10AS032H2F35I1HG - Arria 10 SX SoC, 320K LE, 1152-FBGA | Altera
料号： 10AS032H2F35I1HG ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4200 | $4,200.00 |
| 10 | $3890 | $38,900.00 |
| 50 | $3550 | $177,500.00 |
| 100 | $3200 | $320,000.00 |
| 250 | $2890 | $722,500.00 |
10AS032H2F35I1HG 概述
An SoC FPGA (System-on-Chip Field-Programmable Gate Array) is a heterogeneous compute device that fuses a general-purpose applications processor subsystem with programmable logic on a single die. The Arria 10 SX series specifically targets mid-range applications that benefit from deterministic hardware acceleration in the FPGA fabric while running operating systems such as Linux or real-time operating systems on the ARM cores. Within the broader semiconductor taxonomy, SoC FPGAs occupy a unique position above standalone FPGAs and below Application-Specific Standard Products (ASSPs), offering a balance between flexibility and performance per watt.
Key features include a hard dual-core ARM Cortex-A9 MPCore subsystem with NEON media engine, single- and double-precision floating-point units, CoreSight debug and trace, and a rich set of peripherals (USB, Ethernet, NAND/NOR flash controllers, DDR3/4 memory interfaces with ECC). The programmable logic delivers up to 320K logic elements, approximately 1.6 Mbits of embedded memory (M20K blocks), and 384 user I/Os with support for multiple I/O standards including LVDS and high-speed serial transceivers up to 12.5 Gbps. The integrated hard memory controllers support DDR4 up to 1600 MHz.
Typical applications include industrial machine vision and inspection systems, motor control and industrial drive electronics, software-defined radio baseband processing, broadcast video processing, military and aerospace signal processing, and medical imaging pre-processing. The industrial temperature grade and FCBGA package make it well-suited for harsh-environment deployments. Design considerations include proper power management for the HPS subsystem, careful PCB layout for high-speed transceivers, thermal management for the large FCBGA package, and configuration scheme planning (typically using a QSPI flash or SD card for the HPS bootloader).
This page synthesizes distributor availability, parametric alternatives, and practical design guidance not consolidated in the manufacturer datasheet.
直接替换替代料： 10AS032H2F35I1HG ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10AS032H2F35I1HG （相同外形与封装尺寸） ——差异在于 Package, Mounting Type, Logic Elements, Process Technology, Transceivers.
快速对比工具——选择替代料号进行并排对比：
10AS032H2F35I2SG
✅ 直接替换✓ 有现货
$2050 / 个
查看数据手册 →10AS032H1F35I1HG
✅ 直接替换✓ 有现货
$2265 / 个
查看数据手册 →10AS032H2F35E1HG
✅ 直接替换✓ 有现货
$1293 / 个
查看数据手册 →10AS032H2F35E2SG
✅ 直接替换✓ 有现货
$1325 / 个
查看数据手册 →10AS032H1F35E1HG
✅ 直接替换✓ 有现货
$2540 / 个
查看数据手册 →10AS032H2F35I1HG 最大额定值与电气特性
| Series | Arria 10 SX |
| Architecture | SoC FPGA (FPGA + Dual ARM Cortex-A9 MPCore HPS) |
| Logic Elements | 320K |
| Processor Subsystem | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| Hard Memory Controllers | DDR3/DDR4 with ECC (HPS and FPGA fabric) |
| User I/Os | 384 |
| Transceivers | Up to 24 channels, up to 12.5 Gbps |
| Speed Grade | H2 (mid-performance) |
| 封装 | 1152-FBGA, FC (35 mm x 35 mm) |
| Package Code | F35 |
| Temperature Grade | Industrial (-40C to +100C) |
| 安装类型 | Surface Mount (FCBGA, lead-free) |
| HPS Clock Frequency | Up to 1.5 GHz (per family datasheet) |
| Configuration | QSPI flash, SD card, JTAG (HPS-driven or fabric-driven) |
| RoHS 状态 | Compliant (per distributor product page) |
10AS032H2F35I1HG f35 引脚配置指南
10AS032H2F35I1HG（f35 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10AS032H2F35I1HG.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10AS032H2F35I1HG 适用于 6 应用s: Industrial Motor Control and Drives, Machine Vision and Industrial Inspection, Software-Defined Radio Baseband, Broadcast Video Processing, Medical Imaging Pre-Processing, Military and Aerospace Signal Processing.
