10AS066H2F34E2LG - Arria 10 SX SoC FPGA 660K LE | Intel | SoC
MPN: 10AS066H2F34E2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3834.62 | $3,834.62 |
| 10 | $3700 | $37,000.00 |
| 100 | $3550 | $355,000.00 |
| 500 | $3400 | $1,700,000.00 |
| 1,000 | $3250 | $3,250,000.00 |
10AS066H2F34E2LG Overview
What is an SoC FPGA? An SoC FPGA combines a general-purpose applications processor subsystem (typically ARM Cortex-A cores) with FPGA programmable logic on a single die, allowing hardware accelerators, custom peripherals and parallel datapaths to communicate with software running on the hard CPU over a high-bandwidth on-chip interconnect. The Arria 10 SX extends this concept with hardened floating-point DSP blocks, 12.5 Gbps transceivers and a hardened memory controller, positioning it as a programmable platform for wireless baseband, radar, broadcast and industrial imaging.
Key features of the 10AS066H2F34E2LG include 660K logic elements, 492 user I/Os, hard ARM Cortex-A9 dual-core processor, integrated CoreSight debug, multi-port memory controller supporting DDR4/DDR3/LPDDR3 and 20 nm process technology. The H2 speed grade targets mid-to-high static timing performance while the F34 35x35 mm FCBGA package provides the densest ball array in the family. Integrated PCIe Gen2/3 hard IP blocks and up to 24 transceiver channels at 12.5 Gbps enable high-throughput serial connectivity without consuming FPGA fabric.
Architecturally, the Arria 10 SX family uses TSMC's 20 nm SoC process and Intel's Adaptive Logic Module (ALM) building block, providing 8-input fracturable look-up tables, dedicated memory and DSP slices. The hard processor subsystem includes Level-1 caches, NEON media engine, ECC-protected L2 and a coherent interconnect to FPGA fabric. Power management relies on SmartVoltageID and per-bank voltage scaling to optimise dynamic power across the CPU and FPGA domains.
Typical applications for the 10AS066H2F34E2LG include 4G/5G wireless baseband processing, military radar and electronic warfare, professional broadcast video and machine vision. The hardened ARM cores offload control-plane tasks while the FPGA fabric accelerates DSP-heavy physical-layer pipelines. Designers targeting lower logic capacity can choose 10AS022 or 10AS048 variants in the same F34 footprint for cost optimisation.
When designing with this device, ensure proper sequencing of the multiple supply rails (core, I/O, transceiver, HPS) and follow Intel's pin-out guidelines for the FCBGA to avoid signal-integrity issues. The 35 x 35 mm package requires multi-layer PCB stack-up with controlled-impedance routing and matched-length differential pairs for transceiver channels. Consult the Arria 10 SX device datasheet for thermal management recommendations under sustained ARM CPU + FPGA workload.
This page synthesises distributor pricing, parametric position within the Arria 10 SX family and PCB-layout considerations not found in the manufacturer datasheet alone. Engineers comparing 10AS066H2F34E2LG against Cyclone V SX, Zynq-7000 or Zynq UltraScale+ will find the comparison tables and drop-in alternatives below particularly useful for BOM consolidation.
Drop-in alternatives for 10AS066H2F34E2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10AS066H2F34E2LG (same form factor and footprint) — differing in Package, Temperature Grade, Mounting Type, Core Voltage, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS066H2F34E1HG
✅ Drop-In✓ In Stock
$2980 / Unit
View Datasheet →10AS066H1F34I1HG
✅ Drop-In✓ In Stock
$3720 / Unit
View Datasheet →10AS066H1F34E1HG
✅ Drop-In✓ In Stock
$3900 / Unit
View Datasheet →10AS066H3F34E2LG
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$2875 / Unit
View Datasheet →10AS066H2F34I2SG
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3550 / Unit
View Datasheet →10AS066H2F34E2LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX |
| Series | 10AS066 |
| Device Type | System On Chip (SoC) FPGA |
| Hard Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| Logic Elements | 660,000 |
| Process Technology | 20 nm |
| Maximum User I/O | 492 |
| Package | 1152-FBGA, FC (35 x 35 mm) |
| Package Code | F34 |
| Speed Grade | H2 |
| Temperature Grade | E2 (enhanced) |
| Maximum CPU Frequency | 1.5 GHz |
| RoHS Status | Compliant |
| Lead Free | Yes |
| Mounting Type | Surface Mount (BGA) |
10AS066H2F34E2LG f34 Pin Configuration Guide
Pin configuration for 10AS066H2F34E2LG (f34 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS066H2F34E2LG.
Refer to the datasheet for full pin configuration.
Typical Applications
10AS066H2F34E2LG is suitable for 6 applications: 4G/5G Wireless Baseband Processing, Military Radar and Electronic Warfare, Professional Broadcast Video Processing, Industrial Machine Vision and Inspection, Medical Imaging Systems, High-Performance Test and Measurement.
