Intel

10CX220YF780E5G - Cyclone 10 GX 220K LE FPGA | Intel | F780

Teilenummer: 10CX220YF780E5G ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
780-ball FCBGA (F780), 29 mm x 29 mm Package 5 (commercial, fast) Speed 13,752,320 Memory
Ab $615 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-09-05
Mengenpreise
Menge Stückpreis Gesamt
1 $850 $850,00
10 $790 $7.900,00
100 $720 $72.000,00
250 $685 $171.250,00
500 $650 $325.000,00
1.000 $615 $615.000,00
ℹ️ Alle Preise sind in USD

10CX220YF780E5G Übersicht

The Intel / Altera 10CX220YF780E5G is a Cyclone 10 GX field-programmable gate array (FPGA) with 220,000 logic elements, 13,752,320 bits of embedded memory, and 284 user I/O pins, fabricated on a 20 nm process and housed in a 780-ball flip-chip BGA (FCBGA / F780) package. It targets cost- and power-sensitive applications that still require high-throughput transceivers and DSP resources. As a member of the Cyclone 10 GX family, it is the lowest-density entry in the family but retains the same transceiver-rich architecture used in mid-range Cyclone 10 GX devices.

An FPGA is a reconfigurable digital integrated circuit that allows designers to implement arbitrary logic, DSP, memory, and high-speed serial interfaces by programming look-up tables, routing, and hardened IP blocks. The Cyclone 10 GX family sits in the Intel FPGA hierarchy below Arria 10 and Stratix 10, optimized for mid-range transceiver-rich designs such as industrial vision, broadcast, machine vision, and motor control. The 10CX220YF780E5G integrates transceivers that operate up to 12.5 Gbps, hardened PCI Express Gen2/Gen3 controllers, hardened memory controllers, and variable-precision DSP blocks.

Key features of the 10CX220YF780E5G include up to 12.5 Gbps transceiver data rates, integrated PCI Express Gen3 x4 hard IP, 156 18x19 multipliers for DSP, partial reconfiguration support, and a hardened memory controller subsystem supporting DDR3/DDR4/LPDDR3 external memory. Security features include bitstream encryption using AES-256, JTAG, and configuration via serial flash. The device supports both commercial (0C to 85C) and industrial (-40C to 100C) temperature grades; the E5G suffix denotes the commercial speed grade 5.

The 10CX220YF780E5G is typically deployed in industrial machine vision frame grabbers, broadcast video processing (SDI/HDMI bridges), motor control and drives, low-cost 10G Ethernet aggregation, and PCI Express add-in cards. Its combination of transceivers, DSP, and low power makes it well suited for cost-constrained designs that previously required mid-range FPGAs. Compared with the older Cyclone V and Cyclone IV families, the 10CX220YF780E5G offers up to 2x higher transceiver bandwidth and significantly higher logic density at comparable power.

When designing with this device, ensure Quartus Prime software support matches the device speed grade, plan power sequencing for the multiple supply rails (core, transceiver, I/O, auxiliary), and provide matched-impedance routing for high-speed serial links. The F780 package has a 29 mm x 29 mm body and requires a multilayer PCB with microvia or via-in-pad technology for reliable assembly.

Drop-in-Alternativen für 10CX220YF780E5G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit 10CX220YF780E5G (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Embedded Memory (bits), Logic Elements, Operating Temperature.

Intel
Package: 780-ball FCBGA (F780)
Speed Grade: 5
Embedded Memory (bits): 8,641,536 (8.439 Mbit)
Vergleichen mit 10CX220YF780E5G →
Intel
Package: 780-BBGA, FCBGA
Speed Grade: -5 (E5G)
Embedded Memory (bits): 10,907,648
Vergleichen mit 10CX220YF780E5G →
Intel
Package: 780-ball FCBGA (F780), 29 mm x 29 mm, 1.0 mm pitch
Vergleichen mit 10CX220YF780E5G →
Intel
Package: 780-BBGA, FCBGA (F780)
Speed Grade: 5 (industrial)
Embedded Memory (bits): 13,752,320
Vergleichen mit 10CX220YF780E5G →
Intel
Package: 780-FBGA (FCBGA), 29x29 mm
Embedded Memory (bits): 13,752,320
Operating Temperature: -40C to +100C (Industrial)
Vergleichen mit 10CX220YF780E5G →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

