EP1K30F256-3 - 30K Gates ACEX 1K FPGA, 256-BGA, -3 Speed | Altera
料号： EP1K30F256-3 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $21.8 | $2,180.00 |
| 500 | $18.4 | $9,200.00 |
| 1,000 | $15.6 | $15,600.00 |
EP1K30F256-3 概述
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that allows engineers to implement custom digital circuits through SRAM-based configuration cells, sitting at the top of the programmable logic hierarchy: PLD -> CPLD -> FPGA. ACEX 1K belongs to the older, mature Altera FPGA family based on a 0.18 µm CMOS SRAM process with on-chip Look-Up Table (LUT) architecture, providing true ASIC-like integration with field-reprogrammability. The -3 speed grade places it in the medium-performance tier of the family.
Key features include 24576 bits of embedded SRAM organized as EAB (Embedded Array Blocks), in-system programmability via the IEEE 1532 / IEEE 1149.1 (JTAG) interface, MultiVolt I/O supporting 2.5V and 3.3V interfaces, and a built-in PLL for clock management. The device operates from a 1.8V core supply and supports multiple I/O standards including LVTTL, LVCMOS, PCI, and SSTL. The FBGA-256 package enables compact PCB designs with high I/O density.
The EP1K30F256-3 utilizes an SRAM-based LUT architecture with embedded array blocks (EABs) for distributed memory, a configuration scheme that requires an external configuration device (such as EPC2 or EPC8) or microcontroller to load bitstream at power-up. The -3 speed grade delivers balance between cost and timing margin for industrial designs not requiring maximum Fmax.
Typical applications include industrial control systems, telecommunications glue logic, ASIC prototyping, low-volume production replacements, and embedded control interfaces where FPGA flexibility is preferred over fixed-function ASICs. The ACEX 1K family remains in active service in legacy designs requiring long-term component availability.
When designing with this device, plan for an external configuration PROM and a robust JTAG chain for in-system updates. Verify that the Quartus II design software version is set to support the ACEX 1K device family, and ensure PCB thermal design accounts for the FBGA-256 package's thermal resistance under maximum I/O toggle loading.
This page synthesizes distributor pricing, drop-in alternative ACEX 1K family members, and practical design notes not found in the standalone manufacturer datasheet, helping sourcing engineers quickly identify pin-compatible variants within the Altera ACEX 1K line.
直接替换替代料： EP1K30F256-3 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1K30F256-3 （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Process Technology, Logic Elements, Operating Temperature Grade.
快速对比工具——选择替代料号进行并排对比：
EP1K30FC256-3
✅ 直接替换✓ 有现货
$11.1 / 个
查看数据手册 →EP1K30FI256-2
✅ 直接替换✓ 有现货
$18.2 / 个
查看数据手册 →EP1K30FC256-2
✅ 直接替换✓ 有现货
$22.95 / 个
查看数据手册 →EP1K30FC256-1
✅ 直接替换✓ 有现货
$17.85 / 个
查看数据手册 →EP1K100FC256-3
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$30.22 / 个
查看数据手册 →EP1K100FI256-2
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$92 / 个
查看数据手册 →EP1K30F256-3 最大额定值与电气特性
| Family | ACEX 1K |
| Logic Elements | 1,728 |
| Equivalent Gates | 30,000 |
| Configurable Logic Blocks (CLBs) | 216 |
| Embedded Memory (RAM bits) | 24,576 |
| Maximum User I/O Pins | 171 |
| 最大时钟频率 | 909 MHz |
| Speed Grade | -3 |
| Core Voltage | 1.8 V |
| Process Technology | 0.18 µm CMOS SRAM |
| 封装 | FBGA-256 (FineLine BGA) |
| 安装类型 | Surface Mount (BGA) |
| Configuration Method | SRAM (requires external configuration device) |
| JTAG Support | Yes (IEEE 1149.1 / IEEE 1532) |
| PLL | Yes (on-chip) |
EP1K30F256-3 fbga-256 (fineline bga) 引脚配置指南
EP1K30F256-3（fbga-256 (fineline bga) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP1K30F256-3.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP1K30F256-3 适用于 6 应用s: Industrial Control Logic Integration, Telecommunications Glue Logic, ASIC Prototyping and Emulation, Legacy Equipment Field Replacement, Low-Volume ASIC Replacement, Embedded Control and Interface Bridging.
