10CX150YF780E6G - Cyclone 10 GX FPGA 150K LE, 780-FCBGA | Intel
料号： 10CX150YF780E6G ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $720 | $720.00 |
| 10 | $695 | $6,950.00 |
| 100 | $660 | $66,000.00 |
| 500 | $615 | $307,500.00 |
| 1,000 | $575 | $575,000.00 |
10CX150YF780E6G 概述
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, DSP blocks, and memory controllers. FPGAs sit within the broader taxonomy of programmable logic devices (PLD) and bridge the gap between fixed-function ASICs and software-driven processors, offering hardware-level parallelism with reconfigurable logic. Cyclone 10 GX specifically targets high-volume, cost-sensitive applications that require transceiver connectivity, hardened memory controllers, and moderate DSP throughput.
The 10CX150YF780E6G delivers key features including up to 12.5 Gbps GX transceivers, hardware PCI Express Gen2 hard IP blocks, variable-precision DSP blocks for fixed- and floating-point arithmetic, and support for external memory interfaces including DDR3, DDR4, LPDDR3, and QDR II+ with dedicated hard PHY. The device integrates 1.6 GHz ARM Cortex-A9-class hard processor system support through soft IP and offers on-chip voltage regulation for core and I/O rails.
Architecturally, the Cyclone 10 GX uses a 20nm TSMC process with adaptive logic modules (ALMs) and a multi-tier routing fabric. Each ALM contains eight fracturable look-up tables (LUTs) and dedicated adders, while MLAB memory blocks can be configured as either dual-port RAM or shift registers. Transceiver channels support protocols such as PCIe Gen2 x4, 10GbE KR, CPRI, and JESD204B without external PHY silicon.
Typical applications include industrial machine vision cameras, broadcast video processing, low-density wireless backhaul, factory automation controllers, and cost-optimized PCIe acceleration cards. The combination of transceivers and DSP makes the 10CX150YF780E6G especially suited to video bridging, protocol bridging, and sensor aggregation designs.
When designing with this part, allocate sufficient PCB area for FCBGA breakout and route high-speed transceiver channels with controlled impedance. Use Intel Quartus Prime software for synthesis and place-and-route, and validate timing closure before tape-out. The -E6G speed grade targets the fastest commercial timing, so thermal management must keep junction temperature within Intel-recommended limits.
This page synthesizes Intel Cyclone 10 GX datasheet parameters, distributor pricing as of 2026-09-05, drop-in alternative FPGAs from the same Intel family, and practical design notes not found in the standalone datasheet PDF.
直接替换替代料： 10CX150YF780E6G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10CX150YF780E6G （相同外形与封装尺寸） ——差异在于 Package, Transceivers, Mounting Type, Operating Temperature, Speed Grade.
快速对比工具——选择替代料号进行并排对比：
10CX150YF780E5G
✅ 直接替换✓ 有现货
$160 / 个
查看数据手册 →10CX105YF780E6G
✅ 直接替换✓ 有现货
$580 / 个
查看数据手册 →10CX105YF780E5G
✅ 直接替换✓ 有现货
$350 / 个
查看数据手册 →10CX150YF780E6G 最大额定值与电气特性
| Series | Cyclone 10 GX |
| Family | Cyclone 10 GX |
| Process Technology | 20 nm |
| Logic Elements (LE) | 150,000 |
| Adaptive Logic Modules (ALM) | 56,480 |
| Embedded Memory | 10,907,648 bits (approximately 10.9 Mbit) |
| User I/O Pins | 284 |
| 封装 | 780-ball FCBGA |
| Speed Grade | -6 (E6G industrial fast) |
| 工作温度 | -40C to +100C (Industrial) |
| Transceivers | GX up to 12.5 Gbps |
| PCIe Hard IP | PCI Express Gen2 x4 hard IP |
| DSP Blocks | Variable-precision, fixed/floating point |
| Memory Interfaces | DDR3, DDR4, LPDDR3, QDR II+ |
| 安装类型 | Surface Mount (FCBGA) |
| RoHS 状态 | Compliant |
| Lead-Free | Yes |
10CX150YF780E6G 780-ball fcbga 引脚配置指南
10CX150YF780E6G（780-ball fcbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10CX150YF780E6G.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10CX150YF780E6G 适用于 6 应用s: Industrial Machine Vision Camera Processing, Broadcast Video Bridge and Processing, PCIe Gen2 Acceleration Card, Factory Automation Controller, Wireless Backhaul Low-Density Modem, Sensor Aggregation Hub.
Industrial Machine Vision Camera Processing
The 10CX150YF780E6G is well suited for industrial machine vision cameras because it combines 150K logic elements with up to 12.5 Gbps GX transceivers and PCIe Gen2 hard IP. Vision pipelines typically need parallel pixel processing at 60-120 fps, which the variable-precision DSP blocks handle efficiently. Compared with a CPU-based vision system, this FPGA reduces latency by 5-10x and keeps the 780-FCBGA footprint compact enough for camera-head PCBs while supporting -40C to +100C industrial operation.
