10AS032H2F35I1HG - Arria 10 SX SoC, 320K LE, 1152-FBGA | Altera
부품 번호: 10AS032H2F35I1HG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4200 | $4,200.00 |
| 10 | $3890 | $38,900.00 |
| 50 | $3550 | $177,500.00 |
| 100 | $3200 | $320,000.00 |
| 250 | $2890 | $722,500.00 |
10AS032H2F35I1HG 개요
An SoC FPGA (System-on-Chip Field-Programmable Gate Array) is a heterogeneous compute device that fuses a general-purpose applications processor subsystem with programmable logic on a single die. The Arria 10 SX series specifically targets mid-range applications that benefit from deterministic hardware acceleration in the FPGA fabric while running operating systems such as Linux or real-time operating systems on the ARM cores. Within the broader semiconductor taxonomy, SoC FPGAs occupy a unique position above standalone FPGAs and below Application-Specific Standard Products (ASSPs), offering a balance between flexibility and performance per watt.
Key features include a hard dual-core ARM Cortex-A9 MPCore subsystem with NEON media engine, single- and double-precision floating-point units, CoreSight debug and trace, and a rich set of peripherals (USB, Ethernet, NAND/NOR flash controllers, DDR3/4 memory interfaces with ECC). The programmable logic delivers up to 320K logic elements, approximately 1.6 Mbits of embedded memory (M20K blocks), and 384 user I/Os with support for multiple I/O standards including LVDS and high-speed serial transceivers up to 12.5 Gbps. The integrated hard memory controllers support DDR4 up to 1600 MHz.
Typical applications include industrial machine vision and inspection systems, motor control and industrial drive electronics, software-defined radio baseband processing, broadcast video processing, military and aerospace signal processing, and medical imaging pre-processing. The industrial temperature grade and FCBGA package make it well-suited for harsh-environment deployments. Design considerations include proper power management for the HPS subsystem, careful PCB layout for high-speed transceivers, thermal management for the large FCBGA package, and configuration scheme planning (typically using a QSPI flash or SD card for the HPS bootloader).
This page synthesizes distributor availability, parametric alternatives, and practical design guidance not consolidated in the manufacturer datasheet.
드롭인 대체품: 10AS032H2F35I1HG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS032H2F35I1HG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Mounting Type, Logic Elements, Process Technology, Transceivers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AS032H2F35I2SG
✅ 드롭인✓ 재고 있음
$2050 / 개
데이터시트 보기 →10AS032H1F35I1HG
✅ 드롭인✓ 재고 있음
$2265 / 개
데이터시트 보기 →10AS032H2F35E1HG
✅ 드롭인✓ 재고 있음
$1293 / 개
데이터시트 보기 →10AS032H2F35E2SG
✅ 드롭인✓ 재고 있음
$1325 / 개
데이터시트 보기 →10AS032H1F35E1HG
✅ 드롭인✓ 재고 있음
$2540 / 개
데이터시트 보기 →10AS032H2F35I1HG 최대 정격 & 전기적 특성
| Series | Arria 10 SX |
| Architecture | SoC FPGA (FPGA + Dual ARM Cortex-A9 MPCore HPS) |
| Logic Elements | 320K |
| Processor Subsystem | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| Hard Memory Controllers | DDR3/DDR4 with ECC (HPS and FPGA fabric) |
| User I/Os | 384 |
| Transceivers | Up to 24 channels, up to 12.5 Gbps |
| Speed Grade | H2 (mid-performance) |
| 패키지 | 1152-FBGA, FC (35 mm x 35 mm) |
| Package Code | F35 |
| Temperature Grade | Industrial (-40C to +100C) |
| 실장 유형 | Surface Mount (FCBGA, lead-free) |
| HPS Clock Frequency | Up to 1.5 GHz (per family datasheet) |
| Configuration | QSPI flash, SD card, JTAG (HPS-driven or fabric-driven) |
| RoHS 상태 | Compliant (per distributor product page) |
10AS032H2F35I1HG f35 핀 구성 가이드
10AS032H2F35I1HG(f35 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AS032H2F35I1HG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AS032H2F35I1HG 적합 용도: 6 애플리케이션s: Industrial Motor Control and Drives, Machine Vision and Industrial Inspection, Software-Defined Radio Baseband, Broadcast Video Processing, Medical Imaging Pre-Processing, Military and Aerospace Signal Processing.