Industrial Control Logic Integration
The EP1K30F256-3 fits industrial control logic integration where its 1,728 logic elements, 171 user I/O pins, and 24,576 bits of embedded memory provide enough capacity to consolidate multiple 74-series glue-logic functions onto a single reprogrammable device. The 0.18 µm CMOS process and 1.8V core operation balance power consumption against logic density for always-on industrial controllers. Its JTAG support (IEEE 1149.1) enables in-system firmware updates over the equipment's service lifetime without removing the PCB, critical for installed-base industrial systems. The ACEX 1K family has been deployed in PLCs, motor controllers, and HMI processors since 2000, with proven long-term reliability in factory automation environments.
推荐
Telecommunications Glue Logic
The EP1K30F256-3's 909 MHz maximum internal clock frequency and MultiVolt I/O support (2.5V/3.3V LVTTL, LVCMOS, PCI, SSTL) make it suitable for telecommunications glue logic functions such as bus bridging, protocol conversion, and timing alignment between TDM/SONET framers, SERDES devices, and network processors. The 171 available I/O pins accommodate wide parallel buses with margin for control signals and status LEDs. Embedded Array Blocks (EABs) provide distributed FIFO buffers for cell/packet buffering between protocol layers. The FBGA-256 package's high pin density suits space-constrained telecom line cards and base-station equipment where PCB real estate is at a premium.
推荐
ASIC Prototyping and Emulation
The EP1K30F256-3 delivers 30,000 equivalent gates of SRAM-based logic with JTAG-driven in-system reprogrammability, making it an effective vehicle for ASIC prototyping and pre-silicon validation. Engineers can map RTL designs onto the 1,728 logic elements and 216 CLBs to validate functional behavior, test bench compatibility, and clock-domain crossing before committing to mask-set fabrication. The Quartus II design flow supports rapid iteration with synthesis, place-and-route, and timing analysis in a single tool chain. The 24,576 bits of embedded RAM allow emulation of register files, scratchpad memories, and small FIFOs that mirror the target ASIC's memory architecture.
推荐
Legacy Equipment Field Replacement
The EP1K30F256-3 remains a field-replacement option for legacy industrial, medical, and aerospace equipment originally designed around the ACEX 1K family in the 2000-2005 timeframe. Its NRND status means new designs should target Cyclone II/III/IV, but the EP1K30F256-3's identical pinout and proven in-service reliability make it the lowest-risk replacement for end-of-life support contracts and regulatory re-qualification scenarios where PCBA redesign would require fresh agency approvals (UL, CE, FDA). Distributors typically stock factory-fresh EP1K30F256-3 units specifically for these long-lifecycle maintenance applications.
推荐
Low-Volume ASIC Replacement
For low-to-medium volume production (typically 100-10,000 units annually), the EP1K30F256-3 offers a programmable alternative to mask-set ASICs, eliminating NRE charges and tooling lead times while providing design flexibility for late-stage specification changes. The ACEX 1K family's mature tool support (Quartus II 13.0) and wide third-party IP library availability reduce development risk. The 1.8V core voltage and 0.18 µm process deliver acceptable power efficiency for consumer and prosumer products not requiring maximum battery life. The FBGA-256 package supports compact form factors in handheld instruments and portable test equipment.
