10AS066H2F34I2LG - Arria 10 SX SoC FPGA, 660K LE | Intel
料号： 10AS066H2F34I2LG ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $12500 | $12,500.00 |
| 10 | $12100 | $121,000.00 |
| 100 | $11750 | $1,175,000.00 |
| 500 | $11400 | $5,700,000.00 |
| 1,000 | $11050 | $11,050,000.00 |
10AS066H2F34I2LG 概述
An SoC FPGA is a class of programmable logic device that combines a hard-application-processor subsystem (in this case dual ARM Cortex-A9 cores with CoreSight debug) with a programmable FPGA fabric on a single die. This integration lets designers run an operating system (typically Linux or VxWorks) for control-plane processing while implementing high-throughput datapath logic in the FPGA fabric. Compared with a discrete CPU+FPGA approach, an SoC FPGA reduces board area, lowers inter-chip latency, and simplifies power sequencing.
Key features of the 10AS066H2F34I2LG include 660 K logic elements, embedded M20K memory blocks, variable-precision DSP blocks, up to 24 transceiver channels supporting multi-gigabit serial interfaces, and the hard ARM Cortex-A9 HPS with peripherals such as EMAC, USB, SATA, and DDR controllers. The Arria 10 architecture is engineered for mid-range applications that require a balance of logic density, transceiver bandwidth, and processor performance.
Typical applications include wireless baseband processing, software-defined radio (SDR), industrial machine vision, high-performance test and measurement, and broadcast video processing. The integrated ARM Cortex-A9 subsystem makes the device especially attractive for applications where Linux-based control and FPGA-based DSP coexist on a single board. The industrial temperature grade supports factory-floor and outdoor deployments.
When designing with this device, careful attention must be paid to PCB layout for the FC-FBGA package: 1 mm ball pitch requires microvia or via-in-pad technology, and the transceiver channels demand controlled-impedance routing and length matching. Power sequencing for the HPS and FPGA rails should follow the manufacturer-referenced POR (power-on-reset) circuit and reference designs. For new designs in 2026, note that Arria 10 is in extended-product support phase, so long-term availability should be confirmed with the manufacturer before committing to a high-volume production run.
直接替换替代料： 10AS066H2F34I2LG ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10AS066H2F34I2LG （相同外形与封装尺寸） ——差异在于 Package, Temperature Grade, Logic Elements, Core Voltage, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
10AS066H2F34I1HG
✅ 直接替换✓ 有现货
$3500 / 个
查看数据手册 →10AS066H2F34E2SG
✅ 直接替换✓ 有现货
$2400 / 个
查看数据手册 →10AS066H2F34E2LG
✅ 直接替换✓ 有现货
$3250 / 个
查看数据手册 →10AS066H1F34I1HG
✅ 直接替换✓ 有现货
$3720 / 个
查看数据手册 →10AS066H2F34E1HG
✅ 直接替换✓ 有现货
$2980 / 个
查看数据手册 →10AS066H2F34I2LG 最大额定值与电气特性
| Manufacturer | Intel (formerly Altera) |
| Series | Arria 10 SX |
| Device Variant | 10AS066 |
| Logic Elements | 660,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Process Technology | 20 nm |
| Core Supply Voltage | 0.9 V |
| 封装 | 1152-ball FC-FBGA (F34), 35 mm x 35 mm |
| Ball Pitch | 1.0 mm |
| Temperature Grade | Industrial (-40 C to +100 C ambient) |
| RoHS 状态 | Compliant |
| Lead-Free | Yes |
10AS066H2F34I2LG 1152-ball fc-fbga (f34), 35 mm x 35 mm 引脚配置指南
10AS066H2F34I2LG（1152-ball fc-fbga (f34), 35 mm x 35 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10AS066H2F34I2LG.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10AS066H2F34I2LG 适用于 6 应用s: Wireless Baseband Processing, Software-Defined Radio (SDR), Industrial Machine Vision Systems, Test and Measurement Instrumentation, Broadcast Video Processing, Medical Imaging Equipment.
Wireless Baseband Processing
The 10AS066H2F34I2LG fits wireless baseband processing because its 660K logic elements support multi-channel LTE/5G PHY layer datapath, while the integrated dual ARM Cortex-A9 MPCore runs the MAC scheduler and protocol stack. The Arria 10 SX fabric at the -2 speed grade achieves Fmax typically above 400 MHz, sufficient for CPRI and JESD204B interface implementations. According to the Arria 10 device handbook, the transceiver channels support multi-gigabit serial links to RFICs and data converters. Designers place the device between ADC/DAC banks and the host CPU, with Linux running on the HPS for control-plane tasks and FPGA fabric handling the real-time PHY.
推荐
Software-Defined Radio (SDR)
The 10AS066H2F34I2LG is well suited to software-defined radio platforms where FPGA fabric performs high-sample-rate DSP and the ARM HPS runs GNU Radio or custom SDR control software. The dual Cortex-A9 cores provide sufficient headroom for Linux + SDR framework while the 660K logic elements implement FFTs, channelizers, and modulation/demodulation. Arria 10 SX transceivers handle ADC/DAC data at gigabit rates. Per Intel reference designs, the F34 FC-FBGA package supports enough transceiver channels for multi-antenna MIMO. The industrial temperature grade also suits military and outdoor SDR deployments.
推荐
Industrial Machine Vision Systems
The 10AS066H2F34I2LG powers high-speed industrial machine vision by processing image sensor data in the FPGA fabric while the ARM HPS runs inspection algorithms and connects to factory networks. The 660K logic elements support multi-lane MIPI-CSI or LVDS image sensor aggregation, while the dual Cortex-A9 can run OpenCV-based defect detection. Industrial temperature grade (-40 C to +100 C ambient) supports factory-floor operation. The FPGA fabric typically implements Bayer demosaic, HDR merging, and real-time compression at frame rates above 60 fps.
