10AS032H3F35I2LG - Arria 10 SX SoC FPGA 320K LE | Intel
MPN: 10AS032H3F35I2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1780 | $17,800.00 |
| 25 | $1720 | $43,000.00 |
| 50 | $1650 | $82,500.00 |
| 100 | $1590 | $159,000.00 |
Drop-in alternatives for 10AS032H3F35I2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS032H3F35I2SG
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View Datasheet →10AS032H3F34I2LG
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View Datasheet →10AS032H3F35I2LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX |
| Device Variant | 10AS032 |
| Logic Elements | 320,000 |
| Hard Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum CPU Clock | 1.5 GHz |
| Package | 1152-FCBGA (35 x 35 mm) |
| Process Technology | 20 nm (TSMC) |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Mounting Type | Surface Mount |
| Memory Interfaces | DDR3 / DDR4 external memory interfaces |
| DSP Blocks | Yes (variable-precision DSP blocks) |
| Transceivers | Multi-gigabit transceivers (up to 12.5 Gbps per grade) |
| RoHS Status | Compliant |
| Lead Free | Yes |
| Configuration Memory | On-chip configuration |
| Hard Memory Controller | Yes (HPS-side) |
10AS032H3F35I2LG 1152-fcbga (35 x 35 mm) Pin Configuration Guide
Complete pinout information for 10AS032H3F35I2LG (1152-fcbga (35 x 35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS032H3F35I2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS032H3F35I2LG is suitable for 6 applications: 5G Wireless Baseband Processing, Industrial Machine Vision, Military and Aerospace Signal Processing, Medical Imaging Systems, Video Broadcast and Pro AV, Test and Measurement Instrumentation.
5G Wireless Baseband Processing
The 10AS032H3F35I2LG's 320K logic elements, hardware DSP blocks, and multi-gigabit transceivers support up to 12.5 Gbps make it well suited for 5G baseband and fronthaul processing. Per the Arria 10 SX datasheet, the integrated DSP blocks accelerate FFT, channel estimation, and LDPC decoding required for 5G NR PHY. The dual ARM Cortex-A9 cores run the MAC layer and radio resource control, while the FPGA fabric accelerates the time-critical PHY pipeline, replacing a discrete CPU + FPGA design with a single SoC. The industrial temperature grade supports outdoor radio unit deployments.
Recommended
Industrial Machine Vision
The 10AS032H3F35I2LG delivers the parallel processing bandwidth required for multi-camera industrial inspection systems running at line rates of several gigapixels per second. According to Intel's Arria 10 documentation, the 320K logic elements plus variable-precision DSP blocks enable real-time image preprocessing, defect detection CNN acceleration, and MIPI CSI-2 or GigE Vision aggregation. The dual ARM cores host the Linux-based vision stack and PLC communication, while the FPGA fabric accelerates pixel pipelines. The F35 FCBGA package supports the high transceiver count needed for multi-camera aggregation.
Recommended
Military and Aerospace Signal Processing
The Arria 10 SX SoC FPGA's industrial temperature grade and reconfigurable logic make the 10AS032H3F35I2LG a strong fit for defense signal-processing applications including electronic warfare, radar, and secure communications. According to Intel's Arria 10 device handbook, the device supports cryptographic accelerators and Secure Device Manager for anti-tamper. The HPS runs secure boot and RTOS, while the FPGA fabric handles high-bandwidth RF and DSP pipelines. Designers should verify ITAR/export-control status before procurement for defense end-uses.
Recommended
Medical Imaging Systems
The 10AS032H3F35I2LG supports medical imaging modalities such as ultrasound, CT, and MRI reconstruction where real-time DSP and deterministic latency are required. Per Intel's Arria 10 datasheet, the 320K logic elements and DSP blocks accelerate beamforming, image reconstruction (filtered back-projection, iterative reconstruction), and Doppler processing. The HPS hosts the user interface and DICOM network stack, while the FPGA fabric delivers deterministic real-time processing. The industrial temperature range supports the operating envelope of imaging carts and OEM rack-mount systems.
Recommended
Video Broadcast and Pro AV
The 10AS032H3F35I2LG's transceiver bandwidth and DSP resources make it suitable for 4K/UHD video processing, broadcast encoding/decoding, and professional AV routing. According to the Arria 10 SX datasheet, the integrated transceivers support SDI (SMPTE ST 424/425/2082), 12G-SDI, and 25G Ethernet for IP-based broadcast workflows. The dual ARM cores run the control plane (NMOS IS-04/05, PTP), while the FPGA fabric handles uncompressed video pipelines, color-space conversion, and HDR processing in real time.