推荐
Embedded Control and Interface Bridging
The EP1K30F256-3's combination of 1,728 logic elements, 171 I/O pins, and embedded RAM makes it well-suited to embedded control applications requiring multiple peripheral interfaces bridged together - such as I2C-to-SPI converters, GPIO expanders with debouncing and PWM generation, and custom UART multiplexing logic. The MultiVolt I/O support allows direct interfacing with 2.5V and 3.3V microcontrollers without level shifters, simplifying BOM. The on-chip PLL provides flexible clock synthesis for peripherals operating at non-integer multiples of the system clock. For embedded Linux platforms, the EP1K30F256-3 can offload real-time deterministic tasks from the main processor.
推荐
推荐产品汇总
工程参考数据： EP1K30F256-3 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1K30FC256-3 | EP1K30FI256-2 | EP1K30FC256-2 | EP1K30FC256-1 | EP1K100FC256-3 | EP1K100FI256-2 |
|---|---|---|---|---|---|---|---|
| Package | FBGA-256 | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 4,992 | 4,992 |
| Equivalent Gates | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 | 100,000 | 100,000 |
| Speed Grade | -3 | -3 | -2 | -2 | -1 | -3 | -2 |
| User I/O Pins | 171 | 171 | 171 | 171 | 171 | 171 | 171 |
| Embedded Memory (bits) | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 | 49,152 | 49,152 |
关键差异点
- Mid-density 30K-gate sweet spot in ACEX 1K family （对比 EP1K10TC144-3)
- Highest speed grade (-3) within EP1K30 density （对比 EP1K30FC256-2)
- FBGA-256 package with 171 I/O for high-density designs （对比 EP1K30QI208-2)
设计说明
The EP1K30F256-3 requires a stable 1.8V core supply with maximum ±5% tolerance for reliable SRAM configuration cell operation. Add at least three decoupling capacitors (10 µF bulk + 0.1 µF + 0.01 µF high-frequency) within 5 mm of each VCCINT pin group. The I/O banks (VCCIO) can be powered at 2.5V or 3.3V independently, allowing mixed-voltage interfacing. During configuration, the device draws peak currents up to 500 mA - ensure the 1.8V regulator can sustain this transient without sagging below the minimum VCCINT threshold, which causes configuration failure.
Estimated: The FBGA-256 package has a typical θJA of approximately 18-22 C/W on a 4-layer JEDEC test board. At maximum toggle activity (171 I/O at 100 MHz, all internal logic active), the EP1K30F256-3 can dissipate 1.5-2.5W. For continuous operation above ambient 60C, add thermal vias under the BGA thermal pad and use at least 1 oz copper on inner planes. Industrial temperature grade parts (-40C to +100C junction) require additional thermal margin for fanless enclosed installations.
The FBGA-256 package uses a 1.0 mm ball pitch (verify from datasheet mechanical drawing) requiring laser-drilled microvias or 0.4 mm via-in-pad technology for the inner rows of balls. Escape routing must use 0.1 mm (4 mil) trace width and 0.075 mm space to fan out from the inner ball grid. Place the configuration PROM (EPC2 or EPC8) within 50 mm of the FPGA's DCLK and DATA0 pins to meet setup/hold timing. Use controlled-impedance routing (50 ohm single-ended) for high-speed LVTTL/LVCMOS signals above 100 MHz.
Do not assume EP1K30F256-3 and EP1K30FC256-3 are fully interchangeable - the temperature grade ('C' vs 'I' suffix interpretation varies by datasheet revision) and configuration mode bits may differ. Always check the device marking and confirm the configuration bitstream against the exact part ordered. The 'F' suffix in 'F256' indicates the FineLine BGA package, but earlier revisions used non-FineLine BGA with different thermal performance. Pull MSEL[2:0] pins to the correct logic level for your desired configuration mode (AS, AP, PS, JTAG) before power-up.
合规信息
ACEX 1K family was originally designed in the late 1990s/early 2000s; RoHS/REACH compliance status is not clearly stated in the verified web data. The device is not AEC-Q100 qualified (industrial/commercial grade FPGA, not automotive). Compliance certifications for hazardous-substance regulations should be verified directly with the manufacturer or authorized distributor before use in regions requiring explicit RoHS/REACH declarations.
