10M08DAU324I7G - MAX 10 FPGA, 8K LE, 246 I/O, 324-BGA | Intel
MPN: 10M08DAU324I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.2 | $382.00 |
| 100 | $31.75 | $3,175.00 |
| 500 | $26.4 | $13,200.00 |
| 1,000 | $22.1 | $22,100.00 |
Drop-in alternatives for 10M08DAU324I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M08DAU324C8G
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$11.4 / Unit
View Datasheet →10M08DAF484I7G
✅ Drop-In✓ In Stock
$25.8 / Unit
View Datasheet →10M08DAU324I7P
✅ Drop-In📋 Reference alternative (not in catalog)
10M04DAU324I7G
✅ Drop-In✓ In Stock
$13.5 / Unit
View Datasheet →10M08SCU324C8G
✅ Drop-In✓ In Stock
$14.2 / Unit
View Datasheet →LCMXO2-1200HC-4MG132C
✅ Drop-In📋 Reference alternative (not in catalog)
10M08DAU324I7G Maximum Ratings & Electrical Characteristics
| Series | MAX 10 |
| Logic Elements (LE) | 8,000 |
| Embedded Memory (M9K blocks) | 378 Kbits |
| User Flash Memory | 387,072 bits |
| Maximum User I/O | 246 |
| Package | 324-LFBGA (UBGA), 1.0 mm pitch |
| Operating Temperature | -40C to +100C (Industrial) |
| Supply Voltage (Core) | 1.2 V typical |
| Supply Voltage (I/O Banks) | 1.2 V to 3.3 V |
| Process Technology | TSMC 55 nm embedded flash |
| DSP Blocks (18x18 Multipliers) | 24 |
| PLLs | 4 |
| On-chip ADC | Dual 12-bit, 1 MSPS |
| Configuration | Internal flash, JTAG, Passive Serial |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| MSL Level | 3 |
10M08DAU324I7G 324-lfbga (ubga), 1.0 mm pitch Pin Configuration Guide
Complete pinout information for 10M08DAU324I7G (324-lfbga (ubga), 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M08DAU324I7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M08DAU324I7G is suitable for 7 applications: Industrial I/O Expansion and Bridge, Low-Cost Motor Control and Drive, Video Processing and Display Interfaces, Portable Medical Device Control, Consumer Electronics Custom Logic, Automotive Infotainment and Body Electronics, Communications Protocol Bridging.
Industrial I/O Expansion and Bridge
The 10M08DAU324I7G is well suited for industrial I/O expansion, glue logic, and protocol bridging between legacy and modern interfaces. Its 8,000 logic elements, 246 user I/Os, and integrated flash enable instant-on custom logic bridging SPI to UART, I2C to parallel, and GPIO expansion for PLC and factory automation backplanes. The industrial -40C to +100C temperature range supports harsh factory floor environments. Companion components include RS-485 transceivers like MAX3485, digital isolators such as ADuM1411, and the Nios II soft-core CPU IP for on-chip control logic. Unlike discrete logic ICs, the 10M08 integrates configuration and user data in 387 Kbits of on-chip flash, simplifying the BOM and enabling in-field firmware updates.
Recommended
Low-Cost Motor Control and Drive
The 10M08DAU324I7G delivers dedicated hardware resources for low-cost BLDC, PMSM, and stepper motor control including 24 18x18 DSP multipliers, 4 PLLs, and dual 12-bit 1 MSPS ADCs for current and voltage sensing. The industrial temperature grade and 55 nm embedded flash process handle the thermal and reliability demands of motor drives. Typical designs use the 10M08 to generate PWM waveforms, decode quadrature encoder feedback, and run field-oriented control (FOC) algorithms. Companion components include gate drivers like IR2104 for MOSFET half-bridges, op-amps such as OPA2333 for current-sense amplification, and Hall-effect sensors for rotor position feedback.
