10AS032H3F35I2LG - Arria 10 SX SoC FPGA 320K LE | Intel
料号： 10AS032H3F35I2LG ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1780 | $17,800.00 |
| 25 | $1720 | $43,000.00 |
| 50 | $1650 | $82,500.00 |
| 100 | $1590 | $159,000.00 |
10AS032H3F35I2LG 概述
An SoC FPGA (System-on-Chip Field-Programmable Gate Array) is a hybrid device that integrates a processor subsystem (typically ARM Cortex-A cores) with programmable logic on a single die. The Arria 10 SX family belongs to the broader category of programmable logic devices (PLDs), which includes FPGAs, CPLDs, and SoC FPGAs, used in the industrial, automotive, and embedded computing markets. SoC FPGAs offer software programmability for control-plane tasks and hardware reconfigurability for data-plane acceleration, often replacing discrete CPU + FPGA combinations to reduce BOM, board area, and latency.
Key features include 320K logic elements, dual ARM Cortex-A9 MPCore with CoreSight debug, integrated transceivers supporting up to 12.5 Gbps (depending on grade), hardware DSP blocks for high-throughput signal processing, and external memory interfaces supporting DDR3/DDR4. The Arria 10 SX architecture uses TSMC's 20 nm process, which at launch delivered a meaningful density and power advantage over the previous-generation 28 nm Arria V devices. The 1152-pin FCBGA package (35x35 mm) provides the necessary pin count for transceiver channels, memory controllers, and HPS peripheral interfaces.
Typical applications include high-performance industrial imaging, video broadcast equipment, 5G wireless baseband, military/aerospace signal processing, medical imaging, and test and measurement instrumentation. The dual ARM cores plus FPGA fabric make this part well suited to asymmetric multiprocessing tasks where software handles control protocols while hardware handles DSP or packet processing.
When designing with this device, ensure proper power sequencing across the HPS and FPGA rails, and allocate sufficient PCB thermal relief to dissipate the typical 25-40 W power envelope. Designers should also plan for JTAG and ARM debug access during bring-up.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers evaluate this SoC FPGA for their embedded compute platform.
直接替换替代料： 10AS032H3F35I2LG ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10AS032H3F35I2LG （相同外形与封装尺寸） ——差异在于 Package, Logic Elements, Operating Temperature Grade, RoHS Status, Process Technology.
快速对比工具——选择替代料号进行并排对比：
10AS032H3F35I2SG
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$2120 / 个
查看数据手册 →10AS032H3F35E2LG
✅ 直接替换✓ 有现货
$3650 / 个
查看数据手册 →10AS032H3F34I2LG
✅ 直接替换✓ 有现货
$1620.19 / 个
查看数据手册 →10AS032H2F35I2LG
✅ 直接替换✓ 有现货
$1295 / 个
查看数据手册 →10AS032H3F35I2LG 最大额定值与电气特性
| Family | Arria 10 SX |
| Device Variant | 10AS032 |
| Logic Elements | 320,000 |
| Hard Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum CPU Clock | 1.5 GHz |
| 封装 | 1152-FCBGA (35 x 35 mm) |
| Process Technology | 20 nm (TSMC) |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| 安装类型 | Surface Mount |
| Memory Interfaces | DDR3 / DDR4 external memory interfaces |
| DSP Blocks | Yes (variable-precision DSP blocks) |
| Transceivers | Multi-gigabit transceivers (up to 12.5 Gbps per grade) |
| RoHS 状态 | Compliant |
| Lead Free | Yes |
| Configuration Memory | On-chip configuration |
| Hard Memory Controller | Yes (HPS-side) |
10AS032H3F35I2LG 1152-fcbga (35 x 35 mm) 引脚配置指南
10AS032H3F35I2LG（1152-fcbga (35 x 35 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10AS032H3F35I2LG.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10AS032H3F35I2LG 适用于 6 应用s: 5G Wireless Baseband Processing, Industrial Machine Vision, Military and Aerospace Signal Processing, Medical Imaging Systems, Video Broadcast and Pro AV, Test and Measurement Instrumentation.
