10AX115U4F45I3SG - Arria 10 GX 1.15M LE FPGA | Intel / Altera
MPN: 10AX115U4F45I3SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12269.36 | $12,269.36 |
| 10 | $11000 | $110,000.00 |
| 100 | $9500 | $950,000.00 |
| 500 | $8200 | $4,100,000.00 |
| 1,000 | $7400 | $7,400,000.00 |
Drop-in alternatives for 10AX115U4F45I3SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX115U4F45I3LG
✅ Drop-In✓ In Stock
$5920 / Unit
View Datasheet →10AX115U4F45E3SG
✅ Drop-In✓ In Stock
$5200 / Unit
View Datasheet →10AX115S4F45I3LG
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$10000 / Unit
View Datasheet →10AX115U4F45E3LG
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$5650 / Unit
View Datasheet →10AX115U3F45I2SG
✅ Drop-In✓ In Stock
$7450 / Unit
View Datasheet →10AX115U4F45I3SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory | 68,857,560 bits (approximately 8.0 MBytes) |
| User I/O Count | 480 |
| Package | 1932-ball FC-FBGA (F45) |
| Process Node | 20 nm TSMC |
| Transceiver Count | Up to 24 channels |
| Transceiver Data Rate | Up to 17.4 Gbps |
| DSP Blocks (18x19 multipliers) | 1,518 |
| Speed/Temperature Grade | I3 (industrial, slowest speed grade) |
| Core Voltage | 0.9 V (nominal) |
| Hardened PCIe | PCIe Gen3 x1/x2/x4/x8 endpoint and rootport |
| Hardened Memory Controller | DDR4 up to 2,400 MT/s, DDR3, QDR IV |
| Operating Temperature Range | -40C to +100C (industrial) |
| Mounting Type | Surface Mount (SMT BGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
10AX115U4F45I3SG 1932-ball fc-fbga (f45) Pin Configuration Guide
Complete pinout information for 10AX115U4F45I3SG (1932-ball fc-fbga (f45) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115U4F45I3SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115U4F45I3SG is suitable for 6 applications: 4K/8K Video Broadcast Processing, 10G/40G Ethernet Aggregation Switch, PCIe Gen3 Accelerator Card, Software-Defined Radio (SDR) Baseband, Medical Imaging (CT/MRI Reconstruction), Test & Measurement Instrumentation.
4K/8K Video Broadcast Processing
The 10AX115U4F45I3SG's 1,150,000 logic elements with 1,518 DSP blocks deliver the parallel throughput required for real-time 4K/8K video encoding, decoding, and color-space conversion pipelines. Its DDR4 controller at 2,400 MT/s supplies the frame-buffer bandwidth needed to feed multiple HD-SDI, 12G-SDI, or DisplayPort 1.4 streams simultaneously without stalling the fabric. The 17.4 Gbps transceivers carry uncompressed 12G-SDI or SMPTE ST 2022/2059 video over coaxial cable. Placed at the heart of a broadcast frame-syn card, the FPGA processes 4 pixels per clock cycle across its DSP blocks, sustaining 60 fps 4K throughput.
Recommended
10G/40G Ethernet Aggregation Switch
The 10AX115U4F45I3SG integrates 24 transceivers at 17.4 Gbps, enabling four 10G Ethernet SFP+ uplinks or a single 40G QSFP uplink without external PHY silicon. Hardened 10/40/100G Ethernet MACs and Interlaken cores eliminate soft-logic overhead, freeing fabric resources for switching-table lookup, ACL filtering, and traffic management. The 480 user I/O pins drive multiple QSFP/SFP+ cages and management interfaces. Used as a top-of-rack or aggregation switch fabric, the device achieves line-rate 40G forwarding while dissipating ~25 W.
Recommended
PCIe Gen3 Accelerator Card
The 10AX115U4F45I3SG's hardened PCIe Gen3 x1/x2/x4/x8 endpoint IP block delivers deterministic latency for FPGA accelerator cards plugged into server PCIe slots. Up to 24 transceivers at 17.4 Gbps carry PCIe plus 10G Ethernet side channels for host-to-card control and streaming. The 1,150,000 LE fabric plus 1,518 DSP blocks implement custom accelerators for AI inference, financial simulation, genomics, or compression workloads that would otherwise starve general-purpose CPUs. Deployed as a half-height, half-length PCIe x8 card, the FPGA sustains 7.88 GB/s host bandwidth.
Recommended
Software-Defined Radio (SDR) Baseband
The 10AX115U4F45I3SG's 1,518 18x19 DSP blocks and floating-point hardened units perform baseband signal processing - FFTs, channelization, modulation/demodulation - across hundreds of MHz of instantaneous bandwidth. Transceivers operating at 17.4 Gbps accept digitized RF directly from high-speed ADCs, while the 480 user I/O connect to JESD204B/C converters and antenna interfaces. The industrial -40C to +100C operating range suits outdoor base-station enclosures. Used as the baseband engine in a multi-carrier LTE/5G small-cell, the FPGA sustains 4x4 MIMO processing on a single device.
Recommended
Medical Imaging (CT/MRI Reconstruction)
The 10AX115U4F45I3SG's 68,857,560 bits of embedded memory buffer raw sinogram or k-space data while the 1,518 DSP blocks execute back-projection, FDK, or iterative reconstruction in real time. Hardened DDR4 at 2,400 MT/s moves raw sensor data into the FPGA and reconstructed slices out to display storage. 17.4 Gbps transceivers link to multi-detector CT arrays. Placed inside a CT scanner reconstruction pipeline, the FPGA replaces legacy ASICs and delivers ~3x faster volume rendering with reduced dose exposure per patient.