Industrial Motor Control and Drives
The 10AS032H2F35I1HG fits industrial motor control because the dual-core ARM Cortex-A9 hard processor system runs real-time protocols (EtherCAT, Profinet, CANopen) while the 320K logic-element FPGA fabric implements deterministic current-loop control, PWM generation, and encoder decoding in hardware. The 12.5 Gbps transceivers support high-bandwidth fieldbus and resolver feedback, and the industrial temperature grade (-40C to +100C) covers factory-floor cabinets. Designers typically offload torque-loop computation to the FPGA fabric to achieve sub-microsecond loop times that a software-only controller cannot match.
推荐
Machine Vision and Industrial Inspection
The 10AS032H2F35I1HG suits high-speed machine vision because the FPGA fabric delivers parallel pixel processing at line rate for Camera Link or CoaXPress interfaces, while the dual-core ARM Cortex-A9 handles host communication (GigE Vision, USB3 Vision) and inspection orchestration. The 320K logic elements support multiple image-processing pipelines simultaneously, and the hardened DDR4 controller with ECC enables reliable handling of large frame buffers. Industrial temperature rating ensures consistent performance in factory inspection cells.
推荐
Software-Defined Radio Baseband
The 10AS032H2F35I1HG is well matched to software-defined radio baseband because the 24 transceiver channels at up to 12.5 Gbps aggregate multi-band RF data into the FPGA, where digital down-conversion, channelization, and demodulation run in fabric. The ARM Cortex-A9 cores then handle higher-layer protocol stack, encryption, and IP packetization. The 320K logic elements and approximately 1.6 Mbits of embedded memory (M20K blocks) are sufficient for LTE small-cell or tactical-radio workloads, while industrial temperature rating supports outdoor deployments.
推荐
Broadcast Video Processing
The 10AS032H2F35I1HG serves broadcast video processing because the FPGA fabric implements multi-channel SD/HD/3G-SDI and emerging 12G-SDI interfaces with on-the-fly scaling, de-interlacing, and overlay. The ARM Cortex-A9 subsystem manages IP-based studio workflows (SMPTE 2022, NDI, SMPTE 2110) and metadata. The 384 user I/Os and 24 high-speed transceivers provide ample connectivity for ingest, processing, and playout channels in a single chip, reducing bill-of-materials cost versus discrete FPGA plus external processor designs.
推荐
Medical Imaging Pre-Processing
The 10AS032H2F35I1HG is a strong fit for medical imaging front-ends (ultrasound beamforming, CT reconstruction preprocessing, endoscopy video processing) because the FPGA fabric executes beamforming or filter-back-projection kernels deterministically and in parallel, while the ARM Cortex-A9 cores manage DICOM networking, user interface, and patient-data encryption. The DDR4 controller with ECC protects image-data integrity, and the industrial temperature grade supports operating-room equipment that must remain within spec during extended procedures.
推荐
Military and Aerospace Signal Processing
The 10AS032H2F35I1HG applies to defense and aerospace signal processing where the FPGA fabric implements high-throughput DSP chains (radar pulse compression, electronic-warfare channelization, satellite-comm modem functions) and the ARM Cortex-A9 subsystem handles mission management and secure communications. The industrial temperature grade supports avionics bays and ground-mobile platforms, while the 1152-ball FCBGA package provides robust board-level reliability. Conduction-cooled chassis designs commonly use this part for its balance of logic density and HPS integration.
