10AS032H3F35I2LG - Arria 10 SX SoC FPGA 320K LE | Intel
Артикул: 10AS032H3F35I2LG ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1780 | $17.800,00 |
| 25 | $1720 | $43.000,00 |
| 50 | $1650 | $82.500,00 |
| 100 | $1590 | $159.000,00 |
10AS032H3F35I2LG Обзор
An SoC FPGA (System-on-Chip Field-Programmable Gate Array) is a hybrid device that integrates a processor subsystem (typically ARM Cortex-A cores) with programmable logic on a single die. The Arria 10 SX family belongs to the broader category of programmable logic devices (PLDs), which includes FPGAs, CPLDs, and SoC FPGAs, used in the industrial, automotive, and embedded computing markets. SoC FPGAs offer software programmability for control-plane tasks and hardware reconfigurability for data-plane acceleration, often replacing discrete CPU + FPGA combinations to reduce BOM, board area, and latency.
Key features include 320K logic elements, dual ARM Cortex-A9 MPCore with CoreSight debug, integrated transceivers supporting up to 12.5 Gbps (depending on grade), hardware DSP blocks for high-throughput signal processing, and external memory interfaces supporting DDR3/DDR4. The Arria 10 SX architecture uses TSMC's 20 nm process, which at launch delivered a meaningful density and power advantage over the previous-generation 28 nm Arria V devices. The 1152-pin FCBGA package (35x35 mm) provides the necessary pin count for transceiver channels, memory controllers, and HPS peripheral interfaces.
Typical applications include high-performance industrial imaging, video broadcast equipment, 5G wireless baseband, military/aerospace signal processing, medical imaging, and test and measurement instrumentation. The dual ARM cores plus FPGA fabric make this part well suited to asymmetric multiprocessing tasks where software handles control protocols while hardware handles DSP or packet processing.
When designing with this device, ensure proper power sequencing across the HPS and FPGA rails, and allocate sufficient PCB thermal relief to dissipate the typical 25-40 W power envelope. Designers should also plan for JTAG and ARM debug access during bring-up.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers evaluate this SoC FPGA for their embedded compute platform.
Аналоги без доработки для 10AS032H3F35I2LG — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с 10AS032H3F35I2LG (тот же форм-фактор и посадочное место) — отличается по Package, Logic Elements, Operating Temperature Grade, RoHS Status, Process Technology.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
10AS032H3F35I2SG
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$2120 / шт.
Открыть даташит →10AS032H3F35E2LG
✅ Прямая замена✓ В наличии
$3650 / шт.
Открыть даташит →10AS032H3F34I2LG
✅ Прямая замена✓ В наличии
$1620.19 / шт.
Открыть даташит →10AS032H2F35I2LG
✅ Прямая замена✓ В наличии
$1295 / шт.
Открыть даташит →10AS032H3F35I2LG Максимальные параметры и электрические характеристики
| Family | Arria 10 SX |
| Device Variant | 10AS032 |
| Logic Elements | 320,000 |
| Hard Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum CPU Clock | 1.5 GHz |
| Корпус | 1152-FCBGA (35 x 35 mm) |
| Process Technology | 20 nm (TSMC) |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Тип монтажа | Surface Mount |
| Memory Interfaces | DDR3 / DDR4 external memory interfaces |
| DSP Blocks | Yes (variable-precision DSP blocks) |
| Transceivers | Multi-gigabit transceivers (up to 12.5 Gbps per grade) |
| Статус RoHS | Compliant |
| Lead Free | Yes |
| Configuration Memory | On-chip configuration |
| Hard Memory Controller | Yes (HPS-side) |
Руководство по цоколевке 10AS032H3F35I2LG в корпусе 1152-fcbga (35 x 35 mm)
Цоколевка для 10AS032H3F35I2LG (корпус 1152-fcbga (35 x 35 mm)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для 10AS032H3F35I2LG.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
10AS032H3F35I2LG подходит для 6 применениеs: 5G Wireless Baseband Processing, Industrial Machine Vision, Military and Aerospace Signal Processing, Medical Imaging Systems, Video Broadcast and Pro AV, Test and Measurement Instrumentation.
