10AS066H2F34E2SG - Arria 10 SX SoC FPGA 660K LE | Altera | Intel
MPN: 10AS066H2F34E2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3384.57 | $3,384.57 |
| 10 | $3200 | $32,000.00 |
| 100 | $2900 | $290,000.00 |
| 500 | $2650 | $1,325,000.00 |
| 1,000 | $2400 | $2,400,000.00 |
Drop-in alternatives for 10AS066H2F34E2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS066H2F34E2LG
✅ Drop-In✓ In Stock
$3250 / Unit
View Datasheet →10AS066H1F34I1HG
✅ Drop-In✓ In Stock
$3720 / Unit
View Datasheet →10AS066H2F34I2SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3550 / Unit
View Datasheet →10AS066H2F34E1HG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2980 / Unit
View Datasheet →10AS066H3F34E2SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3600 / Unit
View Datasheet →10AS066H2F34E2SG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 SX |
| Device Family | Arria 10 SX SoC FPGA |
| Logic Elements | 660,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Core Voltage | 0.9 V (typical, 20nm process) |
| Core Frequency | Up to 1.5 GHz |
| User I/O Count | 492 |
| Package | 1152-FBGA, FC (35x35 mm) |
| Package Code | BGA (F34) |
| Speed Grade | H2 |
| Temperature Grade | E2 (extended) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead Free | Yes |
| Peripherals in HPS | USB OTG, UART/USART, Ethernet MAC, SPI, I2C, NAND/NOR flash controller, DDR controller |
10AS066H2F34E2SG bga (f34) Pin Configuration Guide
Complete pinout information for 10AS066H2F34E2SG (bga (f34) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS066H2F34E2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS066H2F34E2SG is suitable for 6 applications: Radar Signal Processing, Software Defined Radio (SDR), Industrial Machine Vision, Medical Imaging Equipment, Test and Measurement Instrumentation, Defense and Aerospace Signal Intelligence.
Radar Signal Processing
The 10AS066H2F34E2SG is well-suited for radar signal processing because its 660K logic elements and dedicated DSP blocks support high-throughput FFT pipelines, pulse compression, and beamforming. The embedded dual ARM Cortex-A9 hard processor system runs control-plane software for radar scheduling, target tracking, and interface management without a separate processor companion. The high-speed transceivers handle digitized RF data from A/D converters at multi-GSPS rates.
Recommended
Software Defined Radio (SDR)
The 10AS066H2F34E2SG delivers FPGA fabric capacity and DSP throughput suitable for wideband SDR platforms. Its 660K logic elements and embedded ARM cores implement digital up/down conversion, channelization filters, and protocol stack layers in a single device. The transceivers support multi-GSPS data interfaces to RF front-end ADC/DAC chips, while the SoC integration simplifies PCB layout and reduces BOM count compared with separate FPGA + processor designs.
Recommended
Industrial Machine Vision
The 10AS066H2F34E2SG serves industrial machine vision applications requiring real-time image processing at high resolution. Its FPGA fabric implements ISP pipelines (debayering, demosaicing, color correction, HDR fusion) at multi-megapixel rates, while the ARM Cortex-A9 cores run Linux for vision algorithms, camera protocol stacks (MIPI CSI-2, GigE Vision), and industrial Ethernet communication. The 492 user I/O pins support multi-camera interfaces and parallel sensor data capture.
Recommended
Medical Imaging Equipment
The 10AS066H2F34E2SG powers medical imaging modalities such as ultrasound, CT, and MRI front-end processing. Its logic capacity supports beamformers, back-projection, and real-time 3D reconstruction, while the embedded ARM subsystem manages patient interface, DICOM networking, and operator console software. The 20nm Arria 10 process offers the performance-per-watt profile required for fanless medical enclosures and IEC 60601 compliance.
Recommended
Test and Measurement Instrumentation
The 10AS066H2F34E2SG integrates into high-end oscilloscopes, protocol analyzers, and signal generators where waveform processing and trigger logic exceed the capacity of smaller FPGAs. Its 660K logic elements accelerate FFT-based spectrum analysis, eye diagram rendering, and real-time serial protocol decoding. The SoC integration runs the instrument UI, remote control, and data export pipelines on the ARM Cortex-A9 subsystem, eliminating a separate CPU module.