10CX220YF780I5G

✅ Drop-In
Intel
📦 780-ball FCBGA (F780)
Cyclone 10 GX · 220,000 · 13,752,320 · 284 (variable-precision) · 284 · Up to 12 channels at up to 12.5 Gbps · PCIe Gen2 hard IP, hard memory controllers · 20 nm

✓ Auf Lager

$1995 / Stück

Datenblatt ansehen →

10CX220YF780E6G

✅ Drop-In
Intel
📦 780-ball FCBGA (F780)
Cyclone 10 GX · 20 nm · 220,000 · 13,752,320 bits (~1.64 MBytes) · 284 · Up to 12 channels, up to 12.5 Gbps · PCIe Gen2 x4 (hard IP) · 780-ball FCBGA (F780), 29 mm x 29 mm, 1.0 mm pitch

✓ Auf Lager

$1720 / Stück

Datenblatt ansehen →

10CX220YF780I6G

✅ Drop-In
Intel
📦 780-ball FCBGA (F780)
Cyclone 10 GX · 220,000 · 13,752,320 · 284 · 780-FBGA (FCBGA), 29x29 mm · 156

✓ Auf Lager

$121.83 / Stück

Datenblatt ansehen →

10CX220YF780E7G

✅ Drop-In
📦 780-ball FCBGA (F780)
same F780 package and 220K LE, slowest speed grade 7 vs grade 5

📋 Referenzalternative (nicht im Katalog)

10CX150YF780E5G

✅ Drop-In
Intel
📦 780-ball FCBGA (F780)
Cyclone 10 GX · 150,000 · 10,907,648 · 284 · 780-BBGA, FCBGA · -5 (E5G) · 0C to +85C (Commercial) · 20 nm

✓ Auf Lager

$160 / Stück

Datenblatt ansehen →

10CX105YF780E5G

✅ Drop-In ⚠️ Spezifikationen ungeprüft
Intel
📦 780-ball FCBGA (F780)
Cyclone 10 GX · 105,000 · 38,000 · 8,641,536 (8.439 Mbit) · 284 · 104,000 · 20 nm · 780-ball FCBGA (F780)

✓ Auf Lager

$350 / Stück

Datenblatt ansehen →

10CX220YF780E5G Grenzwerte & elektrische Eigenschaften

Family Cyclone 10 GX
Logic Elements 220,000
Embedded Memory Bits 13,752,320
18x19 Multipliers 156
User I/O Pins 284
Transceiver Max Data Rate 12.5 Gbps
Hard Memory Controllers Yes (DDR3 / DDR4 / LPDDR3)
PCI Express Hard IP PCIe Gen3 x4
Process Technology 20 nm
Gehäuse 780-ball FCBGA (F780), 29 mm x 29 mm
Speed Grade 5 (commercial, fast)
Temperature Grade E (0C to +85C, commercial)
Configuration Method Serial / Parallel flash, JTAG, AES-256 bitstream encryption
RoHS-Status Compliant

10CX220YF780E5G 780-ball fcbga (f780), 29 mm x 29 mm Pinbelegungsleitfaden

Pinbelegung für 10CX220YF780E5G (780-ball fcbga (f780), 29 mm x 29 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für 10CX220YF780E5G im 780-ball fcbga (f780), 29 mm x 29 mm-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für 10CX220YF780E5G.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

10CX220YF780E5G ist geeignet für 6 Anwendungs: Industrial Machine Vision Frame Grabber, Broadcast Video Processing (SDI / HDMI Bridges), PCI Express Add-in Card / Industrial I/O Board, Motor Control and Industrial Drive, Low-Cost 10 Gigabit Ethernet Aggregation, Test & Measurement Instrumentation Front-End.

🏭

Industrial Machine Vision Frame Grabber

The 10CX220YF780E5G suits machine vision frame grabbers where 220K logic elements accommodate CoaXPress, GigE Vision, or Camera Link aggregation pipelines, and the 12.5 Gbps transceivers carry serialized sensor data with low deterministic latency. Its hardened PCIe Gen3 x4 IP enables direct plug-in to host PCs at line rates above 3 GB/s, while the embedded memory (13.75 Mbits) provides line buffers for image preprocessing. The 284 user I/O pins expose multiple parallel sensor interfaces, GPIO for trigger and strobe lines, and DDR3/DDR4 controller outputs for high-capacity frame storage, all within the same F780 package footprint.