Recommended
Video Processing and Display Interfaces
The 10M08DAU324I7G handles LVDS-based video bridging, image processing pipelines, and display controller functions in cost-sensitive embedded vision applications. Its 246 user I/Os accommodate parallel RGB, LVDS, and CSI-2 camera interfaces, while the integrated flash stores lookup tables and gamma correction curves. The 1 MSPS on-chip ADC can sample control voltages or backlight feedback. Typical designs use the 10M08 to bridge HDMI to LVDS panels, perform on-screen display overlay, or implement frame-rate conversion. Companion components include HDMI transmitters like TFP401, LVDS serializers such as SN65LVDS84A, and DDR2 memory for frame buffering.
Recommended
Portable Medical Device Control
The 10M08DAU324I7G enables portable medical devices such as patient monitors, infusion pumps, and handheld diagnostic instruments that require deterministic real-time response, low power, and a small footprint. Its instant-on flash configuration eliminates boot delays, critical for medical safety. The on-chip dual ADC samples analog physiological signals without an external ADC. The 246 I/Os connect to TFT displays, touch controllers, and wireless modules. Companion components include low-power microcontrollers like STM32L476 for system orchestration, precision op-amps such as AD8628 for signal conditioning, and Bluetooth modules like nRF52832 for wireless connectivity.
Recommended
Consumer Electronics Custom Logic
The 10M08DAU324I7G provides instant-on custom logic for consumer electronics including gaming peripherals, smart appliances, and home automation gateways. Its non-volatile flash configuration supports instant power-on without external boot devices, reducing BOM cost. The 8,000 LEs implement LED matrix drivers, capacitive touch controllers, and audio processing pipelines. The on-chip ADC monitors battery voltage and temperature in battery-powered products. Companion components include LED drivers like TLC5941 for addressable lighting, audio codecs such as SGTL5000 for sound output, and Wi-Fi modules like ESP32 for connectivity.
Recommended
Automotive Infotainment and Body Electronics
The 10M08DAU324I7G supports automotive body electronics, infotainment auxiliary functions, and rear-seat entertainment systems where -40C to +100C operation and AEC-Q100-style reliability are required. The 10M08 implements CAN/LIN bus bridging, rear-view camera overlay, and instrument cluster graphics acceleration. Note that for safety-critical ADAS or chassis functions, choose the AEC-Q100-qualified Cyclone IV or Cyclone V families instead. Companion components include CAN transceivers like TJA1050 for in-vehicle networking, video amplifiers such as THS7374 for camera signal conditioning, and automotive-grade power supplies like TPS5430.
Recommended
Communications Protocol Bridging
The 10M08DAU324I7G excels at communications protocol bridging for routers, base stations, and industrial networking equipment. Its 246 I/Os and embedded 10/100/1000 Ethernet MAC hard IP enable glue logic between PHY, switch, and CPU. The 24 DSP blocks handle packet header parsing and CRC computation. The instant-on flash supports secure boot with bitstream encryption. Companion components include Ethernet PHYs like DP83848 for 10/100 Mb/s, SRAM memories such as CY7C1061 for packet buffering, and supervisory circuits like TPS3808 for reset generation.
