10AS032H3F35E2LG - Arria 10 SX 320K SoC FPGA | Altera | 1152-FBGA
MPN: 10AS032H3F35E2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $4100 | $41,000.00 |
| 100 | $3950 | $395,000.00 |
| 500 | $3800 | $1,900,000.00 |
| 1,000 | $3650 | $3,650,000.00 |
Drop-in alternatives for 10AS032H3F35E2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS032H3F35E2SG
✅ Drop-In✓ In Stock
$2450 / Unit
View Datasheet →10AS032H3F35I2LG
✅ Drop-In✓ In Stock
$1590 / Unit
View Datasheet →10AS032H3F35E1HG
✅ Drop-In📋 Reference alternative (not in catalog)
10AS032H2F35E2LG
✅ Drop-In✓ In Stock
$2310 / Unit
View Datasheet →10AS032H1F35E1HG
✅ Drop-In✓ In Stock
$2540 / Unit
View Datasheet →10AS032H3F35E2LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX |
| Series | 10AS032 |
| Logic Elements | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Fabric Performance | Up to 1.5 GHz |
| Package | 1152-FBGA, FC (35x35 mm) |
| Package Code | F35 |
| Mounting Type | Surface Mount (Flip-Chip BGA) |
| Operating Temperature | 0C to +100C (E2 industrial grade) |
| Memory Controllers | Hardened DDR3/DDR4/LPDDR2/LPDDR3 controllers |
| Process Technology | 20 nm |
| RoHS Status | Compliant |
| Packaging | Tray (LG suffix) |
10AS032H3F35E2LG f35 Pin Configuration Guide
Complete pinout information for 10AS032H3F35E2LG (f35 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS032H3F35E2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS032H3F35E2LG is suitable for 6 applications: Software-Defined Radio (SDR) Baseband, Broadcast Video Encoder/Decoder, Radar and SIGINT Preprocessing, High-End Industrial Machine Vision, 5G Wireless Baseband Unit, Medical Imaging Accelerator.
Software-Defined Radio (SDR) Baseband
The 10AS032H3F35E2LG's 320K Arria 10 SX logic elements and up to 1.5 GHz fabric performance suit SDR baseband processing where wideband waveforms require parallel DSP pipelines. The dual-core ARM Cortex-A9 HPS runs the radio control plane, MAC layer, and network protocols while the FPGA fabric accelerates FFT, channelization, and demodulation. Hardened memory controllers sustain multi-GSPS sample streams to external DDR4, and integrated transceivers interface directly to RF ADCs/DACs. The SoC partitioning eliminates the latency of an external host CPU-to-FPGA link.
Recommended
Broadcast Video Encoder/Decoder
Broadcast encoder/decoder platforms benefit from the 10AS032H3F35E2LG's H.265/HEVC and JPEG2000 codec acceleration in the FPGA fabric plus Linux-managed transport stream multiplexing on the ARM Cortex-A9 HPS. The 320K logic elements implement multi-channel 4K60p processing, and the hard memory controllers feed motion estimation/compensation engines with low-latency DDR4 access. Industrial temperature grade (E2, 0C to +100C) suits broadcast equipment racks, and the F35 1152-FBGA exposes sufficient transceivers for SDI, HDMI, and 10GbE I/O.
Recommended
Radar and SIGINT Preprocessing
In radar and SIGINT preprocessing, the 10AS032H3F35E2LG delivers the deterministic latency needed for pulse compression, moving target indication, and digital beamforming. The dual-core ARM HPS handles tracker and classification algorithms while the FPGA fabric performs real-time DSP at multi-GSPS rates. The 1152-ball F35 package exposes the high-pin-count transceivers and LVDS pairs required for direct ADC/DAC interconnect, and the E2 industrial temperature grade supports ground-mobile and shipboard installations.
Recommended
High-End Industrial Machine Vision
Multi-camera machine vision systems leverage the 10AS032H3F35E2LG's parallel image-processing pipelines and ARM Cortex-A9 HPS running vision frameworks such as OpenCV or vendor SDKs. The 320K logic elements implement real-time defect detection, optical flow, and barcode reading at line-rate, while the HPS manages GigE Vision, USB3 Vision, and CoaXPress protocol stacks. The E2 industrial temperature grade and 35x35 mm F35 package fit standard factory-floor controller enclosures with adequate heatsinking.
Recommended
5G Wireless Baseband Unit
5G small-cell and distributed-unit baseband cards pair the 10AS032H3F35E2LG's FPGA fabric for PHY-layer LDPC/Polar encoding and beamforming weight calculation with the ARM HPS running the 5G stack and OAM software. The hardened CPRI/eCPRI fronthaul transceivers operate at up to 12.5 Gbps per lane, and the hard memory controllers sustain 5G numerology sub-millisecond scheduling. Industrial temperature and the 1152-ball F35 footprint suit outdoor-pole-mount and central-office equipment.