4G/5G Wireless Baseband Processing
The 10AS066H2F34E2LG is well-suited to 4G LTE and 5G NR baseband processing because its 660K logic elements can map multi-antenna MIMO matrices, channel estimation kernels and Turbo/Polar decoders in parallel fabric while the hard Dual ARM Cortex-A9 host runs the MAC scheduler, RRC stack and OAM stack. The 12.5 Gbps transceivers natively interface to CPRI or eCPRI fronthaul to remote radio units, eliminating external SerDes. With 1.5 GHz Cortex-A9 cores handling control-plane and the FPGA fabric delivering sub-microsecond DSP latency, the device meets the throughput and determinism required for a small-cell or picocell baseband board.
Recommended
Military Radar and Electronic Warfare
In radar and EW systems, the 10AS066H2F34E2LG integrates pulse compression, MTI filtering, CFAR detection and digital beamforming on FPGA fabric while the ARM Cortex-A9 HPS runs the tracker, classifier and threat-library. The 660K LE fabric supports several hundred DSP pipelines running at hundreds of MHz each, mapping to phased-array antenna element counts typical of AESA radar. The 1152-ball FCBGA F34 footprint is shared with ruggedised defence screening levels, easing migration into conduction-cooled VPX cards. The hardened 12.5 Gbps transceivers feed ADCs/DACs on the front end, while the DDR4 controller provides multi-gigasample capture buffering.
Recommended
Professional Broadcast Video Processing
Broadcast video routers, format converters and multi-viewers benefit from the 10AS066H2F34E2LG's 660K logic elements to implement SDI de-embedders, colour-space converters, scalers and HDR tone-mapping pipelines at full 4K/UHD frame rates. The hard ARM Cortex-A9 subsystem runs the control plane, SNMP agent and on-screen-display rendering, while the FPGA fabric accelerates the pixel-rate video paths at low latency. Up to 24 multi-rate 12.5 Gbps transceivers handle 12G-SDI, HDMI 2.0 or DisplayPort 1.4 aggregation. The 492 user I/Os expose parallel camera or display interfaces for studio production switchers.
Recommended
Industrial Machine Vision and Inspection
In high-throughput machine-vision inspection lines, the 10AS066H2F34E2LG's 660K LE fabric accelerates image pre-processing (defect detection, optical character recognition, sub-pixel measurement) while the Cortex-A9 HPS runs the HMI, EtherCAT or PROFINET master and statistical process-control logic. The 12.5 Gbps transceivers interface to Camera Link, CoaXPress or GigE Vision cameras at multi-gigabit rates. Multiple MIPI CSI-2 or LVDS ports via the 492 user I/Os connect to image sensors directly, reducing BOM cost compared to FPGA-only or processor-only solutions. The extended temperature E2 grade supports factory-floor deployments.
Recommended
Medical Imaging Systems
Ultrasound, CT and MRI image reconstruction leverage the 10AS066H2F34E2LG's parallel DSP fabric to implement beamforming, back-projection and Fourier-domain reconstruction in real time. The Dual ARM Cortex-A9 subsystem handles the patient interface, DICOM stack and operator console, while the FPGA fabric performs the signal-processing pipeline at medical-grade determinism. The 12.5 Gbps transceivers interface to high-channel-count ADC front ends, and the multi-port DDR4 controller buffers raw RF sample streams. The lead-free E2 temperature grade supports IEC 60601-1 compliant medical device manufacturing. Migration to lower-density 10AS048/10AS057 variants in the same F34 footprint allows cost-tiered product lines.
Recommended
High-Performance Test and Measurement
The 10AS066H2F34E2LG fits automated test equipment (ATE), protocol analysers and high-speed oscilloscope front-ends where 660K logic elements implement parallel pattern generation, real-time signal processing and protocol decoding. The hard ARM Cortex-A9 subsystem manages the test sequencer, remote-control interfaces (LXI, USBTMC) and on-board analytics. Up to 24 transceivers at 12.5 Gbps drive multi-lane PCIe, USB 3.0 or proprietary backplanes to the host workstation. The 492 user I/Os expose parallel trigger buses and timing synchronisation lines required in production-floor ATE racks, and the extended-temperature E2 grade supports thermally dense instrument chassis.
