10AS048E3F29E2LG - Arria 10 SX SoC FPGA 480K LE | Intel
料号： 10AS048E3F29E2LG ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $8500 | $8,500.00 |
| 10 | $8200 | $82,000.00 |
| 100 | $7800 | $780,000.00 |
| 500 | $7400 | $3,700,000.00 |
| 1,000 | $7100 | $7,100,000.00 |
10AS048E3F29E2LG 概述
An SoC FPGA combines a hardened application processor subsystem with programmable FPGA fabric on a single die, enabling hardware-accelerated control planes and DSP pipelines. Arria 10 SX sits in Intel's mid- to high-end SoC FPGA portfolio above Cyclone V/Cyclone 10 and below Stratix 10 SX, offering a balance of logic density, transceiver bandwidth, and ARM Cortex-A9 performance for applications such as motor control, industrial imaging, and software-defined radio. Compared with a discrete host processor plus separate FPGA, an SoC FPGA reduces board area, latency, and BOM while keeping the FPGA fabric fully user-programmable.
Key features include 480K logic elements, dual-core ARM Cortex-A9 with NEON and CoreSight trace, hard memory controllers (DDR3/DDR4/LPDDR2/3), multi-gigabit transceivers, and a hardened floating-point DSP block set. The 780-pin FC-FBGA package provides ample I/O for high-bandwidth parallel interfaces and supports industrial temperature grades. The medical-grade screening extends operating envelope validation beyond commercial-grade parts.
Architecturally, the SoC subsystem is implemented in dedicated ASIC-style logic with coherently connected caches, while the FPGA fabric provides customizable I/O, DSP, and memory interfaces through a high-bandwidth on-chip interconnect. This heterogeneity lets the ARM cores run Linux or RTOS control software while the FPGA fabric accelerates compute-intensive kernels such as FFT, FIR, or machine-learning inference at line rate.
Typical applications include industrial motor control, medical imaging pre-processing, software-defined radio baseband, machine vision, and high-speed data acquisition. The 0.9 V core voltage and 20 nm process enable low static power for thermally constrained embedded systems while sustaining multi-hundred-MHz fabric performance.
When designing with this device, ensure the 780-ball FC-FBGA footprint is accommodated on a high-layer-count PCB with proper BGA escape routing, matched-length DDR traces for the HPS memory controller, and a thermal solution rated for the device's worst-case power envelope. Reference Intel's Arria 10 SX device datasheet and SoC FPGA hardware design guidelines before finalizing the schematic.
This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the Arria 10 SX family, and practical design considerations not consolidated in the manufacturer datasheet.
直接替换替代料： 10AS048E3F29E2LG ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10AS048E3F29E2LG （相同外形与封装尺寸） ——差异在于 Package, RoHS Status, Speed Grade, Logic Elements, Mounting Type.
快速对比工具——选择替代料号进行并排对比：
10AS048E2F29E2LG
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1995 / 个
查看数据手册 →10AS048E3F29I2LG
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1320 / 个
查看数据手册 →10AS048E2F29I2LG
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$2295 / 个
查看数据手册 →10AS066E3F29E2LG
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
10AS032E4F29E3LG
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$2295 / 个
查看数据手册 →10AS048E2F29I2SG
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1980 / 个
查看数据手册 →10AS048E3F29E2LG 最大额定值与电气特性
| Family | Arria 10 SX |
| Device Variant | 10AS048 |
| Architecture | System-on-Chip (SoC) FPGA |
| Logic Elements | 480,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Clock Speed | Up to 1.5 GHz |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Operating Grade | Medical |
| 封装 | 780-ball FC-FBGA (29x29 mm, F29) |
| 安装类型 | Surface Mount (BGA) |
| RoHS 状态 | Compliant |
| Lead-Free | Yes |
| Recommended Operating Temperature | -40C to +100C (medical grade, per Arria 10 datasheet) |
| Product Type | SoC (per DigiKey categorization) |
10AS048E3F29E2LG 780-ball fc-fbga (29x29 mm, f29) 引脚配置指南
10AS048E3F29E2LG（780-ball fc-fbga (29x29 mm, f29) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10AS048E3F29E2LG.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10AS048E3F29E2LG 适用于 6 应用s: Industrial Motor Control, Medical Imaging Pre-Processing, Software-Defined Radio Baseband, Machine Vision Inspection, High-Speed Data Acquisition, Industrial IoT Gateway.