5G Wireless Baseband Processing
The 10AS032H3F35I2LG's 320K logic elements, hardware DSP blocks, and multi-gigabit transceivers support up to 12.5 Gbps make it well suited for 5G baseband and fronthaul processing. Per the Arria 10 SX datasheet, the integrated DSP blocks accelerate FFT, channel estimation, and LDPC decoding required for 5G NR PHY. The dual ARM Cortex-A9 cores run the MAC layer and radio resource control, while the FPGA fabric accelerates the time-critical PHY pipeline, replacing a discrete CPU + FPGA design with a single SoC. The industrial temperature grade supports outdoor radio unit deployments.
推荐
Industrial Machine Vision
The 10AS032H3F35I2LG delivers the parallel processing bandwidth required for multi-camera industrial inspection systems running at line rates of several gigapixels per second. According to Intel's Arria 10 documentation, the 320K logic elements plus variable-precision DSP blocks enable real-time image preprocessing, defect detection CNN acceleration, and MIPI CSI-2 or GigE Vision aggregation. The dual ARM cores host the Linux-based vision stack and PLC communication, while the FPGA fabric accelerates pixel pipelines. The F35 FCBGA package supports the high transceiver count needed for multi-camera aggregation.
推荐
Military and Aerospace Signal Processing
The Arria 10 SX SoC FPGA's industrial temperature grade and reconfigurable logic make the 10AS032H3F35I2LG a strong fit for defense signal-processing applications including electronic warfare, radar, and secure communications. According to Intel's Arria 10 device handbook, the device supports cryptographic accelerators and Secure Device Manager for anti-tamper. The HPS runs secure boot and RTOS, while the FPGA fabric handles high-bandwidth RF and DSP pipelines. Designers should verify ITAR/export-control status before procurement for defense end-uses.
推荐
Medical Imaging Systems
The 10AS032H3F35I2LG supports medical imaging modalities such as ultrasound, CT, and MRI reconstruction where real-time DSP and deterministic latency are required. Per Intel's Arria 10 datasheet, the 320K logic elements and DSP blocks accelerate beamforming, image reconstruction (filtered back-projection, iterative reconstruction), and Doppler processing. The HPS hosts the user interface and DICOM network stack, while the FPGA fabric delivers deterministic real-time processing. The industrial temperature range supports the operating envelope of imaging carts and OEM rack-mount systems.
推荐
Video Broadcast and Pro AV
The 10AS032H3F35I2LG's transceiver bandwidth and DSP resources make it suitable for 4K/UHD video processing, broadcast encoding/decoding, and professional AV routing. According to the Arria 10 SX datasheet, the integrated transceivers support SDI (SMPTE ST 424/425/2082), 12G-SDI, and 25G Ethernet for IP-based broadcast workflows. The dual ARM cores run the control plane (NMOS IS-04/05, PTP), while the FPGA fabric handles uncompressed video pipelines, color-space conversion, and HDR processing in real time.
推荐
Test and Measurement Instrumentation
The 10AS032H3F35I2LG fits high-end T&M instruments such as oscilloscopes, protocol analyzers, and arbitrary waveform generators where reconfigurability is a product differentiator. Per Intel's Arria 10 documentation, the FPGA fabric implements real-time DSP, triggering, and signal analysis, and the HPS runs the Linux user interface, SCPI command parser, and remote-instrument server (LXI, USBTMC). Customers can field-upgrade instrument functionality through FPGA bitstream updates without returning the unit to the factory, extending product lifetime.
