10AS066H2F34E2SG - Arria 10 SX SoC FPGA 660K LE | Altera | Intel
料号： 10AS066H2F34E2SG ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $3384.57 | $3,384.57 |
| 10 | $3200 | $32,000.00 |
| 100 | $2900 | $290,000.00 |
| 500 | $2650 | $1,325,000.00 |
| 1,000 | $2400 | $2,400,000.00 |
10AS066H2F34E2SG 概述
A System-on-Chip (SoC) FPGA is an integrated circuit that merges a microprocessor subsystem (typically ARM Cortex-A cores with caches, MMU, and peripherals) with a programmable FPGA fabric on the same die. This integration places the SoC inside the broader taxonomy of embedded processors -> SoC -> SoC FPGA -> FPGA & CPLD -> programmable logic. The Arria 10 SX family specifically targets applications that require both high-throughput DSP/data-processing in the FPGA fabric and OS-driven control software running on hard ARM cores, eliminating the need for a separate processor companion chip and reducing board area, BOM count, and inter-chip interconnect latency.
Key features of the 10AS066H2F34E2SG include 660K logic elements, embedded ARM Cortex-A9 dual-core MPCore with CoreSight debug, on-chip memory, dedicated DSP blocks, high-speed transceivers, and a 0.9V core supply voltage typical of the 20nm Arria 10 process. The H2 speed grade and E2 temperature grade (extended) make this part suitable for industrial and commercial environments, while the 1152-ball FCBGA package supports the high pin count required for parallel memory interfaces and multi-gigabit transceiver I/O.
Architecturally, the Arria 10 SX combines a hardened Hard Processor System (HPS) block with the FPGA fabric through a coherent system interconnect. The HPS exposes Ethernet MAC, USB OTG, UART/USART, SPI, I2C, NAND/NOR flash controllers, and a DDR memory controller, while the FPGA fabric implements application-specific datapath logic and DSP functions. The 20nm process technology provides the performance-per-watt envelope that distinguishes Arria 10 from prior Stratix/Cyclone families.
Typical applications include industrial machine vision, software-defined radio (SDR), radar signal processing, medical imaging, military/aerospace signal intelligence, and high-performance test and measurement instrumentation. Engineers choose the Arria 10 SX 660K variant when their design requires more logic capacity than Arria 10 GX 270K/480K parts but not the full 1.15M logic element density of higher-tier Arria 10 SX devices.
Design considerations include signal-integrity work for the FCBGA ball-out, multi-rail power sequencing (the HPS and FPGA fabric often require independent ramp profiles), thermal management with the exposed-die FCBGA package, and supply of the Altera/Intel Quartus Prime design suite for HDL synthesis, place-and-route, and HPS firmware development. The 35x35 mm package demands controlled-impedance PCB stackup planning for transceiver channels.
This page synthesizes distributor pricing, package diagrams, drop-in same-brand alternatives, and design notes not found in the standalone Altera datasheet, helping engineers evaluate sourcing options and plan board-level integration.
直接替换替代料： 10AS066H2F34E2SG ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10AS066H2F34E2SG （相同外形与封装尺寸） ——差异在于 Package, Temperature Grade, Mounting Type, Core Voltage, Package Code.
快速对比工具——选择替代料号进行并排对比：
10AS066H2F34E2LG
✅ 直接替换✓ 有现货
$3250 / 个
查看数据手册 →10AS066H1F34I1HG
✅ 直接替换✓ 有现货
$3720 / 个
查看数据手册 →10AS066H2F34I2SG
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3550 / 个
查看数据手册 →10AS066H2F34E1HG
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$2980 / 个
查看数据手册 →10AS066H3F34E2SG
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3600 / 个
查看数据手册 →10AS066H2F34E2SG 最大额定值与电气特性
| Series | Arria 10 SX |
| Device Family | Arria 10 SX SoC FPGA |
| Logic Elements | 660,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Core Voltage | 0.9 V (typical, 20nm process) |
| Core Frequency | Up to 1.5 GHz |
| User I/O Count | 492 |
| 封装 | 1152-FBGA, FC (35x35 mm) |
| Package Code | BGA (F34) |
| Speed Grade | H2 |
| Temperature Grade | E2 (extended) |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
| Lead Free | Yes |
| Peripherals in HPS | USB OTG, UART/USART, Ethernet MAC, SPI, I2C, NAND/NOR flash controller, DDR controller |
10AS066H2F34E2SG bga (f34) 引脚配置指南
10AS066H2F34E2SG（bga (f34) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10AS066H2F34E2SG.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10AS066H2F34E2SG 适用于 6 应用s: Radar Signal Processing, Software Defined Radio (SDR), Industrial Machine Vision, Medical Imaging Equipment, Test and Measurement Instrumentation, Defense and Aerospace Signal Intelligence.
Radar Signal Processing
The 10AS066H2F34E2SG is well-suited for radar signal processing because its 660K logic elements and dedicated DSP blocks support high-throughput FFT pipelines, pulse compression, and beamforming. The embedded dual ARM Cortex-A9 hard processor system runs control-plane software for radar scheduling, target tracking, and interface management without a separate processor companion. The high-speed transceivers handle digitized RF data from A/D converters at multi-GSPS rates.
推荐
Software Defined Radio (SDR)
The 10AS066H2F34E2SG delivers FPGA fabric capacity and DSP throughput suitable for wideband SDR platforms. Its 660K logic elements and embedded ARM cores implement digital up/down conversion, channelization filters, and protocol stack layers in a single device. The transceivers support multi-GSPS data interfaces to RF front-end ADC/DAC chips, while the SoC integration simplifies PCB layout and reduces BOM count compared with separate FPGA + processor designs.
