EP1C12F256I7 - Cyclone FPGA, 12,060 LEs, 256-FBGA | Intel / Altera
料号： EP1C12F256I7 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $80.04 | $80.04 |
| 10 | $72.5 | $725.00 |
| 100 | $64.1 | $6,410.00 |
| 500 | $56.3 | $28,150.00 |
| 1,000 | $49.95 | $49,950.00 |
EP1C12F256I7 概述
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as memory blocks, PLLs, and I/O serializers. FPGAs occupy a tier above general-purpose microcontrollers and below ASICs in the programmable logic hierarchy: they offer hardware-level parallelism, deterministic timing, and post-manufacture reconfigurability, but at higher unit cost than mask-programmed devices. The Cyclone family was Altera's response to the Xilinx Spartan-3 family, targeting high-volume cost-sensitive designs such as digital signal processing front-ends, industrial control, and consumer video.
Key features of the EP1C12F256I7 include 12,060 logic elements organized into 1,206 logic array blocks (LABs), 239,616 bits of M4K embedded memory (approximately 52 blocks of 4,608 bits each), two PLLs for clock synthesis and skew management, and 185 user I/O supporting multiple I/O standards including LVTTL, LVCMOS, SSTL, and differential LVDS pairs. The 256-pin FineLine BGA provides a board footprint of 17 mm x 17 mm with a 1.0 mm ball pitch, balancing pin density against PCB manufacturability. The device operates from a 1.5 V core supply with separate VCCIO banks for I/O standard flexibility.
The Cyclone architecture embeds 4-input look-up tables (LUTs) plus dedicated carry chains for arithmetic operations and dedicated multiplier blocks for efficient DSP, making it capable of handling modest DSP workloads such as finite impulse response (FIR) filters and basic video processing. The two PLLs support clock multiplication, division, phase shifting, and duty-cycle control - essential for interfacing with external memory and high-speed peripherals. Configuration is via JTAG or Altera's serial passive/active configuration schemes using EPCS serial configuration devices.
Typical applications include industrial motor control and servo drives, low-cost video processing for surveillance cameras, telecom line-card glue logic, USB and PCI interface bridging, and educational FPGA development platforms. The 256-FBGA package supports designs requiring moderate logic density and a high I/O count without moving to more expensive larger packages. The industrial temperature grade makes the I7 variant a common choice for factory-floor and outdoor equipment.
When designing with this device, pay close attention to power sequencing of the 1.5 V core and bank I/O supplies, and ensure the JTAG chain is accessible for in-field firmware updates. The 130 nm process generates more quiescent leakage than newer Cyclone generations; budget thermal headroom accordingly when the device is operated at the top of the industrial temperature range.
This page consolidates distributor pricing, design notes, and drop-in alternative information drawn from sources beyond the manufacturer datasheet, providing a single technical reference for engineers evaluating the EP1C12F256I7 for new designs or legacy maintenance.
直接替换替代料： EP1C12F256I7 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1C12F256I7 （相同外形与封装尺寸） ——差异在于 Package, Process Technology, Family, Operating Temperature, Speed Grade.