Recommended
Test and Measurement Instrumentation
The 10AS032H3F35I2LG fits high-end T&M instruments such as oscilloscopes, protocol analyzers, and arbitrary waveform generators where reconfigurability is a product differentiator. Per Intel's Arria 10 documentation, the FPGA fabric implements real-time DSP, triggering, and signal analysis, and the HPS runs the Linux user interface, SCPI command parser, and remote-instrument server (LXI, USBTMC). Customers can field-upgrade instrument functionality through FPGA bitstream updates without returning the unit to the factory, extending product lifetime.
Recommended
Recommended Products Summary
Engineering reference data for 10AS032H3F35I2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS032H3F35I2SG | 10AS032H3F35E2LG | 10AS032H2F35I2LG | 10AS032H3F34I2LG | XC7Z045-2FFG676I |
|---|---|---|---|---|---|---|
| Package | 1152-FCBGA (35x35) | 1152-FCBGA (35x35) - same | 1152-FCBGA (35x35) - same | 1152-FCBGA (35x35) - same | 1152-FCBGA (29x29) - smaller F34 | 676-FCBGA - different package |
| Brand | Intel | Intel | Intel | Intel | Intel | AMD (Xilinx) |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 | ~350,000 |
| Hard Processor Subsystem | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Speed Grade | H3 | H3 | H3 | H2 (slower) | H3 | -2 (Xilinx speed grade) |
| Operating Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Solder Ball Finish | Lead-free (LG) | SnPb (SG) | Lead-free (LG) | Lead-free (LG) | Lead-free (LG) | Lead-free |
| Toolchain | Intel Quartus Prime | Intel Quartus Prime | Intel Quartus Prime | Intel Quartus Prime | Intel Quartus Prime | AMD Vivado |
Key Differentiators
- Lead-free ball finish matches modern reflow profiles while maintaining identical silicon to SnPb variant (vs 10AS032H3F35I2SG)
- Industrial temperature grade vs commercial-only variant (vs 10AS032H3F35E2LG)
- H3 speed grade provides highest Fmax and transceiver bandwidth (vs 10AS032H2F35I2LG)
- Integrated hard processor subsystem eliminates external CPU and PCIe bridge (vs XC7Z045-2FFG676I)
Design Notes
Estimated: the 10AS032H3F35I2LG with 320K LE at typical 70-80% utilization consumes approximately 25-40 W of total power, depending on toggle rate and transceiver activity. Use Intel's Early Power Estimator (EPE) spreadsheet to size core, transceiver, and HPS rails before committing to PCB layout. Intel Enpirion PoL converters (e.g., EN63A0QI for VCC, EN6347QI for VCCPT) provide the required sequencing and telemetry.
The 1152-FCBGA (35x35 mm) package has a typical theta_JA of approximately 4-6 C/W with a properly designed thermal management solution (heat sink + thermal interface material + sufficient airflow). Per the Arria 10 SX thermal design guide, attach a heat spreader directly to the top of the package lid for forced-air and conduction-cooled enclosures. For sealed enclosures, ensure case-to-ambient thermal resistance keeps Tj below 100 C at worst-case load.
Use 1.0 mm or 1.27 mm pitch BGA PCB land patterns as specified in the Arria 10 SX package mechanical drawing. Plan for microvia-in-pad PCB technology on the inner signal rows to fan out the 1152-ball grid; standard through-via fan-out will not fit. Match trace impedance to 50 ohm single-ended or 100 ohm differential for transceiver channels, and follow Intel's reference stackup for DDR3/DDR4 memory interfaces to maintain signal integrity.
Place decoupling capacitors on the bottom side of the PCB directly under the BGA with via-in-pad or near-pad connections, as specified in the Arria 10 SX hardware design guidelines. Group transceiver channels on PCB layers adjacent to the package to minimize via stubs; keep DDR traces matched within the skew tolerances documented in the external memory interface specification. Provide Kelvin-sense connections to the FPGA voltage rails for accurate load-line regulation.
Do not skip the power-up sequencing controller - latch-up is permanent damage on Arria 10 SX devices if the rails are not brought up in the correct order (typically VCC, then VCCPT, then VCCPGM, then VCCIO). Reserve JTAG header access (10-pin or 20-pin) on the PCB for Quartus programmer debugging and ARM DSTREAM for HPS bring-up; attempting to debug an Arria 10 SX design without JTAG access in production is a recurring root cause of failed prototypes.
Compliance Information
LG suffix in OPN denotes lead-free solder ball finish per Intel's Arria 10 product family nomenclature. RoHS and REACH compliance per Intel FPGA product environmental documentation. AEC-Q100 not applicable - this is an industrial-grade FPGA SoC, not an automotive-qualified IC.