推荐
Broadcast Video Bridge and Processing
The 10CX150YF780E6G fits broadcast video bridge applications by providing sufficient logic (150K LE) and 10.9 Mbits of embedded memory to buffer HD/4K frames in real time. The transceiver channels at 12.5 Gbps support SMPTE ST 425 / ST 2081 / ST 2082 coaxial interfaces when paired with external SDI PHY. The DDR4 memory controller hard IP allows high-bandwidth frame store with minimal soft logic overhead, making it a strong fit for broadcast routers and up/down/cross converters.
推荐
PCIe Gen2 Acceleration Card
The 10CX150YF780E6G includes a hard PCI Express Gen2 x4 IP block that reduces soft-logic utilization by approximately 15K LEs compared to soft PCIe implementations. For a low-density acceleration card targeting 2-4 Gbps host link, this FPGA delivers deterministic latency under 200 ns while freeing DSP blocks for actual workload acceleration. Industrial temperature grade (-40C to +100C) suits edge-server and ruggedized deployments.
推荐
Factory Automation Controller
In factory automation, the 10CX150YF780E6G aggregates sensor data from EtherCAT, PROFINET, or Modbus TCP industrial Ethernet links. Its 284 user I/O pins accommodate multiple isolated GPIO plus serial interfaces, while the 12.5 Gbps transceivers handle high-speed backplane or point-to-point links between controllers. The industrial -40C to +100C temperature range and 780-FCBGA package suit sealed control cabinet environments.
推荐
Wireless Backhaul Low-Density Modem
The 10CX150YF780E6G supports low-density wireless backhaul modems where CPRI or JESD204B links are paired with moderate DSP for baseband processing. The 12.5 Gbps transceivers comfortably carry CPRI option 3-5 rates, while variable-precision DSP blocks implement FFT, channel estimation, and FEC. The compact 780-FCBGA enables integration into small-form-factor radio units, and the industrial temperature grade handles outdoor cabinet deployments.
推荐
Sensor Aggregation Hub
The 10CX150YF780E6G works as a sensor aggregation hub for multi-modal sensor systems, combining 150K LEs for stream multiplexing, 284 I/O pins for multi-sensor attachment, and 12.5 Gbps transceivers for high-speed uplink to a host processor. Variable-precision DSP blocks handle sensor pre-processing such as noise filtering and feature extraction, while the DDR4 interface acts as a high-bandwidth buffer between aggregated streams and the host. The industrial temperature range supports harsh-environment deployments.
推荐
推荐产品汇总
工程参考数据： 10CX150YF780E6G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10CX150YF780E5G | 10CX105YF780E6G | 10CX105YF780E5G |
|---|---|---|---|---|
| Package | 780-ball FCBGA | 780-ball FCBGA | 780-ball FCBGA | 780-ball FCBGA |
| Brand | Intel | Intel | Intel | Intel |
| Series | Cyclone 10 GX | Cyclone 10 GX | Cyclone 10 GX | Cyclone 10 GX |
| Logic Elements | 150,000 | 150,000 | 105,000 | 105,000 |
| Speed Grade | -6 (E6G) | -5 (E5G) | -6 (E6G) | -5 (E5G) |
| User I/O Pins | 284 | 284 | 284 | 284 |
| Embedded Memory | 10.9 Mbit | 10.9 Mbit | 7.6 Mbit | 7.6 Mbit |
| Transceiver Speed | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps |
| Operating Temperature | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C |
关键差异点
- Highest LE density in Cyclone 10 GX 780-FCBGA family （对比 10CX105YF780E6G)
- Fastest commercial speed grade in the same footprint （对比 10CX150YF780E5G)
- Integrated 12.5 Gbps transceivers and PCIe Gen2 hard IP （对比 10CL120YF780I7G)
设计说明
Estimated: At full transceiver utilization (12.5 Gbps x 6 channels) plus 80% logic utilization, the 10CX150YF780E6G can dissipate 6-8 W. The 780-FCBGA package requires a thermal via array under the central die pad and at least 4 signal layers with stitched ground pour. For ambient temperatures above 70C, add forced airflow of at least 200 LFM to keep junction temperature below 100C, since the industrial-grade part is rated to +100C Tj.
The 780-ball FCBGA package uses 1.0 mm ball pitch; route signals on inner layers with 4-mil trace/space rules. Place decoupling capacitors on the top layer within 100 mils of the power balls: 0.1 uF and 10 uF combinations per power rail. Use Intel's Cyclone 10 GX pin connection guidelines for ball map and bank voltage assignments. High-speed transceiver channels require matched-length routing within 5 mil tolerance and ground shielding.
For 12.5 Gbps GX transceiver channels, use a 100-ohm differential impedance stackup with Megtron 6 or similar low-loss dielectric. Reference the Intel Cyclone 10 GX transceiver user guide for pre-emphasis and equalization settings. Place external AC-coupling capacitors within 250 mils of the transmitter ball pair and avoid any layer transitions on the channel path. Perform 3D EM simulation on breakout via structures to optimize return loss.
合规信息
RoHS and lead-free compliant per Intel product page. Not AEC-Q100 qualified - this is an industrial-grade FPGA, not an automotive-qualified part. Halogen-free status not explicitly stated in verified data.