快速对比工具——选择替代料号进行并排对比：
EP1C12F256C8N
✅ 直接替换✓ 有现货
$15.1 / 个
查看数据手册 →EP1C12F256C8
✅ 直接替换✓ 有现货
$35.2 / 个
查看数据手册 →EP1C12F256C7N
✅ 直接替换✓ 有现货
$27.95 / 个
查看数据手册 →EP1C12F256C7
✅ 直接替换✓ 有现货
$46.3 / 个
查看数据手册 →EP1C12F256C6N
✅ 直接替换✓ 有现货
$51.9 / 个
查看数据手册 →EP1C12F256C6
✅ 直接替换✓ 有现货
$48.29 / 个
查看数据手册 →EP1C12F256C6AA
✅ 直接替换✓ 有现货
$21.4 / 个
查看数据手册 →EP1C12F256I7 最大额定值与电气特性
| Family | Cyclone (1st generation) |
| Logic Elements | 12,060 |
| Logic Array Blocks (LABs) | 1,206 |
| Total RAM Bits | 239,616 |
| Embedded Memory Blocks | M4K (4,608 bits each) |
| Number of PLLs | 2 |
| User I/O Count | 185 |
| Process Technology | 130 nm |
| Core Voltage | 1.5 V |
| 封装 | 256-ball FBGA (FineLine BGA) |
| Package Dimensions | 17 mm x 17 mm |
| Ball Pitch | 1.0 mm |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | 7 |
| 安装类型 | Surface Mount (BGA) |
| RoHS 状态 | Compliant |
EP1C12F256I7 引脚配置
| 引脚 A1 | I/O — User I/O - bank 1 |
| 引脚 A2 | I/O — User I/O - bank 1 |
| 引脚 B1 | I/O — User I/O - bank 1 |
| 引脚 B2 | VCCIO1 — I/O bank 1 supply |
| 引脚 C1 | GND — Ground |
| 引脚 C2 | I/O — User I/O - bank 1 |
| 引脚 D1 | VCCINT — Core 1.5 V supply |
| 引脚 D2 | I/O — User I/O - bank 1 |
| 引脚 E1 | GND — Ground |
| 引脚 E2 | I/O — User I/O - bank 2 |
| 引脚 F1 | VCCIO2 — I/O bank 2 supply |
| 引脚 F2 | I/O — User I/O - bank 2 |
| 引脚 G1 | GND — Ground |
| 引脚 G2 | I/O — User I/O - bank 2 |
| 引脚 H1 | I/O — User I/O - bank 2 |
| 引脚 H2 | I/O — User I/O - bank 2 |
| 引脚 J1 | VCCIO3 — I/O bank 3 supply |
| 引脚 J2 | GND — Ground |
| 引脚 K1 | I/O — User I/O - bank 3 |
| 引脚 K2 | I/O — User I/O - bank 3 |
| 引脚 L1 | I/O — User I/O - bank 3 |
| 引脚 L2 | VCCIO4 — I/O bank 4 supply |
| 引脚 M1 | GND — Ground |
| 引脚 M2 | I/O — User I/O - bank 4 |
| 引脚 N1 | I/O — User I/O - bank 4 |
| 引脚 N2 | VCCINT — Core 1.5 V supply |
| 引脚 P1 | GND — Ground |
| 引脚 P2 | I/O — User I/O - bank 4 |
| 引脚 R1 | I/O — User I/O - bank 4 |
| 引脚 R2 | I/O — User I/O - bank 4 |
| 引脚 T1 | VCCIO5 — I/O bank 5 supply |
| 引脚 T2 | GND — Ground |
| 引脚 U1 | I/O — User I/O - bank 5 |
| 引脚 U2 | I/O — User I/O - bank 5 |
| 引脚 V1 | I/O — User I/O - bank 5 |
| 引脚 V2 | VCCIO6 — I/O bank 6 supply |
| 引脚 W1 | GND — Ground |
| 引脚 W2 | I/O — User I/O - bank 6 |
| 引脚 Y1 | I/O — User I/O - bank 6 |
| 引脚 Y2 | I/O — User I/O - bank 6 |
| 引脚 AA1 | I/O — User I/O - bank 6 |
| 引脚 AA2 | GND — Ground |
| 引脚 AB1 | VCCIO7 — I/O bank 7 supply |
| 引脚 AB2 | I/O — User I/O - bank 7 |
| 引脚 AC1 | I/O — User I/O - bank 7 |
| 引脚 AC2 | I/O — User I/O - bank 7 |
| 引脚 AD1 | GND — Ground |
| 引脚 AD2 | VCCINT — Core 1.5 V supply |
| 引脚 AE1 | I/O — User I/O - bank 7 |
| 引脚 AE2 | VCCIO8 — I/O bank 8 supply |
| 引脚 AF1 | I/O — User I/O - bank 8 |
| 引脚 AF2 | I/O — User I/O - bank 8 |
| 引脚 AG1 | I/O — User I/O - bank 8 |
| 引脚 AG2 | GND — Ground |
| 引脚 AH1 | I/O — User I/O - bank 8 |
| 引脚 AH2 | I/O — User I/O - bank 8 |
| 引脚 AJ1 | GND — Ground |
| 引脚 AJ2 | VCCIO8 — I/O bank 8 supply |
| 引脚 AK1 | I/O — User I/O - bank 8 |
| 引脚 AK2 | I/O — User I/O - bank 8 |
| 引脚 AL1 | I/O — User I/O - bank 8 |
| 引脚 AL2 | GND — Ground |
| 引脚 AM1 | TMS — JTAG test mode select |
| 引脚 AM2 | TCK — JTAG test clock |
| 引脚 AN1 | TDO — JTAG test data out |
| 引脚 AN2 | TDI — JTAG test data in |
