10M08DAU324C8G - MAX 10 FPGA, 8K LE, 324-LFBGA | Intel / Altera
料号： 10M08DAU324C8G ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $19 | $19.00 |
| 10 | $17.5 | $175.00 |
| 100 | $15.2 | $1,520.00 |
| 500 | $13.1 | $6,550.00 |
| 1,000 | $11.4 | $11,400.00 |
10M08DAU324C8G 概述
A field programmable gate array (FPGA) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O can be programmed by the designer after manufacture. Within the broader semiconductor taxonomy, an FPGA belongs to programmable logic devices (PLD), which sit between standard logic ICs (fixed-function) and application-specific integrated circuits (ASIC, fully custom). FPGAs trade power and absolute performance for design flexibility, fast prototyping, and in-field reconfiguration - making them ideal for low-volume, fast-time-to-market, or rapidly evolving products. The MAX 10 family specifically targets low-cost, low-power, instant-on applications with on-chip flash and analog features that approximate an SoC.
Key features of the 10M08DAU324C8G include 8K LE (8,000 logic elements), 378 Kbit embedded SRAM, 246 maximum user I/O, integrated 12-bit ADC up to 1 MSPS, 1.2 V core operating voltage, and an internal configuration flash of approximately 2.4 Mbit. The device supports commercial junction temperature grade 0C to +85C in the C8 speed grade and is delivered in a 19 mm x 19 mm, 1.0 mm pitch, 324-LFBGA package that suits industrial control, motor drive, and consumer video bridge designs.
The MAX 10 architecture employs LUT-based logic elements, M9K embedded memory blocks, DSP blocks, and hard PCIe Gen2 IP. Its on-chip flash enables instant-on single-chip functionality and supports dual-configuration images, remote system upgrade, and field updates without external storage. Compared with SRAM-based FPGAs, the MAX 10 simplifies board design by removing the boot PROM and configuration controller, while still allowing I/O and logic to be reprogrammed unlimited times.
Typical applications include industrial machine vision, factory automation controllers, automotive driver-assistance prototyping, video bridging and display controllers, low-power IoT edge nodes, and portable medical devices. Designers select the 10M08DAU324C8G when they need MAX 10 instant-on capability, on-chip ADC for sensor aggregation, and a high-I/O count package in a single chip.
When designing with this device, plan for 1.0 mm BGA PCB assembly with controlled-impedance routing, allocate sufficient decoupling, and choose the speed grade (C8 commercial vs I7 industrial) carefully to ensure timing closure. Quartus Prime software is required for synthesis, place-and-route, and bitstream generation; only -I6 and -A6 speed grades are restricted by default in Quartus Prime and require local Intel support. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： 10M08DAU324C8G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10M08DAU324C8G （相同外形与封装尺寸） ——差异在于 Package, Process Technology, Speed Grade, Operating Temperature, Configuration Memory.
快速对比工具——选择替代料号进行并排对比：
10M08DAU324I7G
✅ 直接替换✓ 有现货
$22.1 / 个
查看数据手册 →10M08DCU324C8G
✅ 直接替换📋 参考替代料（不在目录中）
10M08DAU324C7G
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
10M08DAU324A7G
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
10M04DAU324C8G
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →10M16DAU324C8G
✅ 直接替换✓ 有现货
$35.4 / 个
查看数据手册 →10M08DAU324C8G 最大额定值与电气特性
| Series | MAX 10 |
| Family | MAX 10 FPGA |
| Logic Elements (LE) | 8000 |
| Embedded Memory (M9K blocks) | 378 Kbit total |
| Maximum User I/O | 246 |
| Maximum User I/O (this package) | 246 |
| Process Technology | TSMC 55 nm NOR-flash |
| Core Voltage | 1.2 V |
| On-chip Configuration Flash | Approx. 2.4 Mbit |
| Integrated ADC | 12-bit, up to 1 MSPS |
| 封装 | 324-LFBGA (U324), 19x19 mm, 1.0 mm pitch |
| 安装类型 | Surface Mount (BGA) |
| Speed Grade | C8 (commercial, 0C to +85C) |
| Operating Temperature (Junction) | 0C to +85C |
| Configuration Mode | Internal flash (instant-on, dual-image) |
| RoHS 状态 | Compliant |
10M08DAU324C8G 324-lfbga (u324), 19x19 mm, 1.0 mm pitch 引脚配置指南
10M08DAU324C8G（324-lfbga (u324), 19x19 mm, 1.0 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10M08DAU324C8G.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10M08DAU324C8G 适用于 6 应用s: Industrial Motor Control, Video Bridging and Display Controllers, Factory Automation Controllers, Automotive Driver-Assistance Prototyping, IoT Edge Nodes and Sensor Aggregation, Portable Medical Device Controllers.