Industrial Motor Control
The 10AS048E3F29E2LG is well suited to multi-axis industrial motor control where the dual ARM Cortex-A9 hard processor system runs a real-time control loop and Linux HMI in parallel while the 480K-logic-element FPGA fabric executes field-oriented control (FOC) and encoder feedback decoding at microsecond latency. Its 1.5 GHz HPS can handle EtherCAT, EtherNet/IP, or PROFINET stack processing, while hard floating-point DSP blocks accelerate Park/Clarke transforms and SVM modulation. The medical-grade screening plus -40C to +100C operating envelope make it reliable for factory-floor enclosures with elevated ambient temperatures.
推荐
Medical Imaging Pre-Processing
For ultrasound, endoscopy, and patient-monitoring front-ends, the 10AS048E3F29E2LG pairs a Cortex-A9 dual-core host processor with 480K FPGA logic elements capable of real-time image filtering, beamforming, and JPEG/MJPEG compression at full video rates. Its medical-grade qualification simplifies regulatory submissions for IEC 60601-1 systems, while the 780-ball FC-FBGA supports high-bandwidth LVDS camera link inputs and DDR3/DDR4 frame buffering. The 0.9 V core voltage on 20 nm process keeps dissipated power manageable for fan-less medical carts.
推荐
Software-Defined Radio Baseband
In SDR baseband cards, the 10AS048E3F29E2LG's 480K logic elements and hardened floating-point DSP blocks perform wide-bandwidth channelization, FFT, and digital down-conversion at line rate, while the dual ARM Cortex-A9 HPS executes the MAC layer, network stack, and waveform management. Multi-gigabit transceivers interface directly to RF ADC/DAC front-ends, and the Cortex-A9 NEON engine handles crypto accelerators for secure waveforms. Medical-grade screening is a bonus for mission-critical deployable radios.
推荐
Machine Vision Inspection
The 10AS048E3F29E2LG is an excellent fit for high-speed factory inspection, where the FPGA fabric processes 4K CoaXPress or GigE Vision streams in real time and the ARM Cortex-A9 HPS runs the inspection algorithm, defect classification, and PLC integration. Its 480K logic elements accommodate multiple parallel image-processing pipelines, while the medical-grade operating range ensures long-term reliability in 24/7 production environments. PCIe Gen2 hard IP enables direct host-PC frame grabber integration when needed.
推荐
High-Speed Data Acquisition
For radar, lidar, and scientific instruments, the 10AS048E3F29E2LG ingests multi-gigasample-per-second ADC data through LVDS or JESD204B interfaces implemented in the FPGA fabric, with the dual Cortex-A9 HPS responsible for time stamping, trigger handling, and data forwarding over 10 Gigabit Ethernet. Its 1.5 GHz HPS can drive TCP/IP streaming at full line rate, while 480K logic elements sustain 200+ MHz fabric clock for real-time DSP. Medical-grade screening supports long-life deployment in field instrumentation.
推荐
Industrial IoT Gateway
Industrial IoT edge gateways benefit from the 10AS048E3F29E2LG's dual-core ARM Cortex-A9 running Linux with containerized applications, while the FPGA fabric accelerates protocol bridging between legacy fieldbuses (Modbus, CAN, RS-485) and modern MQTT/OPC-UA/TSN Ethernet. The 480K logic elements allow simultaneous support for several protocol converters in a single device, and the medical-grade screening guarantees long-term reliability in unattended industrial cabinets. The 0.9 V core voltage reduces power budget for PoE-powered gateways.