Recommended
Medical Imaging Accelerator
CT, MRI, and ultrasound imaging systems use the 10AS032H3F35E2LG's FPGA fabric for back-projection, beamforming, and real-time filtering while the ARM Cortex-A9 HPS runs the user interface, DICOM stack, and patient database. The 320K logic elements and DDR4 controller bandwidth sustain multi-slice CT reconstruction at diagnostic frame rates. Although not AEC-Q100 qualified, the E2 industrial temperature grade and deterministic latency meet medical imaging OEM reliability targets when paired with appropriate qualification pathways.
Recommended
Recommended Products Summary
Engineering reference data for 10AS032H3F35E2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS032H3F35E2SG | 10AS032H3F35I2LG | 10AS032H3F35E1HG | 10AS032H2F35E2LG | 10AS032H1F35E1HG |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1152-FBGA, FC (35x35 mm) | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 160,000 | Lower density (H1) |
| Hard Processor System | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Speed/Temperature Grade | E2 (industrial 0C to +100C) | E2 (industrial) | I2 (extended -40C to +100C) | E1 (-1 speed grade) | E2 (industrial) | E1 (-1 speed grade) |
| Fabric Performance | Up to 1.5 GHz | Up to 1.5 GHz | Up to 1.5 GHz | Up to 1.35 GHz (E1 derate) | Up to 1.5 GHz | Up to 1.35 GHz (E1 derate) |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Hardened Memory Controllers | DDR3/DDR4/LPDDR2/LPDDR3 | DDR3/DDR4/LPDDR2/LPDDR3 | DDR3/DDR4/LPDDR2/LPDDR3 | DDR3/DDR4/LPDDR2/LPDDR3 | DDR3/DDR4/LPDDR2/LPDDR3 | DDR3/DDR4/LPDDR2/LPDDR3 |
Key Differentiators
- Dual-core ARM Cortex-A9 HPS integrated on-die (vs 10AS066H3F35E2LG)
- 320K logic elements at 1.5 GHz fabric performance (vs 10AS032H2F35E2LG)
- Hardened DDR4 memory controller with ECC (vs 10AS032H3F35E1HG)
Design Notes
Estimated: at 100% FPGA utilization and 1.5 GHz fabric operation, the 10AS032H3F35E2LG can dissipate 20-25 W depending on toggle rate. The 1152-ball 35x35 mm Flip-Chip BGA exposes the die through the package substrate; a heatsink with thermal interface material and at least 150 LFM airflow is mandatory for reliable operation. Without active cooling, junction temperature can exceed 100C within seconds under heavy HPS + fabric load. Consult the Arria 10 thermal management user guide for the recommended heatsink supplier list.
The 1152-ball F35 BGA requires a high-density PCB stack-up with at least 8 layers, microvias, and 0.4 mm ball pitch escape routing. Use the Intel/Altera F35 package pin-out file to generate the PCB footprint and follow the reference design's via-in-pad recommendations for transceiver and DDR4 signal integrity. Length-matching within 25 mils is required for DDR4 byte lanes and within 50 mils for transceiver differential pairs. Do not route signals beneath the BGA shadow; provide a continuous reference plane on each layer.
The Arria 10 SX device requires multiple sequenced power rails (core VCC, VCCPT, VCCBAT, VCCA_PLL, VCC_HPS, transceiver rails) with strict monotonic ramp and sequence constraints documented in the Arria 10 power management user guide. Use the Intel-recommended power controller (e.g., LTC2977 or TI TPS53681) with the pre-programmed Arria 10 recipe; deviation can cause permanent device damage. Decouple each rail with 0.1 uF + 10 uF + 47 uF capacitors placed within 5 mm of the BGA balls.
Do not power the HPS subsystem before the FPGA fabric is configured; this can leave the HPS in an undefined state and corrupt the boot ROM. Always generate the preloader with the Quartus SoC EDS bsp-editor matching the exact silicon revision and HPS pin mux. Failure to update the device tree when changing HPS peripheral assignments results in Linux kernel panics. For JTAG programming, ensure the TCK frequency does not exceed 25 MHz during initial configuration to avoid BSDL boundary-scan failures.
Compliance Information
RoHS compliance per DigiKey product listing. AEC-Q100 not applicable for industrial SoC FPGA; for automotive applications consult Intel's automotive-grade Cyclone or Arria V counterparts. Lead-free reflow profile per JEDEC J-STD-020.