Industrial Motor Control
The 10M08DAU324C8G fits industrial motor control boards because of its 8,000 logic elements, 246 user I/O, and integrated 12-bit ADC up to 1 MSPS for current/voltage sensing. The on-chip configuration flash enables instant-on startup so the controller can energize the power stage deterministically after power-on reset. The 324-LFBGA U324 package brings out enough I/O to drive three-phase PWM, quadrature encoder inputs, and isolated communication interfaces (RS-485, CAN) without external bus expanders. Designers also benefit from the MAX 10 hardware DSP blocks which accelerate field-oriented control (FOC) math, and from the 1.2 V core with simple single-rail power design versus SRAM FPGAs needing boot PROMs.
推荐
Video Bridging and Display Controllers
The 10M08DAU324C8G is well suited to video bridging applications where MIPI-CSI, LVDS, or parallel RGB input must be translated to HDMI or DisplayPort outputs. Its 8K LE fabric, M9K memory, and 246 I/O handle wide parallel video buses plus pixel-clock DDR interfaces comfortably. The on-chip configuration flash removes the boot PROM, enabling faster display bring-up in thin clients, kiosks, and digital signage. Quartus Prime IP for video format conversion is readily available and routes efficiently in the U324 BGA footprint, while the integrated 12-bit ADC supports backlight or temperature monitoring alongside video processing.
推荐
Factory Automation Controllers
For PLC, distributed I/O, and industrial gateway designs the 10M08DAU324C8G provides deterministic instant-on boot from internal flash - critical for fail-safe restart behaviour on factory floors. The 246 user I/O support multi-protocol industrial networks (EtherCAT, PROFINET, Modbus) via soft IP and a high count of discrete opto-isolated inputs. Its integrated 12-bit ADC replaces external ADCs for analog sensor aggregation, and the 324-LFBGA package keeps the PCB compact for DIN-rail modules. The commercial 0C to +85C junction range covers most cabinet environments, with the 10M08DAU324I7G drop-in for harsher installations.
推荐
Automotive Driver-Assistance Prototyping
Although the 10M08DAU324C8G itself is commercial-grade, the MAX 10 architecture is widely used to prototype ADAS sensor pre-processing, parking-camera overlays, and driver-monitoring algorithms before porting to automotive-qualified silicon. The 8K LE and DSP blocks deliver real-time pixel processing at the edge, while the integrated 12-bit ADC digitizes analog sensor channels without an external ADC. Its instant-on behaviour matches the cold-start requirements of body electronics prototypes, and the U324 package supports the high pin count of multi-camera head units.
推荐
IoT Edge Nodes and Sensor Aggregation
Battery- and line-powered IoT edge nodes benefit from the 10M08DAU324C8G's combination of low static power, instant-on internal flash boot, and on-chip ADC for sensor fusion. The 8K LE easily handles protocol stacks (MQTT-SN, CoAP) and local analytics before forwarding to a wireless module. With 246 I/O the device can fan-out to multiple sensors, displays, and user interfaces while keeping the BOM small. Quartus Prime provides Nios II soft-core support for C-based edge applications, making the 10M08DAU324C8G a flexible silicon platform for next-generation edge gateways.
推荐
Portable Medical Device Controllers
In portable patient monitors, infusion pumps, and handheld diagnostic tools, the 10M08DAU324C8G's instant-on flash boot, integrated 12-bit ADC, and small 1.2 V core reduce bill-of-material count and extend battery life. The 8K LE fits signal-conditioning pipelines, simple display controllers, and user-interface state machines in a single chip. Designers value the deterministic startup for safety-critical sequences, and the U324 LFBGA package keeps the device compact while exposing enough I/O for touch panels, pumps, and serial sensors. The commercial C8 grade suits controlled clinical environments; industrial I7 variants are available on the same footprint for field-deployed units.