📺

Broadcast Video Processing (SDI / HDMI Bridges)

For broadcast video routers and SDI-to-HDMI bridges, the 10CX220YF780E5G delivers up to 12.5 Gbps per lane to handle 12G-SDI and UHD HDMI 2.0 streams. Its 156 18x19 multipliers provide ample DSP capacity for color space conversion, scaling, and frame-rate conversion, while the hardened DDR4 controller maintains smooth buffering of 4K video. The commercial temperature grade (0C to 85C) and BGA package suit controlled-environment broadcast head-end equipment, and Quartus Prime IP cores simplify integration of SMPTE ST 2082 and HDMI transport layers.

🖥️

PCI Express Add-in Card / Industrial I/O Board

The 10CX220YF780E5G's integrated PCIe Gen3 x4 hard IP enables cost-effective PCIe add-in cards for data acquisition, FPGA co-processing, and protocol offload. Its 220K LEs handle user logic, DMA engines, and protocol stacks such as 10 Gigabit Ethernet or CAN-FD aggregation, while the 12.5 Gbps transceivers support external SFP+ or QSFP modules. The F780 package's 284 user I/O pins route directly to high-density mezzanine connectors, and partial reconfiguration allows in-field firmware updates without disrupting PCIe link state.

🏭

Motor Control and Industrial Drive

Industrial servo drives and high-end motor controllers leverage the 10CX220YF780E5G's combination of fast transceivers for EtherCAT or SERCOS III fieldbuses, DSP blocks for field-oriented control (FOC) algorithms, and 284 I/O pins for encoder, resolver, and power-stage feedback. Hardened PCIe Gen3 simplifies integration with industrial PC controllers, while the commercial temperature range suits enclosed cabinet installations. Quartus Prime DSP Builder accelerates development of high-bandwidth current and torque loops running at sub-microsecond intervals.

🌐

Low-Cost 10 Gigabit Ethernet Aggregation

For top-of-rack or industrial aggregation switches, the 10CX220YF780E5G's transceivers natively support 10GBASE-R (10 Gigabit Ethernet), and its 220K LEs plus 13.75 Mbits of embedded memory handle MAC, PCS, and basic L2 switching. The hardened DDR4 controller supports large packet buffers, while PCIe Gen3 x4 uplinks to a host CPU or switch fabric ASIC. Compared with full ASIC solutions, this FPGA-based approach accelerates time-to-market for custom aggregation features and protocol extensions.

🔧

Test & Measurement Instrumentation Front-End

Test instruments such as protocol analyzers, BERT testers, and high-speed logic analyzers benefit from the 10CX220YF780E5G's reconfigurable logic and multi-gigabit transceivers. Engineers can implement custom serial protocol decoders (PCIe, USB 3.0, SATA) or parallel pattern generation using the FPGA's DSP and memory resources. The 284 user I/O pins expose dedicated probe interfaces, while the F780 BGA package with 1.0 mm pitch supports fine-pitch PCB layouts typical of high-bandwidth instrumentation front-ends.