Recommended
Test & Measurement Instrumentation
The 10AX115U4F45I3SG's combination of 480 user I/O, 17.4 Gbps transceivers, and high-density fabric suits high-end oscilloscopes, BERT testers, and protocol analyzers requiring real-time capture and analysis. PCIe Gen3 endpoint IP streams captured waveforms to host software at line rate, while the industrial temperature grade allows bench-to-floor deployment. Used as the digital engine inside a 100 Gbps BERT, the device achieves sub-100 ps trigger jitter across all measurement channels.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115U4F45I3SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115U4F45I3LG | 10AX115U4F45E3SG | 10AX115S4F45I3LG | 10AX115U4F45E3LG | 10AX115U3F45I2SG |
|---|---|---|---|---|---|---|
| Package | 1932-ball FC-FBGA (F45) | 1932-ball FC-FBGA (F45) - same | 1932-ball FC-FBGA (F45) - same | 1932-ball FC-FBGA (F45) - same | 1932-ball FC-FBGA (F45) - same | 1932-ball FC-FBGA (F45) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Embedded Memory | 68,857,560 bits | 68,857,560 bits | 68,857,560 bits | 68,857,560 bits | 68,857,560 bits | 68,857,560 bits |
| User I/O | 480 | 480 | 480 | 480 | 480 | 480 |
| Transceiver Tier | U4 (up to 24 ch @ 17.4 Gbps) | U4 (24 ch) | U4 (24 ch) | S4 (fewer SERDES) | U4 (24 ch) | U3 (fewer SERDES than U4) |
| Speed/Temperature Grade | I3 (industrial, slowest) | I3 (industrial) | E3 (commercial) | I3 (industrial) | E3 (commercial) | I2 (industrial, faster) |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C | 0C to +100C | -40C to +100C | 0C to +100C | -40C to +100C |
| Packaging Form | Tray | Tape and Reel | Tray | Tape and Reel | Tape and Reel | Tray |
| 1-Unit Price (USD) | 12,269.36 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest transceiver density at the -U4 tier within the Arria 10 family (vs 10AX115S4F45I3LG)
- Industrial -40C to +100C operating range in the same footprint (vs 10AX115U4F45E3SG)
- Hardened PCIe Gen3 x8 IP eliminates soft-logic latency (vs 10AX115U3F45I2SG)
Design Notes
The 1932-ball FC-FBGA at 1.0 mm ball pitch requires an HDI PCB stack-up with microvias, ENIG or ENEPIG surface finish, and at least 12 layers to escape the dense BGA pattern. Per the Arria 10 pin connection guidelines, every transceiver lane ball must have a continuous ground reference plane on the adjacent layer to control impedance. Estimate: signal-via stub length should stay below 0.15 mm to avoid resonance above 10 GHz. Decoupling capacitors must be placed directly under the BGA using land-side mounted (LdSM) or via-in-pad construction.
The Arria 10 GX can dissipate 20-30 W under typical transceiver + DDR4 + fabric workloads. A heatsink with thermal interface material (TIM) and at least 200 LFM airflow is required for industrial -40C to +100C operation. Estimated: at 25 W dissipation with a 0.5 C/W heatsink-to-ambient thermal resistance, junction-to-ambient theta_JA of approximately 1.0 C/W yields ~25C temperature rise. Verify using the Intel PowerPlay Early Power Estimator (EPE) and Quartus Prime thermal models.
Core rails (0.9 V) require low-impedance power distribution with bulk decoupling within 50 mm of the BGA and high-frequency MLCC capacitors in land-side mounted configuration. Transceiver rails (1.0 V, 1.2 V) need ferrite bead isolation from noisy digital rails. Sequence the rails per the Arria 10 POR (power-on-reset) sequence specified in the datasheet to avoid latch-up; failure to sequence correctly can cause permanent damage. Use a multi-rail PMIC such as a TI TPS65086 or LTM4644 for clean startup.
17.4 Gbps transceiver channels demand loss budgeting below 8 dB at the Nyquist frequency with controlled crosstalk. Use 100-ohm differential stripline or microstrip with skew below 5 ps per pair. AC-coupling capacitors for SERDES lanes must be placed within 4 mm of the FPGA balls with reference planes undisturbed. Estimate: at 17.4 Gbps using FR-4 with Dk=4.2, signal loss is approximately 0.6 dB/inch at 8.7 GHz, requiring Megtron-6 or equivalent low-loss material for longer traces.
Common pitfalls: (1) omitting JTAG pull-ups on TCK/TMS/TDO/TDI which prevents configuration download; (2) failing to install a 0.1 uF cap on every VCCINT pin, leading to supply noise; (3) using non-HDI PCB construction, causing BGA solder joint defects; (4) selecting the wrong speed grade (e.g., -E3 commercial vs -I3 industrial) for harsh environments; (5) underestimating the configuration time for 1.15M LE designs - use a fast config device such as EPCQ-L256 or dual EPCQ for compressed bitstreams.
Compliance Information
RoHS and lead-free per Intel Altera product page. AEC-Q100 not applicable for FPGAs (this is not an automotive qualified part). For automotive applications, contact Intel about Cyclone V or Arria 10 Auto variants.
