EP1K30F256-3 - 30K Gates ACEX 1K FPGA, 256-BGA, -3 Speed | Altera
MPN: EP1K30F256-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $21.8 | $2,180.00 |
| 500 | $18.4 | $9,200.00 |
| 1,000 | $15.6 | $15,600.00 |
Drop-in alternatives for EP1K30F256-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K30FC256-3
✅ Drop-In✓ In Stock
$11.1 / Unit
View Datasheet →EP1K30FI256-2
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$18.2 / Unit
View Datasheet →EP1K30FC256-2
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View Datasheet →EP1K30FC256-1
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$17.85 / Unit
View Datasheet →EP1K100FC256-3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EP1K100FI256-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EP1K30F256-3 Maximum Ratings & Electrical Characteristics
| Family | ACEX 1K |
| Logic Elements | 1,728 |
| Equivalent Gates | 30,000 |
| Configurable Logic Blocks (CLBs) | 216 |
| Embedded Memory (RAM bits) | 24,576 |
| Maximum User I/O Pins | 171 |
| Maximum Clock Frequency | 909 MHz |
| Speed Grade | -3 |
| Core Voltage | 1.8 V |
| Process Technology | 0.18 µm CMOS SRAM |
| Package | FBGA-256 (FineLine BGA) |
| Mounting Type | Surface Mount (BGA) |
| Configuration Method | SRAM (requires external configuration device) |
| JTAG Support | Yes (IEEE 1149.1 / IEEE 1532) |
| PLL | Yes (on-chip) |
EP1K30F256-3 fbga-256 (fineline bga) Pin Configuration Guide
Complete pinout information for EP1K30F256-3 (fbga-256 (fineline bga) package) with 171 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K30F256-3.
Refer to the datasheet for full pin configuration.
Estimated pin count: 171 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K30F256-3 is suitable for 6 applications: Industrial Control Logic Integration, Telecommunications Glue Logic, ASIC Prototyping and Emulation, Legacy Equipment Field Replacement, Low-Volume ASIC Replacement, Embedded Control and Interface Bridging.
Industrial Control Logic Integration
The EP1K30F256-3 fits industrial control logic integration where its 1,728 logic elements, 171 user I/O pins, and 24,576 bits of embedded memory provide enough capacity to consolidate multiple 74-series glue-logic functions onto a single reprogrammable device. The 0.18 µm CMOS process and 1.8V core operation balance power consumption against logic density for always-on industrial controllers. Its JTAG support (IEEE 1149.1) enables in-system firmware updates over the equipment's service lifetime without removing the PCB, critical for installed-base industrial systems. The ACEX 1K family has been deployed in PLCs, motor controllers, and HMI processors since 2000, with proven long-term reliability in factory automation environments.
Recommended
Telecommunications Glue Logic
The EP1K30F256-3's 909 MHz maximum internal clock frequency and MultiVolt I/O support (2.5V/3.3V LVTTL, LVCMOS, PCI, SSTL) make it suitable for telecommunications glue logic functions such as bus bridging, protocol conversion, and timing alignment between TDM/SONET framers, SERDES devices, and network processors. The 171 available I/O pins accommodate wide parallel buses with margin for control signals and status LEDs. Embedded Array Blocks (EABs) provide distributed FIFO buffers for cell/packet buffering between protocol layers. The FBGA-256 package's high pin density suits space-constrained telecom line cards and base-station equipment where PCB real estate is at a premium.
Recommended
ASIC Prototyping and Emulation
The EP1K30F256-3 delivers 30,000 equivalent gates of SRAM-based logic with JTAG-driven in-system reprogrammability, making it an effective vehicle for ASIC prototyping and pre-silicon validation. Engineers can map RTL designs onto the 1,728 logic elements and 216 CLBs to validate functional behavior, test bench compatibility, and clock-domain crossing before committing to mask-set fabrication. The Quartus II design flow supports rapid iteration with synthesis, place-and-route, and timing analysis in a single tool chain. The 24,576 bits of embedded RAM allow emulation of register files, scratchpad memories, and small FIFOs that mirror the target ASIC's memory architecture.
Recommended
Legacy Equipment Field Replacement
The EP1K30F256-3 remains a field-replacement option for legacy industrial, medical, and aerospace equipment originally designed around the ACEX 1K family in the 2000-2005 timeframe. Its NRND status means new designs should target Cyclone II/III/IV, but the EP1K30F256-3's identical pinout and proven in-service reliability make it the lowest-risk replacement for end-of-life support contracts and regulatory re-qualification scenarios where PCBA redesign would require fresh agency approvals (UL, CE, FDA). Distributors typically stock factory-fresh EP1K30F256-3 units specifically for these long-lifecycle maintenance applications.