Industrial Motor Control and Drives
The 10AS032H2F35I1HG fits industrial motor control because the dual-core ARM Cortex-A9 hard processor system runs real-time protocols (EtherCAT, Profinet, CANopen) while the 320K logic-element FPGA fabric implements deterministic current-loop control, PWM generation, and encoder decoding in hardware. The 12.5 Gbps transceivers support high-bandwidth fieldbus and resolver feedback, and the industrial temperature grade (-40C to +100C) covers factory-floor cabinets. Designers typically offload torque-loop computation to the FPGA fabric to achieve sub-microsecond loop times that a software-only controller cannot match.
추천
Machine Vision and Industrial Inspection
The 10AS032H2F35I1HG suits high-speed machine vision because the FPGA fabric delivers parallel pixel processing at line rate for Camera Link or CoaXPress interfaces, while the dual-core ARM Cortex-A9 handles host communication (GigE Vision, USB3 Vision) and inspection orchestration. The 320K logic elements support multiple image-processing pipelines simultaneously, and the hardened DDR4 controller with ECC enables reliable handling of large frame buffers. Industrial temperature rating ensures consistent performance in factory inspection cells.
추천
Software-Defined Radio Baseband
The 10AS032H2F35I1HG is well matched to software-defined radio baseband because the 24 transceiver channels at up to 12.5 Gbps aggregate multi-band RF data into the FPGA, where digital down-conversion, channelization, and demodulation run in fabric. The ARM Cortex-A9 cores then handle higher-layer protocol stack, encryption, and IP packetization. The 320K logic elements and approximately 1.6 Mbits of embedded memory (M20K blocks) are sufficient for LTE small-cell or tactical-radio workloads, while industrial temperature rating supports outdoor deployments.
추천
Broadcast Video Processing
The 10AS032H2F35I1HG serves broadcast video processing because the FPGA fabric implements multi-channel SD/HD/3G-SDI and emerging 12G-SDI interfaces with on-the-fly scaling, de-interlacing, and overlay. The ARM Cortex-A9 subsystem manages IP-based studio workflows (SMPTE 2022, NDI, SMPTE 2110) and metadata. The 384 user I/Os and 24 high-speed transceivers provide ample connectivity for ingest, processing, and playout channels in a single chip, reducing bill-of-materials cost versus discrete FPGA plus external processor designs.
추천
Medical Imaging Pre-Processing
The 10AS032H2F35I1HG is a strong fit for medical imaging front-ends (ultrasound beamforming, CT reconstruction preprocessing, endoscopy video processing) because the FPGA fabric executes beamforming or filter-back-projection kernels deterministically and in parallel, while the ARM Cortex-A9 cores manage DICOM networking, user interface, and patient-data encryption. The DDR4 controller with ECC protects image-data integrity, and the industrial temperature grade supports operating-room equipment that must remain within spec during extended procedures.