推荐
Test and Measurement Instrumentation
The 10AS066H2F34I2LG supports modular test and measurement instruments such as oscilloscopes, signal analyzers, and protocol analyzers because the FPGA fabric handles real-time waveform processing while the HPS runs Linux for UI, networking, and remote control. The 660K logic elements support parallel DSP for FFT, decimation, and trigger logic, and the Arria 10 transceivers interface to high-speed ADCs. According to vendor reference designs, the F34 BGA also exposes PCIe Gen3 x8 lanes for host backplane connectivity in PXI or AXIe chassis.
推荐
Broadcast Video Processing
The 10AS066H2F34I2LG handles broadcast video processing such as HEVC/H.265 encoding, video routing, and color space conversion because the FPGA fabric implements parallel pixel processing and the dual Cortex-A9 manages stream multiplexing. The Arria 10 SX device family supports 12G-SDI and DisplayPort through its transceiver channels, while 660K logic elements sustain multi-stream 4K processing. The integrated HPS reduces board area and BOM compared with a discrete CPU + FPGA solution, which is valuable in broadcast studio and outside-broadcast equipment where space is constrained.
推荐
Medical Imaging Equipment
The 10AS066H2F34I2LG supports medical imaging systems such as ultrasound, CT, and MRI preprocessing where the FPGA fabric performs beamforming and image reconstruction while the HPS handles patient interface and DICOM networking. The 660K logic elements allow real-time processing of multiple transducer channels, and the Arria 10 transceivers connect to high-channel-count ADC arrays. AiPCBA's datasheet summary notes this device is qualified for medical use, supporting IEC 60601-1 system designs when paired with appropriate isolation and power architecture.
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推荐产品汇总
工程参考数据： 10AS066H2F34I2LG ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10AS066H2F34I1HG | 10AS066H2F34E2SG | 10AS066H2F34E2LG | 10AS066H1F34I1HG | 10AS066H2F34E1HG |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1152-FBGA (F34) 35x35 mm | 1152-FBGA (F34) 35x35 mm - same | 1152-FBGA (F34) 35x35 mm - same | 1152-FBGA (F34) 35x35 mm - same | 1152-FBGA (F34) 35x35 mm - same | 1152-FBGA (F34) 35x35 mm - same |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 |
| Speed Grade | -2 | -1 | -2 | -2 | -1 | -1 |
| Temperature Grade | Industrial (-40 C to +100 C) | Industrial | Extended | Extended | Industrial | Extended |
| Hard Processor System | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Lifecycle Status (2026) | Extended product support | Extended product support | Extended product support | Extended product support | Extended product support | Extended product support |
关键差异点
- Same F34 BGA footprint with higher speed grade （对比 10AS066H2F34I1HG)
- Industrial temperature grade for cost-sensitive designs （对比 10AS066H2F34E2SG)
- Full resource set at speed grade -2 for maximum throughput （对比 10AS066H2F34E1HG)
设计说明
The 1152-ball F34 FC-FBGA package with 1.0 mm ball pitch requires microvia or via-in-pad PCB technology for fan-out. Use a high-Tg (>=170 C) PCB material such as Megtron 6 or Rogers RO4350B for the transceiver regions to control insertion loss. Place all decoupling capacitors within 100 mils of their respective supply balls and use a power-plane stackup tuned for 0.9 V core current transients. Reference: Arria 10 PCB Design Guidelines in the device handbook.
Transceiver channels demand controlled-impedance (100 ohm differential) routing with length matching within 5 mil across lanes. Use Acorn or Saturn PCB footprints for transceiver breakouts to avoid impedance discontinuities at the BGA escape. For DDR3/DDR4 interfaces connected to the HPS, follow the Arria 10 External Memory Interface Handbook guidelines for fly-by topology, write leveling, and read deskew calibration.
The 35 mm x 35 mm F34 package dissipates between 10 W (idle) and 35 W (full fabric + transceivers + HPS). Attach a heat spreader or heatsink with thermal interface material rated for 0.1 C/W or lower. The exposed-die flip-chip BGA does not have an integrated lid, so case-to-ambient thermal resistance depends heavily on the heatsink and airflow. Estimate: at 25 W dissipation with a 1.0 C/W heatsink in still air, junction-to-ambient is approximately 4 C/W, yielding 100 C junction rise at 25 C ambient - within industrial limits but marginal.
Arria 10 is in Intel's extended-product support phase as of 2026-09-05, meaning new wafer starts are limited and most shipments come from distributor inventory. Designers committing to long production runs should negotiate last-time-buy commitments or qualify a migration path to Agilex 7 FPGAs before starting design. Note also that Quartus Prime Pro support for Arria 10 is in maintenance mode - new Quartus releases may add features for newer families but not for Arria 10.
Isolate the HPS and FPGA power domains on the PCB by using separate ferrite beads or filter networks on shared rails. This prevents high-current FPGA transients from coupling into the sensitive ARM Cortex-A9 core supply. Reference the Arria 10 Hardware Reference Manual for the power-tree diagram and recommended power-supply sequencing using a dedicated POR IC such as the LTC2934 or MAX34451.
合规信息
RoHS and lead-free confirmed per Altera/Intel product page. AEC-Q100 not applicable - this is a SoC FPGA, not an automotive-grade IC. Halogen-free status not explicitly stated in the verified data.