Recommended
Low-Volume ASIC Replacement
For low-to-medium volume production (typically 100-10,000 units annually), the EP1K30F256-3 offers a programmable alternative to mask-set ASICs, eliminating NRE charges and tooling lead times while providing design flexibility for late-stage specification changes. The ACEX 1K family's mature tool support (Quartus II 13.0) and wide third-party IP library availability reduce development risk. The 1.8V core voltage and 0.18 µm process deliver acceptable power efficiency for consumer and prosumer products not requiring maximum battery life. The FBGA-256 package supports compact form factors in handheld instruments and portable test equipment.
Recommended
Embedded Control and Interface Bridging
The EP1K30F256-3's combination of 1,728 logic elements, 171 I/O pins, and embedded RAM makes it well-suited to embedded control applications requiring multiple peripheral interfaces bridged together - such as I2C-to-SPI converters, GPIO expanders with debouncing and PWM generation, and custom UART multiplexing logic. The MultiVolt I/O support allows direct interfacing with 2.5V and 3.3V microcontrollers without level shifters, simplifying BOM. The on-chip PLL provides flexible clock synthesis for peripherals operating at non-integer multiples of the system clock. For embedded Linux platforms, the EP1K30F256-3 can offload real-time deterministic tasks from the main processor.
Recommended
Recommended Products Summary
Engineering reference data for EP1K30F256-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K30FC256-3 | EP1K30FI256-2 | EP1K30FC256-2 | EP1K30FC256-1 | EP1K100FC256-3 | EP1K100FI256-2 |
|---|---|---|---|---|---|---|---|
| Package | FBGA-256 | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 4,992 | 4,992 |
| Equivalent Gates | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 | 100,000 | 100,000 |
| Speed Grade | -3 | -3 | -2 | -2 | -1 | -3 | -2 |
| Temperature Grade | [DATA_NEEDED] | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| User I/O Pins | 171 | 171 | 171 | 171 | 171 | 171 | 171 |
| Embedded Memory (bits) | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 | 49,152 | 49,152 |
Key Differentiators
- Mid-density 30K-gate sweet spot in ACEX 1K family (vs EP1K10TC144-3)
- Highest speed grade (-3) within EP1K30 density (vs EP1K30FC256-2)
- FBGA-256 package with 171 I/O for high-density designs (vs EP1K30QI208-2)
Design Notes
The EP1K30F256-3 requires a stable 1.8V core supply with maximum ±5% tolerance for reliable SRAM configuration cell operation. Add at least three decoupling capacitors (10 µF bulk + 0.1 µF + 0.01 µF high-frequency) within 5 mm of each VCCINT pin group. The I/O banks (VCCIO) can be powered at 2.5V or 3.3V independently, allowing mixed-voltage interfacing. During configuration, the device draws peak currents up to 500 mA - ensure the 1.8V regulator can sustain this transient without sagging below the minimum VCCINT threshold, which causes configuration failure.
Estimated: The FBGA-256 package has a typical θJA of approximately 18-22 C/W on a 4-layer JEDEC test board. At maximum toggle activity (171 I/O at 100 MHz, all internal logic active), the EP1K30F256-3 can dissipate 1.5-2.5W. For continuous operation above ambient 60C, add thermal vias under the BGA thermal pad and use at least 1 oz copper on inner planes. Industrial temperature grade parts (-40C to +100C junction) require additional thermal margin for fanless enclosed installations.
The FBGA-256 package uses a 1.0 mm ball pitch (verify from datasheet mechanical drawing) requiring laser-drilled microvias or 0.4 mm via-in-pad technology for the inner rows of balls. Escape routing must use 0.1 mm (4 mil) trace width and 0.075 mm space to fan out from the inner ball grid. Place the configuration PROM (EPC2 or EPC8) within 50 mm of the FPGA's DCLK and DATA0 pins to meet setup/hold timing. Use controlled-impedance routing (50 ohm single-ended) for high-speed LVTTL/LVCMOS signals above 100 MHz.
Do not assume EP1K30F256-3 and EP1K30FC256-3 are fully interchangeable - the temperature grade ('C' vs 'I' suffix interpretation varies by datasheet revision) and configuration mode bits may differ. Always check the device marking and confirm the configuration bitstream against the exact part ordered. The 'F' suffix in 'F256' indicates the FineLine BGA package, but earlier revisions used non-FineLine BGA with different thermal performance. Pull MSEL[2:0] pins to the correct logic level for your desired configuration mode (AS, AP, PS, JTAG) before power-up.
Compliance Information
ACEX 1K family was originally designed in the late 1990s/early 2000s; RoHS/REACH compliance status is not clearly stated in the verified web data. The device is not AEC-Q100 qualified (industrial/commercial grade FPGA, not automotive). Compliance certifications for hazardous-substance regulations should be verified directly with the manufacturer or authorized distributor before use in regions requiring explicit RoHS/REACH declarations.