Zusammenfassung der empfohlenen Produkte

10CL120YF780I7G Intel Verwendet in: Industrial Machine Vision Frame Grabber, Motor Control and Industrial Drive MT41K256M16 Micron Technology Verwendet in: Industrial Machine Vision Frame Grabber DS90UB960 FPD-Link III deserializer aggregator Verwendet in: Industrial Machine Vision Frame Grabber 10CX150YF780E5G Intel Verwendet in: Broadcast Video Processing (SDI / HDMI Bridges) MT40A512M16 DDR4 SDRAM for video line buffer Verwendet in: Broadcast Video Processing (SDI / HDMI Bridges) M23428G-33 12G-SDI adaptive cable equalizer Verwendet in: Broadcast Video Processing (SDI / HDMI Bridges) 10CX220YF672E5G Intel Verwendet in: PCI Express Add-in Card / Industrial I/O Board PEX8714 PCIe Gen3 switch for fan-out topologies Verwendet in: PCI Express Add-in Card / Industrial I/O Board FTLF8519P3BTL SFP+ transceiver for 10G optical links Verwendet in: PCI Express Add-in Card / Industrial I/O Board AD2S1210 Resolver-to-digital converter Verwendet in: Motor Control and Industrial Drive EtherCAT ET1100 EtherCAT slave controller ASIC Verwendet in: Motor Control and Industrial Drive 10CX220YF672I5G Altera Verwendet in: Low-Cost 10 Gigabit Ethernet Aggregation 88X3310 Marvell 10G Ethernet PHY Verwendet in: Low-Cost 10 Gigabit Ethernet Aggregation MT41K512M16 DDR3L packet buffer memory Verwendet in: Low-Cost 10 Gigabit Ethernet Aggregation 10CX150YF780I5G Intel Verwendet in: Test & Measurement Instrumentation Front-End ADC12DJ3200 High-speed ADC for digitizer front-end Verwendet in: Test & Measurement Instrumentation Front-End Si5341 Low-jitter clock generator Verwendet in: Test & Measurement Instrumentation Front-End
What is the logic element count of the 10CX220YF780E5G?
The 10CX220YF780E5G contains 220,000 logic elements (LEs), 13,752,320 bits of embedded memory, and 156 18x19 multipliers according to the DigiKey listing and Altera Cyclone 10 GX datasheet family. It is the lowest-density device in the Cyclone 10 GX family, designed for cost-sensitive transceiver-rich applications. The F780 package exposes 284 user I/O pins, providing ample connectivity for parallel sensor and memory interfaces.
What transceiver speed does the 10CX220YF780E5G support?
The 10CX220YF780E5G integrates hard transceiver channels that support data rates up to 12.5 Gbps, suitable for PCI Express Gen3, 10 Gigabit Ethernet, CPRI, SATA, and Serial RapidIO. According to the Cyclone 10 GX family datasheet, these transceivers are hardened in the silicon and consume substantially less power than soft SERDES implementations. This makes the 10CX220YF780E5G attractive for cost-optimized 10G interfaces.
Does the 10CX220YF780E5G support DDR4 memory?
Yes, the 10CX220YF780E5G includes a hardened external memory interface subsystem that supports DDR3, DDR4, and LPDDR3 memories. Per Intel's Cyclone 10 GX device overview, the hard memory controller reduces logic utilization and simplifies timing closure compared to soft controllers. Designers must still use the External Memory Interface (EMIF) IP in Quartus Prime to configure the controller for the chosen memory topology.
What is the difference between 10CX220YF780E5G and 10CX220YF780I5G?
The 10CX220YF780E5G is the commercial temperature grade (0C to 85C), while the 10CX220YF780I5G is the industrial grade (-40C to 100C). Both parts share the same F780 FCBGA package, 220K LE count, and speed grade 5. According to the Altera ordering information, the only difference is the operating temperature range; pricing differs but pin compatibility is preserved.
Where can I buy the 10CX220YF780E5G and what is the price?
The 10CX220YF780E5G is available from authorized distributors including DigiKey, Mouser, Arrow, and Octopart-listed suppliers, as of 2026-09-05. Unit pricing for low quantities is approximately $850, dropping to roughly $615 per unit at 1000-piece volumes. Lead time varies by distributor and lot availability; Intel recommends checking stock with authorized channels for production builds.
What is the lead time for the 10CX220YF780E5G?
As of 2026-09-05, DigiKey shows the 10CX220YF780E5G ships same-day from in-stock inventory at certain volume points, while higher volumes require factory order with typical 8-12 week lead time from Intel. Mouser and Arrow listings indicate similar distributor stock. For production runs, contact an authorized Intel distributor or the Intel FPGA direct sales channel to confirm current lead times.