5G Wireless Baseband Processing
The 10AS032H3F35I2LG's 320K logic elements, hardware DSP blocks, and multi-gigabit transceivers support up to 12.5 Gbps make it well suited for 5G baseband and fronthaul processing. Per the Arria 10 SX datasheet, the integrated DSP blocks accelerate FFT, channel estimation, and LDPC decoding required for 5G NR PHY. The dual ARM Cortex-A9 cores run the MAC layer and radio resource control, while the FPGA fabric accelerates the time-critical PHY pipeline, replacing a discrete CPU + FPGA design with a single SoC. The industrial temperature grade supports outdoor radio unit deployments.
Рекомендуется
Industrial Machine Vision
The 10AS032H3F35I2LG delivers the parallel processing bandwidth required for multi-camera industrial inspection systems running at line rates of several gigapixels per second. According to Intel's Arria 10 documentation, the 320K logic elements plus variable-precision DSP blocks enable real-time image preprocessing, defect detection CNN acceleration, and MIPI CSI-2 or GigE Vision aggregation. The dual ARM cores host the Linux-based vision stack and PLC communication, while the FPGA fabric accelerates pixel pipelines. The F35 FCBGA package supports the high transceiver count needed for multi-camera aggregation.
Рекомендуется
Military and Aerospace Signal Processing
The Arria 10 SX SoC FPGA's industrial temperature grade and reconfigurable logic make the 10AS032H3F35I2LG a strong fit for defense signal-processing applications including electronic warfare, radar, and secure communications. According to Intel's Arria 10 device handbook, the device supports cryptographic accelerators and Secure Device Manager for anti-tamper. The HPS runs secure boot and RTOS, while the FPGA fabric handles high-bandwidth RF and DSP pipelines. Designers should verify ITAR/export-control status before procurement for defense end-uses.
Рекомендуется
Medical Imaging Systems
The 10AS032H3F35I2LG supports medical imaging modalities such as ultrasound, CT, and MRI reconstruction where real-time DSP and deterministic latency are required. Per Intel's Arria 10 datasheet, the 320K logic elements and DSP blocks accelerate beamforming, image reconstruction (filtered back-projection, iterative reconstruction), and Doppler processing. The HPS hosts the user interface and DICOM network stack, while the FPGA fabric delivers deterministic real-time processing. The industrial temperature range supports the operating envelope of imaging carts and OEM rack-mount systems.
Рекомендуется
Video Broadcast and Pro AV
The 10AS032H3F35I2LG's transceiver bandwidth and DSP resources make it suitable for 4K/UHD video processing, broadcast encoding/decoding, and professional AV routing. According to the Arria 10 SX datasheet, the integrated transceivers support SDI (SMPTE ST 424/425/2082), 12G-SDI, and 25G Ethernet for IP-based broadcast workflows. The dual ARM cores run the control plane (NMOS IS-04/05, PTP), while the FPGA fabric handles uncompressed video pipelines, color-space conversion, and HDR processing in real time.