Recommended
Defense and Aerospace Signal Intelligence
The 10AS066H2F34E2SG supports defense electronic warfare, SIGINT, and secure communications platforms where Altera (Intel) has long-standing aerospace qualified FPGA offerings. Its 660K logic elements implement wideband digital receivers, encryption accelerators, and protocol demodulators, while the ARM cores handle system management, secure boot, and crypto key handling. The extended E2 temperature grade supports harsh tactical environments typical of airborne and shipboard installations.
Recommended
Recommended Products Summary
Engineering reference data for 10AS066H2F34E2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS066H2F34E2LG | 10AS066H1F34I1HG | 10AS066H2F34I2SG | 10AS066H2F34E1HG | 10AS066H3F34E2SG |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1152-FBGA (F34, 35x35 mm) | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 |
| Speed Grade | H2 | H2 | H1 (-12% Fmax) | H2 | H2 | H3 (+10% Fmax) |
| Temperature Grade | E2 (Extended) | E2 (Extended) | I1 (Industrial) | I2 (Industrial) | E1 (Extended lower) | E2 (Extended) |
| Hard Processor System | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Shipping Media | Tray | Tape & Reel | Tray (HG) | Tray (SG) | Tray (HG) | Tray (SG) |
| Approx. Unit Price (qty 1, USD) | $3,384.57 | $3,384.57 | ~$3,000 [DATA_NEEDED] | ~$3,400 [DATA_NEEDED] | ~$3,200 [DATA_NEEDED] | ~$3,800 [DATA_NEEDED] |
Key Differentiators
- Same-brand drop-in alternative with tape & reel packaging (vs 10AS066H2F34E2LG)
- Lower speed grade variant for cost-sensitive designs (vs 10AS066H1F34I1HG)
- Higher speed grade variant for performance-critical systems (vs 10AS066H3F34E2SG)
Design Notes
The 1152-ball FCBGA (35x35 mm) requires a high-density PCB stackup with controlled-impedance routing for high-speed transceiver channels. Recommended stackup is 12-16 layers with thin dielectric (3-4 mil) between signal layers and adjacent reference planes. Use microvia-in-pad technology (stacked or staggered) for breakout from the 1.0 mm pitch BGA array to inner routing layers. Per Altera's Arria 10 board design guidelines, length-matching tolerance for DDR interfaces should be held to +/- 25 ps and within a byte lane to +/- 10 ps.
Estimated: the Arria 10 SX 660K at typical utilization (~70% LE, ~50% DSP, mid transceiver activity) consumes approximately 15-20 W from the 0.9 V core rail alone, with auxiliary rails (HPS, I/O, PLL, transceiver, AUX) adding another 5-10 W. Design a multi-rail power tree with independent sequencing: FPGA fabric core should ramp before HPS core and I/O to prevent latch-up. Use Altera's PowerPlay early power estimator spreadsheet before committing to discrete regulator selection. Decoupling follows Altera's recommended capacitor mix of 0402 and 0201 ceramics placed inside the package keep-out zone.
The 35x35 mm FCBGA package exposes the die through a thermal interface, so heatsink attachment via a thermal interface material (TIM) is mandatory for sustained workloads. Estimated thermal resistance theta_JB is approximately 0.5 C/W, requiring a heatsink with theta_SA under 1 C/W to keep junction rise below 25 C at 20 W. For fanless industrial designs, consider a top-side finned heatsink with thermal pad; for fan-cooled enclosures, a low-profile aluminum extrusion suffices. Add a temperature sensor (e.g., TMP102 or MAX31760) adjacent to the package for thermal throttling in firmware.
Common pitfalls when designing with the Arria 10 SX SoC FPGA: (1) ignoring the HPS boot mode pin strapping (BSEL pins) which selects NAND, SD, QSPI, or eMMC boot source, (2) failing to provide a separate free-running clock to the HPS for watchdog operation independent of the FPGA fabric clock, (3) underestimating configuration time when loading via JTAG versus a fast passive parallel (FPP) configuration flash, (4) mixing transceiver reference clock frequencies across channels without proper PLL planning, and (5) omitting the external MSEL pin strapping which selects configuration mode. Always consult the Arria 10 SX pinout file before PCB fabrication.
Compliance Information
RoHS compliant per Altera product page. Not AEC-Q100 qualified (industrial/extended temperature grades available instead - I1, I2, E1, E2). Lead-free and halogen-free per Altera material declaration. AEC-Q100 is not applicable for FPGAs; for automotive-grade FPGAs consider Cyclone V or Cyclone IV automotive variants.