推荐
Industrial Machine Vision
The 10AS066H2F34E2SG serves industrial machine vision applications requiring real-time image processing at high resolution. Its FPGA fabric implements ISP pipelines (debayering, demosaicing, color correction, HDR fusion) at multi-megapixel rates, while the ARM Cortex-A9 cores run Linux for vision algorithms, camera protocol stacks (MIPI CSI-2, GigE Vision), and industrial Ethernet communication. The 492 user I/O pins support multi-camera interfaces and parallel sensor data capture.
推荐
Medical Imaging Equipment
The 10AS066H2F34E2SG powers medical imaging modalities such as ultrasound, CT, and MRI front-end processing. Its logic capacity supports beamformers, back-projection, and real-time 3D reconstruction, while the embedded ARM subsystem manages patient interface, DICOM networking, and operator console software. The 20nm Arria 10 process offers the performance-per-watt profile required for fanless medical enclosures and IEC 60601 compliance.
推荐
Test and Measurement Instrumentation
The 10AS066H2F34E2SG integrates into high-end oscilloscopes, protocol analyzers, and signal generators where waveform processing and trigger logic exceed the capacity of smaller FPGAs. Its 660K logic elements accelerate FFT-based spectrum analysis, eye diagram rendering, and real-time serial protocol decoding. The SoC integration runs the instrument UI, remote control, and data export pipelines on the ARM Cortex-A9 subsystem, eliminating a separate CPU module.
推荐
Defense and Aerospace Signal Intelligence
The 10AS066H2F34E2SG supports defense electronic warfare, SIGINT, and secure communications platforms where Altera (Intel) has long-standing aerospace qualified FPGA offerings. Its 660K logic elements implement wideband digital receivers, encryption accelerators, and protocol demodulators, while the ARM cores handle system management, secure boot, and crypto key handling. The extended E2 temperature grade supports harsh tactical environments typical of airborne and shipboard installations.
推荐
推荐产品汇总
工程参考数据： 10AS066H2F34E2SG ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10AS066H2F34E2LG | 10AS066H1F34I1HG | 10AS066H2F34I2SG | 10AS066H2F34E1HG | 10AS066H3F34E2SG |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1152-FBGA (F34, 35x35 mm) | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 |
| Speed Grade | H2 | H2 | H1 (-12% Fmax) | H2 | H2 | H3 (+10% Fmax) |
| Temperature Grade | E2 (Extended) | E2 (Extended) | I1 (Industrial) | I2 (Industrial) | E1 (Extended lower) | E2 (Extended) |
| Hard Processor System | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Shipping Media | Tray | Tape & Reel | Tray (HG) | Tray (SG) | Tray (HG) | Tray (SG) |
关键差异点
- Same-brand drop-in alternative with tape & reel packaging （对比 10AS066H2F34E2LG)
- Lower speed grade variant for cost-sensitive designs （对比 10AS066H1F34I1HG)
- Higher speed grade variant for performance-critical systems （对比 10AS066H3F34E2SG)
设计说明
The 1152-ball FCBGA (35x35 mm) requires a high-density PCB stackup with controlled-impedance routing for high-speed transceiver channels. Recommended stackup is 12-16 layers with thin dielectric (3-4 mil) between signal layers and adjacent reference planes. Use microvia-in-pad technology (stacked or staggered) for breakout from the 1.0 mm pitch BGA array to inner routing layers. Per Altera's Arria 10 board design guidelines, length-matching tolerance for DDR interfaces should be held to +/- 25 ps and within a byte lane to +/- 10 ps.
Estimated: the Arria 10 SX 660K at typical utilization (~70% LE, ~50% DSP, mid transceiver activity) consumes approximately 15-20 W from the 0.9 V core rail alone, with auxiliary rails (HPS, I/O, PLL, transceiver, AUX) adding another 5-10 W. Design a multi-rail power tree with independent sequencing: FPGA fabric core should ramp before HPS core and I/O to prevent latch-up. Use Altera's PowerPlay early power estimator spreadsheet before committing to discrete regulator selection. Decoupling follows Altera's recommended capacitor mix of 0402 and 0201 ceramics placed inside the package keep-out zone.
The 35x35 mm FCBGA package exposes the die through a thermal interface, so heatsink attachment via a thermal interface material (TIM) is mandatory for sustained workloads. Estimated thermal resistance theta_JB is approximately 0.5 C/W, requiring a heatsink with theta_SA under 1 C/W to keep junction rise below 25 C at 20 W. For fanless industrial designs, consider a top-side finned heatsink with thermal pad; for fan-cooled enclosures, a low-profile aluminum extrusion suffices. Add a temperature sensor (e.g., TMP102 or MAX31760) adjacent to the package for thermal throttling in firmware.
Common pitfalls when designing with the Arria 10 SX SoC FPGA: (1) ignoring the HPS boot mode pin strapping (BSEL pins) which selects NAND, SD, QSPI, or eMMC boot source, (2) failing to provide a separate free-running clock to the HPS for watchdog operation independent of the FPGA fabric clock, (3) underestimating configuration time when loading via JTAG versus a fast passive parallel (FPP) configuration flash, (4) mixing transceiver reference clock frequencies across channels without proper PLL planning, and (5) omitting the external MSEL pin strapping which selects configuration mode. Always consult the Arria 10 SX pinout file before PCB fabrication.
合规信息
RoHS compliant per Altera product page. Not AEC-Q100 qualified (industrial/extended temperature grades available instead - I1, I2, E1, E2). Lead-free and halogen-free per Altera material declaration. AEC-Q100 is not applicable for FPGAs; for automotive-grade FPGAs consider Cyclone V or Cyclone IV automotive variants.