10AS066H1F34I1HG - Arria 10 SX SoC FPGA, 660K LE | Intel
MPN: 10AS066H1F34I1HG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4650 | $46,500.00 |
| 100 | $4310 | $431,000.00 |
| 500 | $3990 | $1,995,000.00 |
| 1,000 | $3720 | $3,720,000.00 |
Drop-in alternatives for 10AS066H1F34I1HG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS066H1F34E1HG
✅ Drop-In✓ In Stock
$3900 / Unit
View Datasheet →10AS066H1F34I1SG
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10AS057H1F34I1HG
✅ Drop-In✓ In Stock
$3500 / Unit
View Datasheet →10AS048H1F34I1HG
✅ Drop-In✓ In Stock
$2650 / Unit
View Datasheet →10AS032H1F34I1HG
✅ Drop-In✓ In Stock
$2077.26 / Unit
View Datasheet →10AS066H1F34I1HG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 660000 (approx.) |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Core Frequency | 1.5 GHz (max) |
| Process Technology | 20 nm |
| Package | 1152-ball FC-FBGA (35 x 35 mm) |
| Operating Temperature Grade | Industrial (-40C to +100C, suffix I) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
| Maximum Seated Height | 3.35 mm |
| Terminal Form | BALL |
| Number of Terminals | 1152 |
| Package Code | BGA |
| Package Shape | SQUARE |
| Lead Free | Yes (per Altera product page) |
| Configuration Memory | SRAM-based (volatile) |
10AS066H1F34I1HG square Pin Configuration Guide
Complete pinout information for 10AS066H1F34I1HG (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS066H1F34I1HG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS066H1F34I1HG is suitable for 7 applications: Wireless Baseband Processing, Radar and Electronic Warfare, Professional Video Broadcast and Image Processing, Industrial Machine Vision and Motor Control, High-Throughput Data Acquisition, 5G Fronthaul and PHY Acceleration, Medical Imaging Equipment.
Wireless Baseband Processing
The 10AS066H1F34I1HG suits wireless baseband designs where the 660K logic elements and hardened DSP blocks implement high-throughput channel cards, while the dual 1.5 GHz ARM Cortex-A9 cores run the MAC scheduler and protocol stack. Its industrial temperature grade supports outdoor small-cell and pico-cell deployments. Compared with a discrete FPGA + MCU design, the integrated HPS removes inter-chip latency and board area.
Recommended
Radar and Electronic Warfare
In radar and EW systems, the 10AS066H1F34I1HG's hardened floating-point DSP blocks and high-speed transceivers process wideband I/Q streams directly, while the HPS runs tracker and classification algorithms. The 1152-ball F34 package exposes the full transceiver count needed for multi-channel phased-array receivers. The industrial temperature grade enables platform deployments in unconditioned enclosures.
Recommended
Professional Video Broadcast and Image Processing
Broadcast video routers, multi-viewers, and 4K/8K image-processing pipelines benefit from the 10AS066H1F34I1HG's combination of 660K logic elements, on-chip memory, and the integrated HPS for control-plane networking. The SoC runs Linux for IP-based control while the FPGA fabric handles pixel-rate processing. Industrial temperature grade supports studio and outdoor-broadcast equipment racks.
Recommended
Industrial Machine Vision and Motor Control
Factory automation cameras and high-precision motor drives use the 10AS066H1F34I1HG to run multi-axis control loops and image-pipeline preprocessing simultaneously. The HPS executes motion-control software under a real-time OS while the FPGA fabric handles encoder decoding and image preprocessing. The industrial temperature grade and -40C to +100C range suit factory-floor conditions.
Recommended
High-Throughput Data Acquisition
Test and measurement instruments and high-channel-count DAQ systems pair the 10AS066H1F34I1HG's transceivers and parallel I/O with the HPS for data forwarding over 10 Gigabit Ethernet or PCIe. The SoC enables real-time DSP in fabric and Linux-side storage simultaneously, eliminating a separate processor card. Industrial temperature grade supports lab and field-instrument deployments.
Recommended
5G Fronthaul and PHY Acceleration
The 10AS066H1F34I1HG accelerates 5G PHY-layer functions such as LDPC decoding, FFT/iFFT, and digital pre-distortion in the FPGA fabric, while the dual 1.5 GHz ARM Cortex-A9 HPS handles fronthaul networking under Linux. Its hardened DSP and transceiver count suit mid-band radio units. Industrial temperature grade supports outdoor radio-unit enclosures.