推荐
推荐产品汇总
工程参考数据： 10M08DAU324C8G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10M08DAU324I7G | 10M08DCU324C8G | 10M08DAU324C7G | 10M08DAU324A7G | 10M04DAU324C8G | 10M16DAU324C8G |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 324-LFBGA (U324), 19x19 mm | 324-LFBGA (U324) - same | 324-LFBGA (U324) - same | 324-LFBGA (U324) - same | 324-LFBGA (U324) - same | 324-LFBGA (U324) - same | 324-LFBGA (U324) - same |
| Logic Elements | 8000 | 8000 | 8000 | 8000 | 8000 | 4000 (-50%) | 16000 (+100%) |
| Speed Grade | C8 (commercial) | I7 (industrial) | C8 (commercial) | C7 (faster) | A7 (slower) | C8 (commercial) | C8 (commercial) |
| Temperature Range | 0C to +85C (C8 commercial) | -40C to +100C (I7 industrial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
| Maximum User I/O | 246 | 246 | 246 | 246 | 246 | 246 | 246 |
| Embedded Memory | 378 Kbit (M9K) | 378 Kbit | 378 Kbit | 378 Kbit | 378 Kbit | 189 Kbit (-50%) | 549 Kbit (+45%) |
| Integrated ADC | 12-bit, up to 1 MSPS | 12-bit, up to 1 MSPS | 12-bit, up to 1 MSPS | 12-bit, up to 1 MSPS | 12-bit, up to 1 MSPS | 12-bit, up to 1 MSPS | 12-bit, up to 1 MSPS |
关键差异点
- Integrated configuration flash eliminates external boot PROM （对比 10CL055YU484C8G (Cyclone IV))
- Commercial C8 speed grade balance of cost and performance （对比 10M08DAU324I7G (I7 industrial))
- Same 8K LE logic density as 10M08DAU324I7G in commercial grade （对比 10M08DAU324C7G (C7 speed grade))
- 8K LE vs 4K LE alternative （对比 10M04DAU324C8G)
设计说明
Estimated: The 10M08DAU324C8G uses a 324-ball LFBGA at 1.0 mm pitch. Design PCB pad stacks with non-solder-mask-defined (NSMD) pads approximately 0.5 mm diameter, 0.6 mm solder mask opening, and micro-via-in-pad (0.1 mm laser via) for full BGA escape routing. Use at least 4 PCB layers with a continuous ground plane under the BGA to provide low-impedance return paths for high-speed DDR/PCIe interfaces.
Provide bulk decoupling of at least 47 uF and 100 nF high-frequency ceramic caps at every VCCINT, VCCA, and VCCIO pin pair. Per the manufacturer datasheet, the MAX 10 device requires a 1.2 V core, 2.5 V analog supply (for ADC), and 1.2-3.3 V VCCIO banks; ramp all rails in monotonic sequence to avoid latch-up. Estimated: peak in-rush current at cold boot can reach 0.5-1 A for tens of milliseconds as the internal flash configures the fabric.
For DDR3 interfaces, route 50 ohm controlled-impedance traces with length matching within 50 mils (1.27 mm) on the byte lanes. The MAX 10 DSP and M9K blocks can source high-edge-rate signals into the BGA, so place series 33 ohm damping resistors near the FPGA pin when driving long backplane traces. Validate timing in Quartus Prime TimeQuest with the correct speed-grade model (C8) and the actual operating temperature corner.
Do not assume the -I6 and -A6 speed grades are visible in Quartus Prime by default; the manufacturer datasheet confirms these are not available by default and require contact with local Intel sales support. Always double-check the ordering code suffix and the device OPN file in Quartus before commit. Mixing commercial C8 with industrial I7 parts on the same PCB will break the operating-temperature specification across the assembly.
合规信息
RoHS and REACH compliance per Intel / Altera product page; commercial grade only - choose industrial-grade MAX 10 I7 variants for harsh environments; AEC-Q100 not applicable to this commercial C8 ordering code.