Recommended
Recommended Products Summary
Engineering reference data for 10M08DAU324I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M08DAU324C8G | 10M08DAF484I7G | 10M08SCU324C8G | 10M04DAU324I7G | LCMXO2-1200HC-4MG132C |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Lattice Semiconductor |
| Package | 324-LFBGA (UBGA), 1.0 mm pitch | 324-LFBGA (UBGA) - same | 324-LFBGA compatible subset of F484 | 324-LFBGA (UBGA) - same | 324-LFBGA (UBGA) - same | 132-csBGA - different package, verify pinout |
| Logic Elements | 8,000 | 8,000 | 8,000 | 8,000 | 4,000 (-50%) | 1,280 LUTs (-84%) |
| Embedded Memory | 378 Kbits M9K | 378 Kbits | 378 Kbits | 378 Kbits | 189 Kbits (-50%) | 64 Kbits (-83%) |
| User Flash | 387 Kbits | 387 Kbits | 387 Kbits | 387 Kbits | 193 Kbits (-50%) | 0 (external boot required) |
| On-chip ADC | Dual 12-bit, 1 MSPS | Dual 12-bit, 1 MSPS | Dual 12-bit, 1 MSPS | None (SC variant) | Dual 12-bit, 1 MSPS | None |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C |
| Maximum User I/O | 246 | 246 | Up to 250 | 246 | 246 | Up to 80 |
| DSP Multipliers (18x18) | 24 | 24 | 24 | 24 | 16 (-33%) | 0 |
| Price (qty-1, USD) | $42.50 | ~$38.00 | ~$48.00 | ~$36.00 | ~$28.00 | ~$7.00 |
Key Differentiators
- On-chip user flash memory eliminates external boot PROM (vs Lattice LCMXO2-1200HC-4MG132C)
- Dual on-chip 12-bit ADC for analog signal acquisition (vs Xilinx XC6SLX9-2CPG196C)
- Higher logic density in the same package footprint (vs 10M04DAU324I7G)
Design Notes
The 324-LFBGA package uses a 1.0 mm ball pitch, which requires microvia or HDI PCB fabrication technology for reliable fan-out routing. Use a 4-layer or 6-layer stack-up with controlled impedance for high-speed LVDS pairs. The BGA escape routing must accommodate 0.4 mm-pitch microvias between the top and inner layer; ensure your PCB manufacturer's process supports this pitch. According to the Intel MAX 10 pin connection guidelines, all VCCINT and VCCA pins must be decoupled with 100 nF capacitors placed as close to the balls as physically possible.
Estimated: at typical operation with 50 percent logic utilization, 50 percent toggle rate, and 85C ambient, the 10M08 dissipates approximately 0.5 to 1.0 W. The 324-LFBGA package has a theta_JA of approximately 15 C/W with a properly designed thermal pad and PCB thermal vias. Without thermal vias, theta_JA rises above 30 C/W. According to the Intel MAX 10 datasheet, junction temperature must remain below 100C for industrial operation; verify with a thermal simulation in your specific PCB layout. Estimated input values: 1.0 W dissipation, 15 C/W theta_JA, 85C ambient yields 100C junction - at the operating limit.
Do not leave configuration pins floating: MSEL[2:0] must be tied to VCCIO or GND to select the configuration mode. Unused I/O pins should be set as inputs with internal weak pull-up enabled in the Quartus Prime pin assignment to avoid floating inputs. According to the Intel MAX 10 datasheet, the JTAG TCK pin requires a 1 kohm pull-down to prevent inadvertent configuration. Always implement bitstream encryption when the design contains proprietary IP. Verify that all LVDS pairs use matched-length routing within 50 mil tolerance.
The 10M08DAU324I7G requires three supply rails: VCCINT (1.2 V core), VCCA (2.5 V analog supply for PLLs and ADC), and VCCIO (1.2 V to 3.3 V per bank). According to the Intel MAX 10 datasheet, power-on sequencing requires VCCIO to ramp before or simultaneously with VCCINT. Use a sequencer or monotonic supply ramp to avoid latch-up. Decouple each VCCINT pin with 100 nF X7R ceramic; add a 10 uF bulk capacitor per supply near the device. The on-chip voltage regulator allows single 3.3 V supply operation if design constraints permit slightly higher core current.
LVDS and high-speed DDR interfaces on the 10M08 require 100 ohm differential impedance routing with intra-pair length matching of 5 mil or better. For DDR memory interfaces, use the Quartus Prime Timing Analyzer to verify setup/hold margins before tape-out. According to the Intel MAX 10 External Memory Interface Handbook, place reference voltage (VREF) decoupling capacitors every 5 mm along the DDR bus. Series termination resistors (22 to 33 ohm) on LVCMOS outputs reduce overshoot and ringing on long PCB traces.
Compliance Information
RoHS and REACH compliant per Intel product page. Standard MAX 10 family is not AEC-Q100 qualified - for automotive safety-critical applications use the Cyclone IV or Cyclone V families instead. Lead-free and halogen-free per Intel material declaration.