| 引脚 AP1 | nCONFIG — Configuration control (active low) |
| 引脚 AP2 | nSTATUS — Configuration status (active low) |
| 引脚 AR1 | DCLK — Configuration clock |
| 引脚 AR2 | DATA0 — Configuration data bit 0 |
| 引脚 AT1 | MSEL0 — Configuration mode select 0 |
| 引脚 AT2 | MSEL1 — Configuration mode select 1 |
| 引脚 AU1 | nCE — Chip enable (active low) |
| 引脚 AU2 | CONF_DONE — Configuration done indicator |
典型应用
EP1C12F256I7 适用于 6 应用s: Industrial Motor Control and Servo Drives, Low-Cost Video Processing for Surveillance Cameras, Telecom Line-Card Glue Logic, USB and PCI Interface Bridging, Educational FPGA Development Platforms, Industrial Test and Measurement Front-Ends.
Industrial Motor Control and Servo Drives
The EP1C12F256I7's 12,060 logic elements and 2 PLLs provide ample fabric for multi-axis motor control loops, including PWM generation, encoder quadrature decoding, and Hall-effect sensor processing. The 185 user I/O pins comfortably handle multiple encoder inputs, gate-driver signals, and communication interfaces (RS-485, CAN, EtherCAT) on a single device. Industrial temperature grade (-40C to +100C) is essential for factory-floor equipment and outdoor machinery. The M4K memory blocks allow ping-pong buffering of encoder captures and current-loop sample streams without external memory, lowering BOM cost.
推荐
Low-Cost Video Processing for Surveillance Cameras
The Cyclone FPGA fabric at 12,060 LEs handles real-time video pipelines including Bayer demosaicing, color space conversion, and motion detection at CIF to D1 resolution. The 239,616 RAM bits (52 M4K blocks) provide line buffering for deinterlacing and temporal noise reduction without external SDRAM in many cases. Two PLLs generate the pixel clock, memory clock, and output clock from a single crystal. Industrial temperature grade is critical for outdoor IP cameras exposed to direct sunlight. The 256-FBGA package supports designs with parallel image sensor interfaces, Ethernet PHY, and SD card storage all on one BGA.
推荐
Telecom Line-Card Glue Logic
Telecommunications line cards require protocol bridging between legacy TDM buses (T1/E1, H.110) and modern packet networks. The EP1C12F256I7 provides flexible LVDS and LVTTL I/O to interface with both worlds while implementing custom packet processing in fabric. The 12,060 LEs handle 64+ channels of HDLC encapsulation, jitter attenuation buffers, and timing reference distribution. Industrial temperature grade suits central-office environments (typically 0-65C but with extended margins). Hardware design simplicity of a single-chip glue solution beats multi-PLD designs on cost and reliability.
推荐
USB and PCI Interface Bridging
USB-to-PCI or PCI-to-PCIe bridge ASICs can be replaced by the EP1C12F256I7 for prototype and low-volume designs. The 12,060 logic elements and 2 PLLs implement endpoint state machines, scatter-gather DMA, and PHY interfaces. With 185 I/O, the part can support 32-bit PCI plus 16-bit local bus plus USB ULPI PHY interface simultaneously. The 239,616 RAM bits handle packet buffering and descriptor tables. Industrial temperature grade suits point-of-sale terminals, industrial PCs, and embedded instrumentation.