推荐
推荐产品汇总
工程参考数据： 10AS048E3F29E2LG ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10AS048E2F29E2LG | 10AS048E3F29I2LG | 10AS066E3F29E2LG | 10AS032E4F29E3LG | 10AS048E2F29I2SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FC-FBGA (F29, 29x29 mm) | 780-ball FC-FBGA (F29, 29x29 mm) - same | 780-ball FC-FBGA (F29, 29x29 mm) - same | 780-ball FC-FBGA (F29, 29x29 mm) - same | 780-ball FC-FBGA (F29, 29x29 mm) - same | 780-ball FC-FBGA (F29, 29x29 mm) - same |
| Logic Elements | 480,000 | 480,000 | 480,000 | 660,000 (+38%) | 270,000 (-44%) | 480,000 |
| Hard Processor System | Dual ARM Cortex-A9 up to 1.5 GHz | Dual ARM Cortex-A9 up to 1.5 GHz | Dual ARM Cortex-A9 up to 1.5 GHz | Dual ARM Cortex-A9 up to 1.5 GHz | Dual ARM Cortex-A9 up to 1.5 GHz | Dual ARM Cortex-A9 up to 1.5 GHz |
| Feature Tier (E-code) | E3 | E2 (lower) | E3 | E3 | E4 (higher) | E2 (lower) |
| Operating Temperature | -40C to +100C (medical grade) | -40C to +100C (medical grade) | -40C to +100C (industrial grade) | -40C to +100C (medical grade) | -40C to +100C (medical grade) | -40C to +100C (industrial grade) |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
关键差异点
- Medical-grade screening extends operating-grade reliability beyond industrial （对比 10AS048E3F29I2LG (industrial grade))
- Higher logic density for compute-intensive designs （对比 10AS032E4F29E3LG (270K LE))
- Balanced E3 feature tier for moderate transceiver and DSP needs （对比 10AS032E4F29E3LG (E4 tier))
- Lower density but upgrade path to 660K LE within same F29 BGA （对比 10AS066E3F29E2LG (660K LE))
设计说明
Estimated: at full HPS utilization (dual Cortex-A9 at 1.5 GHz) plus 80% logic utilization on the 480K fabric, the 10AS048E3F29E2LG can dissipate 15-25 W depending on toggle rate and transceiver usage. The 780-ball FC-FBGA package requires a multilayer PCB with a thermal via array beneath the central BGA balls and a heatsink rated for at least 8 W. Refer to Intel Arria 10 SX thermal design guidelines for junction-to-ambient thermal resistance modeling. The 0.9 V core voltage must be derived from a high-efficiency buck regulator with output accuracy within +/-3% to avoid timing margin loss.
The 780-ball FC-FBGA requires a high-layer-count PCB (typically 12+ layers) with microvia-in-pad construction, matched-length DDR3/DDR4 traces for the HPS memory controller, and dedicated transceiver channels routed with controlled impedance (typically 85 ohm differential for 10 Gbps links). Place decoupling capacitors on the bottom side directly under the BGA escape vias. Reference Intel's Arria 10 SX hardware design guidelines for ball-out specifics and PCIe Gen2/Gen3 channel routing rules.
Do not assume all Arria 10 SX variants share the same bitstream; the configuration bitstream is generated per device and per speed grade by Quartus Prime. Programming a 10AS048E3 with a 10AS048E2 or 10AS066E3 bitstream will fail configuration. Always regenerate programming files (.sof, .jic, .pof) for the exact target ordering part number. Also verify the HPS preloader image matches the specific device; mixed preloader+bitstream combinations can result in HPS boot failure.
Multi-gigabit transceivers on Arria 10 SX require strict signal-integrity practices: AC-coupled interconnect, controlled 100 ohm differential impedance, and tight via stub minimization via back-drilling or HDI construction. The 1.5 GHz HPS subsystem uses 0.9 V core plus separate PLL supplies; isolate PLL power rails with ferrite beads and decoupling networks as recommended in the Arria 10 SX pin connection guidelines.
合规信息
RoHS compliance and lead-free status confirmed per Intel/Altera material declarations. REACH, conflict-minerals, and AEC-Q100 status not specifically stated in verified web data; treat as unknown unless confirmed with Intel directly. AEC-Q100 does not apply to FPGAs as a category.