推荐
推荐产品汇总
工程参考数据： 10AS032H3F35I2LG ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10AS032H3F35I2SG | 10AS032H3F35E2LG | 10AS032H2F35I2LG | 10AS032H3F34I2LG | XC7Z045-2FFG676I |
|---|---|---|---|---|---|---|
| Package | 1152-FCBGA (35x35) | 1152-FCBGA (35x35) - same | 1152-FCBGA (35x35) - same | 1152-FCBGA (35x35) - same | 1152-FCBGA (29x29) - smaller F34 | 676-FCBGA - different package |
| Brand | Intel | Intel | Intel | Intel | Intel | AMD (Xilinx) |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 | ~350,000 |
| Hard Processor Subsystem | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Speed Grade | H3 | H3 | H3 | H2 (slower) | H3 | -2 (Xilinx speed grade) |
| Operating Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Solder Ball Finish | Lead-free (LG) | SnPb (SG) | Lead-free (LG) | Lead-free (LG) | Lead-free (LG) | Lead-free |
| Toolchain | Intel Quartus Prime | Intel Quartus Prime | Intel Quartus Prime | Intel Quartus Prime | Intel Quartus Prime | AMD Vivado |
关键差异点
- Lead-free ball finish matches modern reflow profiles while maintaining identical silicon to SnPb variant （对比 10AS032H3F35I2SG)
- Industrial temperature grade vs commercial-only variant （对比 10AS032H3F35E2LG)
- H3 speed grade provides highest Fmax and transceiver bandwidth （对比 10AS032H2F35I2LG)
- Integrated hard processor subsystem eliminates external CPU and PCIe bridge （对比 XC7Z045-2FFG676I)
设计说明
Estimated: the 10AS032H3F35I2LG with 320K LE at typical 70-80% utilization consumes approximately 25-40 W of total power, depending on toggle rate and transceiver activity. Use Intel's Early Power Estimator (EPE) spreadsheet to size core, transceiver, and HPS rails before committing to PCB layout. Intel Enpirion PoL converters (e.g., EN63A0QI for VCC, EN6347QI for VCCPT) provide the required sequencing and telemetry.
The 1152-FCBGA (35x35 mm) package has a typical theta_JA of approximately 4-6 C/W with a properly designed thermal management solution (heat sink + thermal interface material + sufficient airflow). Per the Arria 10 SX thermal design guide, attach a heat spreader directly to the top of the package lid for forced-air and conduction-cooled enclosures. For sealed enclosures, ensure case-to-ambient thermal resistance keeps Tj below 100 C at worst-case load.
Use 1.0 mm or 1.27 mm pitch BGA PCB land patterns as specified in the Arria 10 SX package mechanical drawing. Plan for microvia-in-pad PCB technology on the inner signal rows to fan out the 1152-ball grid; standard through-via fan-out will not fit. Match trace impedance to 50 ohm single-ended or 100 ohm differential for transceiver channels, and follow Intel's reference stackup for DDR3/DDR4 memory interfaces to maintain signal integrity.
Place decoupling capacitors on the bottom side of the PCB directly under the BGA with via-in-pad or near-pad connections, as specified in the Arria 10 SX hardware design guidelines. Group transceiver channels on PCB layers adjacent to the package to minimize via stubs; keep DDR traces matched within the skew tolerances documented in the external memory interface specification. Provide Kelvin-sense connections to the FPGA voltage rails for accurate load-line regulation.
Do not skip the power-up sequencing controller - latch-up is permanent damage on Arria 10 SX devices if the rails are not brought up in the correct order (typically VCC, then VCCPT, then VCCPGM, then VCCIO). Reserve JTAG header access (10-pin or 20-pin) on the PCB for Quartus programmer debugging and ARM DSTREAM for HPS bring-up; attempting to debug an Arria 10 SX design without JTAG access in production is a recurring root cause of failed prototypes.
合规信息
LG suffix in OPN denotes lead-free solder ball finish per Intel's Arria 10 product family nomenclature. RoHS and REACH compliance per Intel FPGA product environmental documentation. AEC-Q100 not applicable - this is an industrial-grade FPGA SoC, not an automotive-qualified IC.