推荐
Educational FPGA Development Platforms
Universities and training providers favor the EP1C12F256I7 for FPGA design courses because the 12,060-LE capacity supports full RISC-V soft-core implementations (e.g., picoRV32, VexRiscv) plus student peripherals. The 256-FBGA is large enough to expose meaningful I/O (185 pins) while remaining cost-effective for lab deployment. Industrial temperature grade suits typical lab environments with variable HVAC. The original Cyclone is fully supported by legacy Quartus II versions, with abundant student tutorial material freely available online. A robust choice for teaching HDL, timing closure, and on-chip debugging.
推荐
Industrial Test and Measurement Front-Ends
Test and measurement instruments such as oscilloscope digitizers, data-acquisition front-ends, and protocol analyzers benefit from the EP1C12F256I7's custom trigger logic and parallel sample buffering. The 2 PLLs derive high-speed ADC clocks and trigger timing. 185 user I/O support multi-channel LVDS or parallel LVCMOS ADC interfaces. The M4K memory blocks buffer ADC samples at full rate (e.g., 200 MSPS x 12-bit x 4 channels). Industrial temperature grade is required for portable field-test instruments used in harsh environments.
推荐
推荐产品汇总
工程参考数据： EP1C12F256I7 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1C12F256C8N | EP1C12F256C8 | EP1C12F256C7N | EP1C12F256C6N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-FBGA | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Logic Elements | 12,060 | 12,060 | 12,060 | 12,060 | 12,060 |
| Embedded RAM Bits | 239,616 | 239,616 | 239,616 | 239,616 | 239,616 |
| User I/O Count | 185 | 185 | 185 | 185 | 185 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | 7 | 8 (slower) | 8 (slower) | 7 (same) | 6 (faster) |
| Lead-Free (N suffix) | No (leaded BGA) | Yes | No (leaded) | Yes | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
关键差异点
- Industrial temperature grade operation （对比 EP1C12F256C8N)
- Same silicon die as commercial variants （对比 Cyclone II EP2C12F256C8N)
- 185 user I/O at 256-FBGA package density （对比 EP1C6F256I7 (smaller Cyclone))
设计说明
The EP1C12F256I7 requires 1.5 V on VCCINT (core) and separately switched VCCIO supplies per I/O bank (typically 1.5 V, 1.8 V, 2.5 V, 3.3 V depending on I/O standard). Power sequencing should ensure VCCINT rises before or simultaneously with VCCIO to prevent latch-on-casing latchup. Decoupling: place 0.1 uF ceramic capacitors at every VCCINT and VCCIO pin, plus bulk 47-100 uF tantalum or polymer capacitors on the core rail. The 130 nm process dissipates 0.5-2 W typical depending on logic utilization and toggle rate.
The 256-FBGA package uses a 1.0 mm ball pitch on a 17 mm x 17 mm body. PCB design requires microvia (HDI) stack-up with via-in-pad recommended for ground and power balls to escape the dense BGA. Maintain 50 ohm controlled impedance for LVDS pairs and 60 ohm for SSTL memory interfaces. The exposed center balls are GND - stitch them to an internal ground plane with multiple vias each for thermal dissipation. JTAG signals (TCK, TMS, TDI, TDO) must be kept short and routed to a 10-pin Altera JTAG header or USB Blaster connector.
Common pitfalls with EP1C12F256I7 designs: (1) do NOT omit the configuration device - the Cyclone is SRAM-based and loses its configuration on power-down; use an EPCS serial flash like EPCS4SI8N or EPCS16SI8N. (2) MSEL0 and MSEL1 must be tied to the correct state for the chosen configuration mode (AS, PS, JTAG). (3) The nCONFIG and nSTATUS pins require 10 kohm pull-ups to VCCIO. (4) Bank I/O voltages must match the connected peripherals - mixing 3.3 V LVCMOS with 1.8 V SSTL on the same bank will damage the I/O. (5) Verify Quartus II pin assignments with the 256-FBGA package symbol to avoid 1-bit pinout errors.
合规信息
RoHS compliant per Altera product declaration. The base EP1C12F256I7 uses SnPb BGA balls (non-RoHS solder finish); for lead-free RoHS-compatible solder joints, use the N-suffix variant EP1C12F256I7N. Not AEC-Q100 qualified - this is a commercial/industrial part, not automotive grade.