추천
Military and Aerospace Signal Processing
The 10AS032H2F35I1HG applies to defense and aerospace signal processing where the FPGA fabric implements high-throughput DSP chains (radar pulse compression, electronic-warfare channelization, satellite-comm modem functions) and the ARM Cortex-A9 subsystem handles mission management and secure communications. The industrial temperature grade supports avionics bays and ground-mobile platforms, while the 1152-ball FCBGA package provides robust board-level reliability. Conduction-cooled chassis designs commonly use this part for its balance of logic density and HPS integration.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS032H2F35I1HG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AS032H2F35I2SG | 10AS032H1F35I1HG | 10AS032H2F35E1HG | 10AS032H2F35E2SG | 10AS032H1F35E1HG |
|---|---|---|---|---|---|---|
| Package | 1152-FBGA, F35 (35 mm) | 1152-FBGA, F35 (35 mm) - same | 1152-FBGA, F35 (35 mm) - same | 1152-FBGA, F35 (35 mm) - same | 1152-FBGA, F35 (35 mm) - same | 1152-FBGA, F35 (35 mm) - same |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Series | Arria 10 SX | Arria 10 SX | Arria 10 SX | Arria 10 SX | Arria 10 SX | Arria 10 SX |
| Logic Elements | 320K | 320K | 320K | 320K | 320K | 320K |
| Speed Grade | H2 | H2 | H1 (slower) | H2 | H2 | H1 (slower) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| HPS (ARM Cortex-A9) | Dual-core | Dual-core | Dual-core | Dual-core | Dual-core | Dual-core |
| Transceivers | Up to 24 channels, 12.5 Gbps | Up to 24 channels, 12.5 Gbps | Up to 24 channels, 12.5 Gbps | Up to 24 channels, 12.5 Gbps | Up to 24 channels, 12.5 Gbps | Up to 24 channels, 12.5 Gbps |
주요 차별점
- Industrial temperature grade with hard ARM Cortex-A9 HPS (vs 10AS032H2F35E1HG)
- Higher speed grade for timing closure margin (vs 10AS032H1F35I1HG)
- Mid-range SoC FPGA with hardened peripherals (vs Cyclone V SoC (e.g. 5CSEBA6U23I7))
설계 노트
Estimated: at typical SoC FPGA utilization (~70% logic, HPS active, transceiver banks active), the 10AS032H2F35I1HG dissipates approximately 15 to 25 W. The 1152-ball FCBGA package requires a thermal management strategy combining an exposed-die heat spreader, thermal interface material, and a heatsink with adequate airflow. Designers should use the Arria 10 thermal model in Quartus Prime PowerPlay to compute junction temperature for their specific activity profile. Industrial deployments must keep Tj below 100C even at 70C ambient.
The 1152-FBGA F35 package uses 1.0 mm ball pitch with flip-chip mounting, requiring a high-layer-count PCB (typically 12 to 16 layers) with stacked microvia (HDI) construction. All transceiver lanes must be length-matched within the tolerances specified in the Arria 10 device handbook, and the DDR4 interface should route on inner layers with reference planes on both sides. Power distribution requires multiple decoupling capacitors placed as close to the balls as via-in-pad geometry allows, with separate rails for HPS, fabric, and transceiver supplies.
Do not confuse the F35 (35 mm) FCBGA with the smaller F29 (29 mm) or F34 (34 mm) FCBGA variants in the Arria 10 SX family - the ball maps are not pin-compatible. Verify the speed grade (H1 vs H2) before final BOM lock, because downgrading to H1 may cause timing closure failures on designs that rely on H2 margins. Also confirm the HPS boot configuration (QSPI vs SD vs NAND) matches the production firmware, as boot-mode straps are sampled on reset and cannot be changed in software.
Arria 10 SX transceiver channels up to 12.5 Gbps require strict impedance control (typically 100 ohm differential with 85 ohm common-mode for some protocols) and continuous reference planes beneath the lanes. AC-coupling capacitors must be placed within the spacing limits defined by the protocol (PCIe, CPRI, 10 GbE) - missing or misplaced AC caps are a common cause of link-training failures. Use the Arria 10 transceiver toolkit in Quartus Prime to pre-emphasize and pre-tune the SerDes settings for your backplane or cable plant.
규정 준수 정보
RoHS compliance inferred from Altera/Intel PSG product family statements and distributor listings. AEC-Q100 not applicable for industrial-grade FPGA (different qualification standard). Halogen-free status not explicitly confirmed in available web data - set to unknown.