Recommended
Recommended Products Summary
Engineering reference data for 10AS066H2F34E2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS066H2F34E1HG | 10AS066H1F34I1HG | 10AS066H1F34E1HG | 10AS066H3F34E2LG | 10AS066H2F34I2SG |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA (F34, 35x35 mm) | 1152-FBGA (F34) - same | 1152-FBGA (F34) - same | 1152-FBGA (F34) - same | 1152-FBGA (F34) - same | 1152-FBGA (F34) - same |
| Logic Elements | 660K | 660K (identical) | 660K (identical) | 660K (identical) | 660K (identical) | 660K (identical) |
| Speed Grade | H2 | H2 (same) | H1 (slower) | H1 (slower) | H3 (faster) | H2 (same) |
| Temperature Grade | E2 (enhanced industrial) | E1 (industrial) | I1 (industrial) | E1 (industrial) | E2 (same) | I2 (industrial, wider) |
| Solder Ball Finish | Lead-free (L suffix) | Leaded (H suffix) | Leaded (H suffix) | Leaded (H suffix) | Lead-free (same) | Lead-free (same) |
| Hard Processor Subsystem | Dual ARM Cortex-A9 with CoreSight | Dual ARM Cortex-A9 (identical) | Dual ARM Cortex-A9 (identical) | Dual ARM Cortex-A9 (identical) | Dual ARM Cortex-A9 (identical) | Dual ARM Cortex-A9 (identical) |
| Maximum CPU Frequency | 1.5 GHz | 1.5 GHz (identical) | 1.5 GHz (identical) | 1.5 GHz (identical) | 1.5 GHz (identical) | 1.5 GHz (identical) |
| Approx. Unit Price (qty 1, USD) | 3834.62 | Similar (~3800-3900) | Lower (~3200-3400) | Lower (~3200-3400) | Higher (~4400-4600) | Similar (~3800-3900) |
Key Differentiators
- Highest-capacity lead-free Arria 10 SX with H2 speed grade and E2 temperature in F34 footprint (vs 10AS066H1F34I1HG)
- Lead-free solder finish for RoHS-compliant manufacturing (vs 10AS066H2F34E1HG)
- Integrated Dual ARM Cortex-A9 hard processor subsystem (vs 5ASXBB3D4F35I5G (Arria V SX))
Design Notes
The 1152-ball FCBGA (F34, 35 x 35 mm) package dissipates up to ~15-20 W under sustained ARM Cortex-A9 + heavy FPGA fabric utilisation. Design a thermal-management strategy that includes a high-conductivity PCB stack-up with at least eight inner copper layers stitched directly under the BGA thermal balls, a heat-spreader or heatsink with 4-6 C/W thermal interface material, and adequate airflow in the chassis. Estimated junction-to-ambient resistance is in the 1.5-2.5 C/W range with a properly designed thermal solution, ensuring the E2-grade 100C junction limit is respected in worst-case ambient (e.g., 70C).
The 35 x 35 mm F34 FCBGA requires a multi-layer PCB stack-up (typically 12-16 layers) with microvia-in-pad or stacked-microvia construction to fan out the 1.0 mm pitch BGA balls. Use the Intel-provided F34 package footprint and pin-out file as the authoritative source for land pattern, solder mask defined (SMD) pads and via-in-pad dimensions. Decoupling must follow the Quartus Prime power-tree guidance: place bulk MLCC capacitors within 2-3 mm of every power ball pair, with a high-frequency 100 nF 0402 cap adjacent to each pair to suppress transient current peaks during fabric clocking.
The 12.5 Gbps transceivers demand strict signal-integrity discipline: matched-length differential pairs within 0.127 mm (5 mil), controlled differential impedance of 100 ohms +/- 10%, and AC-coupling capacitors placed close to the transmitter. Reference the Intel Arria 10 SX transceiver user guide for pre-emphasis and equalisation settings, and validate the channel with 3D-EM simulation (e.g., ANSYS HFSS, Cadence Clarity) before committing layout. Mismatched length or impedance will severely degrade eye-diagram margin at 12.5 Gbps.
The Arria 10 SX SoC requires multiple supply rails: core (typically 0.85-0.95 V), HPS core, HPS I/O, FPGA I/O banks (multiple voltages for LVDS, LVCMOS, SSTL), transceiver supply (1.0-1.1 V) and PLL supplies. Sequence these rails per the Intel power-management guidance using a PMBus-controlled multi-rail regulator (e.g., the Intel Enpirion EM11x series or LTM4677). Keep analog PLLs isolated with ferrite beads and LC filters from digital switching noise.
Common pitfalls when designing with the 10AS066H2F34E2LG include: (1) confusing F34 with F35 package code - they share the 35x35 mm outline but the ball map differs; (2) under-provisioning cooling for simultaneous HPS + heavy FPGA workload; (3) leaving JTAG, MSEL configuration pins in the wrong state, causing boot failure; (4) omitting the required external configuration flash (e.g., EPCQ-L) for non-volatile bitstream; (5) not enabling ECC on the HPS L2 cache for safety-critical applications. Review Intel's Arria 10 SX SoC boot-and-configuration user guide before taping out.
Compliance Information
Lead-free ball finish confirmed by L suffix and RoHS compliance per distributor listings. Halogen-free status not explicitly stated in verified data - assumed unknown. AEC-Q100 not applicable (this is an FPGA/SoC, not an automotive analog IC).