Recommended
Medical Imaging Equipment
Ultrasound and CT imaging systems use the 10AS066H1F34I1HG to perform beamforming and image reconstruction in the FPGA fabric, while the HPS runs the user interface and DICOM networking stack. The SoC reduces board count compared with discrete designs and the industrial temperature grade supports hospital and mobile-clinic environments.
Recommended
Recommended Products Summary
Engineering reference data for 10AS066H1F34I1HG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS066H1F34E1HG | 10AS057H1F34I1HG | 10AS048H1F34I1HG | 10AS032H1F34I1HG |
|---|---|---|---|---|---|
| Package | 1152-ball FC-FBGA (F34, 35x35 mm) | 1152-ball FC-FBGA (F34, 35x35 mm) | 1152-ball FC-FBGA (F34, 35x35 mm) | 1152-ball FC-FBGA (F34, 35x35 mm) | 1152-ball FC-FBGA (F34, 35x35 mm) |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 660000 | 660000 | 570000 | 480000 | 320000 |
| Hard Processor System | Dual ARM Cortex-A9, 1.5 GHz | Dual ARM Cortex-A9, 1.5 GHz | Dual ARM Cortex-A9, 1.5 GHz | Dual ARM Cortex-A9, 1.5 GHz | Dual ARM Cortex-A9, 1.5 GHz |
| Temperature Grade | Industrial (-40C to +100C) | Extended | Industrial | Industrial | Industrial |
| Speed Grade | -1 | -1 | -1 | -1 | -1 |
| Process Node | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Pin/Package Compatibility | Reference | Drop-in (same F34 BGA) | Drop-in (same F34 BGA, lower LE) | Drop-in (same F34 BGA, lower LE) | Drop-in (same F34 BGA, lower LE) |
Key Differentiators
- Integrated ARM Cortex-A9 HPS at 1.5 GHz alongside 660K LE fabric (vs 10AS057H1F34I1HG (570K LE))
- Industrial temperature grade on a 660K-LE SX die (vs 10AS066H1F34E1HG (extended temperature))
- Pin-compatible density scaling within the F34 footprint (vs 10AS032H1F34I1HG (320K LE))
- 20 nm process with hardened floating-point DSP (vs 10AS048H1F34I1HG (480K LE))
Design Notes
Estimated: The 1152-ball FC-FBGA 35 x 35 mm Arria 10 SX package dissipates 15-30 W under sustained workload depending on toggle rate and transceiver utilisation. With a typical theta_JA of around 8 C/W, junction temperature can rise 120-240 C above ambient without thermal relief. A heatsink with thermal interface material and adequate airflow is required for industrial-temperature operation. Confirm exact theta values against the latest Intel Arria 10 Device Datasheet.
Arria 10 SX SoCs require multiple power rails (core VCC, VCCPT, VCCAUX, VCCR, transceiver supplies, HPS supplies). Sequence rails according to the Intel Arria 10 Power Management User Guide to avoid latch-up. Use the Altera/Intel PowerPlay early power estimator to size regulators before final schematic. Estimated: budget 25 W of regulator capacity for a typical 660K-LE SX design with 4 transceiver channels at full utilisation.
The 1152-ball F34 BGA has a 1.0 mm ball pitch. Use at least 8 PCB layers with HDI micro-via stack-ups (any-layer via preferred). Match trace lengths within each transceiver bank to within the limits in the Intel Arria 10 Transceiver User Guide; length matching within 150 mils is typical for 10 Gbps channels. Decouple every VCC pin individually with 0402 or 0201 ceramic capacitors.
Do not omit the configuration device. Arria 10 SRAM-based FPGAs lose configuration on power-down and require a serial flash (EPCQ-L) plus the appropriate MSEL pin strapping for fast/standard/remote configuration. For HPS boot, populate the QSPI flash and SD card boot interface; ensure the boot mode pins are correctly strapped on reset.
Transceiver channels on Arria 10 SX require controlled-impedance 100-ohm differential routing with AC coupling capacitors at the device pins. Reference the Intel Arria 10 Transceiver User Guide for the recommended AC-coupling capacitor value, typically 100 nF for data rates up to 10 Gbps and 10 nF for 25 Gbps channels. Estimated: budget 4-8 transceiver channels per fabric-side interface card for typical mid-band radio units.
Compliance Information
RoHS and lead-free per Altera/Intel product page. AEC-Q100 not applicable for SoC FPGA. Halogen-free status marked as unknown - not stated explicitly in retrieved distributor data.