Рекомендуется
Test and Measurement Instrumentation
The 10AS032H3F35I2LG fits high-end T&M instruments such as oscilloscopes, protocol analyzers, and arbitrary waveform generators where reconfigurability is a product differentiator. Per Intel's Arria 10 documentation, the FPGA fabric implements real-time DSP, triggering, and signal analysis, and the HPS runs the Linux user interface, SCPI command parser, and remote-instrument server (LXI, USBTMC). Customers can field-upgrade instrument functionality through FPGA bitstream updates without returning the unit to the factory, extending product lifetime.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для 10AS032H3F35I2LG — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | 10AS032H3F35I2SG | 10AS032H3F35E2LG | 10AS032H2F35I2LG | 10AS032H3F34I2LG | XC7Z045-2FFG676I |
|---|---|---|---|---|---|---|
| Package | 1152-FCBGA (35x35) | 1152-FCBGA (35x35) - same | 1152-FCBGA (35x35) - same | 1152-FCBGA (35x35) - same | 1152-FCBGA (29x29) - smaller F34 | 676-FCBGA - different package |
| Brand | Intel | Intel | Intel | Intel | Intel | AMD (Xilinx) |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 | ~350,000 |
| Hard Processor Subsystem | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Speed Grade | H3 | H3 | H3 | H2 (slower) | H3 | -2 (Xilinx speed grade) |
| Operating Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Solder Ball Finish | Lead-free (LG) | SnPb (SG) | Lead-free (LG) | Lead-free (LG) | Lead-free (LG) | Lead-free |
| Toolchain | Intel Quartus Prime | Intel Quartus Prime | Intel Quartus Prime | Intel Quartus Prime | Intel Quartus Prime | AMD Vivado |
Ключевые отличия
- Lead-free ball finish matches modern reflow profiles while maintaining identical silicon to SnPb variant (против 10AS032H3F35I2SG)
- Industrial temperature grade vs commercial-only variant (против 10AS032H3F35E2LG)
- H3 speed grade provides highest Fmax and transceiver bandwidth (против 10AS032H2F35I2LG)
- Integrated hard processor subsystem eliminates external CPU and PCIe bridge (против XC7Z045-2FFG676I)
Заметки по проектированию
Estimated: the 10AS032H3F35I2LG with 320K LE at typical 70-80% utilization consumes approximately 25-40 W of total power, depending on toggle rate and transceiver activity. Use Intel's Early Power Estimator (EPE) spreadsheet to size core, transceiver, and HPS rails before committing to PCB layout. Intel Enpirion PoL converters (e.g., EN63A0QI for VCC, EN6347QI for VCCPT) provide the required sequencing and telemetry.
The 1152-FCBGA (35x35 mm) package has a typical theta_JA of approximately 4-6 C/W with a properly designed thermal management solution (heat sink + thermal interface material + sufficient airflow). Per the Arria 10 SX thermal design guide, attach a heat spreader directly to the top of the package lid for forced-air and conduction-cooled enclosures. For sealed enclosures, ensure case-to-ambient thermal resistance keeps Tj below 100 C at worst-case load.
Use 1.0 mm or 1.27 mm pitch BGA PCB land patterns as specified in the Arria 10 SX package mechanical drawing. Plan for microvia-in-pad PCB technology on the inner signal rows to fan out the 1152-ball grid; standard through-via fan-out will not fit. Match trace impedance to 50 ohm single-ended or 100 ohm differential for transceiver channels, and follow Intel's reference stackup for DDR3/DDR4 memory interfaces to maintain signal integrity.
Place decoupling capacitors on the bottom side of the PCB directly under the BGA with via-in-pad or near-pad connections, as specified in the Arria 10 SX hardware design guidelines. Group transceiver channels on PCB layers adjacent to the package to minimize via stubs; keep DDR traces matched within the skew tolerances documented in the external memory interface specification. Provide Kelvin-sense connections to the FPGA voltage rails for accurate load-line regulation.
Do not skip the power-up sequencing controller - latch-up is permanent damage on Arria 10 SX devices if the rails are not brought up in the correct order (typically VCC, then VCCPT, then VCCPGM, then VCCIO). Reserve JTAG header access (10-pin or 20-pin) on the PCB for Quartus programmer debugging and ARM DSTREAM for HPS bring-up; attempting to debug an Arria 10 SX design without JTAG access in production is a recurring root cause of failed prototypes.
Информация о соответствии
LG suffix in OPN denotes lead-free solder ball finish per Intel's Arria 10 product family nomenclature. RoHS and REACH compliance per Intel FPGA product environmental documentation. AEC-Q100 not applicable - this is an industrial-grade FPGA SoC, not an automotive-qualified IC.