推荐
推荐产品汇总
工程参考数据： 10AS032H2F35I1HG ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10AS032H2F35I2SG | 10AS032H1F35I1HG | 10AS032H2F35E1HG | 10AS032H2F35E2SG | 10AS032H1F35E1HG |
|---|---|---|---|---|---|---|
| Package | 1152-FBGA, F35 (35 mm) | 1152-FBGA, F35 (35 mm) - same | 1152-FBGA, F35 (35 mm) - same | 1152-FBGA, F35 (35 mm) - same | 1152-FBGA, F35 (35 mm) - same | 1152-FBGA, F35 (35 mm) - same |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Series | Arria 10 SX | Arria 10 SX | Arria 10 SX | Arria 10 SX | Arria 10 SX | Arria 10 SX |
| Logic Elements | 320K | 320K | 320K | 320K | 320K | 320K |
| Speed Grade | H2 | H2 | H1 (slower) | H2 | H2 | H1 (slower) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| HPS (ARM Cortex-A9) | Dual-core | Dual-core | Dual-core | Dual-core | Dual-core | Dual-core |
| Transceivers | Up to 24 channels, 12.5 Gbps | Up to 24 channels, 12.5 Gbps | Up to 24 channels, 12.5 Gbps | Up to 24 channels, 12.5 Gbps | Up to 24 channels, 12.5 Gbps | Up to 24 channels, 12.5 Gbps |
关键差异点
- Industrial temperature grade with hard ARM Cortex-A9 HPS （对比 10AS032H2F35E1HG)
- Higher speed grade for timing closure margin （对比 10AS032H1F35I1HG)
- Mid-range SoC FPGA with hardened peripherals （对比 Cyclone V SoC (e.g. 5CSEBA6U23I7))
设计说明
Estimated: at typical SoC FPGA utilization (~70% logic, HPS active, transceiver banks active), the 10AS032H2F35I1HG dissipates approximately 15 to 25 W. The 1152-ball FCBGA package requires a thermal management strategy combining an exposed-die heat spreader, thermal interface material, and a heatsink with adequate airflow. Designers should use the Arria 10 thermal model in Quartus Prime PowerPlay to compute junction temperature for their specific activity profile. Industrial deployments must keep Tj below 100C even at 70C ambient.
The 1152-FBGA F35 package uses 1.0 mm ball pitch with flip-chip mounting, requiring a high-layer-count PCB (typically 12 to 16 layers) with stacked microvia (HDI) construction. All transceiver lanes must be length-matched within the tolerances specified in the Arria 10 device handbook, and the DDR4 interface should route on inner layers with reference planes on both sides. Power distribution requires multiple decoupling capacitors placed as close to the balls as via-in-pad geometry allows, with separate rails for HPS, fabric, and transceiver supplies.
Do not confuse the F35 (35 mm) FCBGA with the smaller F29 (29 mm) or F34 (34 mm) FCBGA variants in the Arria 10 SX family - the ball maps are not pin-compatible. Verify the speed grade (H1 vs H2) before final BOM lock, because downgrading to H1 may cause timing closure failures on designs that rely on H2 margins. Also confirm the HPS boot configuration (QSPI vs SD vs NAND) matches the production firmware, as boot-mode straps are sampled on reset and cannot be changed in software.
Arria 10 SX transceiver channels up to 12.5 Gbps require strict impedance control (typically 100 ohm differential with 85 ohm common-mode for some protocols) and continuous reference planes beneath the lanes. AC-coupling capacitors must be placed within the spacing limits defined by the protocol (PCIe, CPRI, 10 GbE) - missing or misplaced AC caps are a common cause of link-training failures. Use the Arria 10 transceiver toolkit in Quartus Prime to pre-emphasize and pre-tune the SerDes settings for your backplane or cable plant.
合规信息
RoHS compliance inferred from Altera/Intel PSG product family statements and distributor listings. AEC-Q100 not applicable for industrial-grade FPGA (different qualification standard). Halogen-free status not explicitly confirmed in available web data - set to unknown.