Is the 10CX220YF780E5G in stock at major distributors?
According to DigiKey's product page (snapshotted 2026-09-05), the 10CX220YF780E5G has limited in-stock quantity at low unit volumes; higher quantities require quote. Mouser and Arrow listings also reflect constrained supply typical for industrial FPGAs. For long-term production, register the part on an Intel supply assurance program to guarantee allocation.
10CX220YF780E5G vs 10CX150YF780E5G - which is better for high-density logic?
The 10CX220YF780E5G provides 220,000 logic elements, while the 10CX150YF780E5G provides 150,000 logic elements. Both share the same F780 package, transceiver count, and DSP architecture. According to Intel's ordering information, the 10CX220YF780E5G is the better choice when more logic and memory resources are needed; the 10CX150YF780E5G offers cost savings for designs that fit within 150K LEs.
10CX220YF780E5G vs 10CX105YF780E5G - which is better for low-power designs?
The 10CX220YF780E5G (220K LE) consumes more static and dynamic power than the 10CX105YF780E5G (105K LE) due to higher logic density. For low-power applications where logic utilization fits in 105K LEs, the 10CX105YF780E5G is the better choice; both share the F780 package and identical transceiver capability. Per Cyclone 10 GX power estimation guidance, power scales roughly with logic usage.
When should I choose 10CX220YF780E5G over 10CL120YF780I7G?
The 10CX220YF780E5G (Cyclone 10 GX) is the correct choice when 12.5 Gbps transceivers and PCI Express Gen3 hard IP are required. The 10CL120YF780I7G (Cyclone 10 LP) lacks high-speed transceivers and uses a different architecture targeting low-power, transceiver-free applications. Per Intel's family comparison, Cyclone 10 GX bridges the gap between Cyclone 10 LP and Arria 10.
What is the best drop-in replacement for the 10CX220YF780E5G?
The best drop-in same-package replacement is 10CX220YF780I5G (industrial temperature grade), which shares the F780 FCBGA footprint, 220K LE count, and speed grade 5. According to the Cyclone 10 GX ordering information, only the temperature grade differs, enabling true pin-to-pin substitution with minor firmware reconfiguration. Higher-grade 10CX220YF672E5G or 10CX220YF672I5G parts use a smaller F672 package, requiring PCB rework.
Where can I download the 10CX220YF780E5G datasheet PDF?
The official 10CX220YF780E5G datasheet can be downloaded from Intel's Cyclone 10 GX device documentation page at intel.com (https://www.intel.com/content/www/us/en/docs/programmable/683473/current/cyclone-10-gx-device-overview.html). Datasheet PDFs are also mirrored on distributor sites such as DigiKey and Mouser, but Intel's documentation should be treated as the authoritative source for specification values.
Where can I find the 10CX220YF780E5G pinout and ball map?
The 10CX220YF780E5G F780 pinout is published by Intel in three formats (PDF, XLS, TXT) on the Pin-Out Files for Altera FPGAs page (altera.com/design/devices/resources/pinouts). The F780 is a 29 mm x 29 mm flip-chip BGA with 780 balls in a 1.0 mm pitch grid, requiring microvia PCB technology for reliable assembly. Quartus Prime pin planner tool also exports the full ball map for the selected package.
What software is required to program the 10CX220YF780E5G?
The 10CX220YF780E5G is programmed using Intel Quartus Prime design software. Quartus Prime Lite Edition (free) supports Cyclone 10 GX devices and includes the Qsys platform designer for IP integration. For production bitstream generation, designers use the Quartus Prime Programmer tool with an Intel FPGA download cable (USB-Blaster II or compatible) over JTAG or via serial configuration flash.
Is the 10CX220YF780E5G RoHS compliant and lead-free?
Yes, the 10CX220YF780E5G is RoHS compliant and lead-free per Intel's Cyclone 10 GX material composition declarations. According to the manufacturer's environmental compliance information, the F780 package uses lead-free BGA balls and is suitable for Pb-free reflow assembly processes. Halogen-free status and REACH compliance should be verified against the latest Intel product declaration documents.

Technische Referenzdaten für 10CX220YF780E5G – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the 10CX220YF780E5G when your design requires 12.5 Gbps transceivers and PCIe Gen3 x4 hard IP within 220,000 logic elements and you can accept the commercial 0C-85C temperature range. Select 10CX220YF780I5G for industrial temperature deployments in the same F780 footprint. Choose 10CX220YF780E6G or E7G if your timing can close at slower speed grades - this reduces dynamic power. For designs that fit in 150K LE, select the 10CX150YF780E5G to save cost. Use 10CX220YF672E5G only if you can accommodate the smaller F672 PCB footprint - it is NOT a drop-in replacement for F780. All listed alternatives share the F780 BGA package, enabling PCB layout reuse across the 220K and 150K Cyclone 10 GX variants.

Vergleich mit Alternativen

Parameter Dieses Produkt 10CX220YF780I5G 10CX220YF780E6G 10CX220YF780I6G 10CX220YF780E7G 10CX150YF780E5G
Brand Intel Intel Intel Intel Intel Intel
Package 780-ball FCBGA (F780), 29 x 29 mm 780-ball FCBGA (F780) - same 780-ball FCBGA (F780) - same 780-ball FCBGA (F780) - same 780-ball FCBGA (F780) - same 780-ball FCBGA (F780) - same
Logic Elements 220,000 220,000 220,000 220,000 220,000 150,000 (-32%)
Speed Grade 5 (fastest) 5 (fastest) 6 (slower) 6 (slower) 7 (slowest) 5 (fastest)
Temperature Grade E (Commercial 0C to 85C) I (Industrial -40C to 100C) E (Commercial) I (Industrial) E (Commercial) E (Commercial)
Embedded Memory Bits 13,752,320 13,752,320 13,752,320 13,752,320 13,752,320 9,500,000 approx (-31%)
Transceiver Max Data Rate 12.5 Gbps 12.5 Gbps 12.5 Gbps 12.5 Gbps 12.5 Gbps 12.5 Gbps
PCI Express Hard IP Gen3 x4 Gen3 x4 Gen3 x4 Gen3 x4 Gen3 x4 Gen3 x4
User I/O Pins 284 284 284 284 284 284

Wichtigste Unterscheidungsmerkmale

  • Industrial temperature grade variant available in same package (vs. 10CX220YF780I5G)
  • Slowest speed grade option for power-constrained designs (vs. 10CX220YF780E7G)
  • Higher-density logic in same F780 package (vs. 10CX150YF780E5G)
  • Integrated 12.5 Gbps transceivers absent in Cyclone 10 LP family (vs. 10CL120YF780I7G)

Designhinweise

The 10CX220YF780E5G requires multiple power rails (core, transceiver PLLs, transceiver channels, I/O banks, auxiliary). Per Intel's Cyclone 10 GX power management user guide, designers must sequence the rails in the order specified to avoid latch-up. Typical core current at full utilization is approximately 3-5 A and a high-efficiency buck regulator with remote sensing is recommended. The transceiver supply (VCCR_GXB / VCCT_GXB) is sensitive to noise - place ferrite beads and bulk capacitors within 1 cm of the package balls.

In dense transceiver-rich designs, the 10CX220YF780E5G can dissipate 8-15 W. The F780 FCBGA package uses a heat-spreader lid; attach a heatsink with thermal interface material (TIM) or use a forced-air cooling solution. Estimated: at 12 W dissipation with theta_JA of approximately 12 C/W (with heatsink), junction-to-ambient rise is 144 C - verify against the device's maximum junction temperature (100C for commercial grade). Always perform thermal simulation with the actual PCB stack-up and airflow.

The F780 package has a 1.0 mm ball pitch and 29 mm x 29 mm body, requiring a multilayer PCB with microvia or stacked-via technology to fan out signal and power balls. All 780 balls are present even if some are unused - unused power balls must still be connected to their rails to maintain package coplanarity and current capacity. Matched-impedance routing (85 ohm differential for transceivers, 50 ohm single-ended for general I/O) must be verified with a 3D field solver.

Transceiver channels must be routed with controlled-impedance differential pairs, length matching within the budget specified in the Cyclone 10 GX transceiver user guide, and DC-blocking capacitors placed close to the package balls. AC-coupling capacitor selection must consider the transceiver's pre-emphasis and equalization capabilities. Use IBIS-AMI models from Intel for channel simulation, including crosstalk from adjacent aggressor traces.

A common pitfall is selecting the wrong speed grade: speed grade 5 is the fastest, while grade 7 is the slowest; mixing grades between prototypes and production may break timing closure. Another pitfall is ignoring configuration scheme selection - the device supports AS (active serial), PS (passive serial), JTAG, and fast passive parallel, each with different bitstream width and boot time implications. Always verify bitstream compatibility for revision changes with Quartus Prime.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Yes
Konfliktmineralien
Compliant

RoHS compliant and lead-free per Intel's Cyclone 10 GX material declarations. AEC-Q100 not applicable (industrial FPGAs are not automotive-qualified by default; Intel offers automotive-grade Cyclone 10 GX variants under separate part numbers). Verify halogen-free and REACH status against the latest Intel product declaration documents.

Daten verifiziert am: 2026-09-05 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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