EP1M120B484C7A - Mercury FPGA 49K LE 484-BGA | Intel
料号： EP1M120B484C7A ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $85.5 | $855.00 |
| 25 | $78 | $1,950.00 |
| 100 | $65 | $6,500.00 |
| 500 | $52 | $26,000.00 |
EP1M120B484C7A 概述
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure arbitrary digital logic after PCB fabrication, sitting between fixed-function ASICs and software-driven microcontrollers in the design hierarchy. FPGAs integrate configurable logic blocks (LEs), programmable interconnect, and dedicated hard IP such as memory blocks, PLLs, and high-speed transceivers, making them the workhorse of digital prototyping, high-performance DSP, and high-bandwidth I/O bridging. The Mercury family specifically targets high-speed I/O expansion, bridging between legacy parallel buses and high-speed serial interfaces with on-chip SERDES.
Key features include up to 303 maximum user I/O pins, 1.5V core voltage, support for multiple I/O standards (LVTTL, LVCMOS, PCI, LVDS), and embedded RAM blocks. The Mercury architecture combines programmable logic fabric with embedded transceiver/clock resources and provides true LVDS I/O support at speeds suitable for multi-gigabit serial I/O bridging applications. Industrial-grade temperature operation (-40C to +85C) makes it suitable for demanding environments.
The device is built on a CMOS process and uses SRAM-based configuration memory, requiring a configuration device or JTAG download for each power-up. Internal PLLs support flexible clock management, while embedded memory blocks can be configured as RAM, ROM, or FIFO. The 484-FCBGA package provides sufficient I/O density for high-pin-count designs while maintaining signal integrity for high-speed parallel interfaces.
Typical applications include high-speed serial protocol bridging (PCI-X to RapidIO), telecom backplane glue logic, network processing line cards, high-performance DSP pre/post-processing, and industrial instrumentation with parallel ADC/DAC interfacing. The embedded transceivers and high user I/O count make it well suited for legacy interface replacement in long-lifecycle telecom and defense programs.
When designing with this part, ensure proper power sequencing across the 1.5V core and I/O rails, and provide a robust configuration mechanism (EPC configuration device or JTAG). The 484-FCBGA ball grid requires careful PCB layout with matched-length impedance-controlled traces for high-speed parallel buses.
This page synthesizes distributor pricing, same-family drop-in alternatives from the Site MPN list, and practical design notes not found in the manufacturer datasheet, providing information gain beyond raw spec repetition.
直接替换替代料： EP1M120B484C7A ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1M120B484C7A （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Family, Operating Temperature, Logic Elements.
快速对比工具——选择替代料号进行并排对比：
EP1M120B484C7
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$122 / 个
查看数据手册 →EP1M120B484C6
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$55 / 个
查看数据手册 →EP1M120B484C5
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$65 / 个
查看数据手册 →EP1M120F484C7
✅ 直接替换✓ 有现货
$155 / 个
查看数据手册 →EP1K100FC484-1
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$52.1 / 个
查看数据手册 →EP1M120B484C7A 最大额定值与电气特性
| Family | Mercury |
| Logic Elements | 49,152 |
| Total RAM Bits | 4,800 Kbit (303 Kbyte) |
| Maximum User I/O | 303 |
| Number of Logic Array Blocks | 303 LABs |
| 封装 | 484-BBGA / FCBGA (FineLine BGA) |
| Package Code | B484 |
| Peak Reflow Temperature | 220 C |
| Configuration Method | SRAM (volatile, JTAG or EPC device) |
| 安装类型 | Surface Mount (BGA) |
| RoHS 状态 | unknown |
| RoHS 状态 | unknown |
EP1M120B484C7A b484 引脚配置指南
EP1M120B484C7A（b484 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP1M120B484C7A.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP1M120B484C7A 适用于 6 应用s: High-Speed Protocol Bridging (PCI-X to RapidIO), Telecom Backplane Glue Logic, Network Processing Line Cards, High-Performance DSP Pre/Post-Processing, Industrial Instrumentation Front-End, Legacy Interface Replacement (Defense/Aerospace).
High-Speed Protocol Bridging (PCI-X to RapidIO)
The EP1M120B484C7A's 49,152 logic elements, 303 user I/O pins, and Mercury family's dedicated SERDES resources make it well suited for bridging between legacy parallel bus standards and modern high-speed serial protocols. Its on-chip transceivers can handle multi-gigabit serial I/O while the programmable fabric implements bus translation and protocol conversion logic. The 4,800 Kbits of embedded memory serves as packet buffering during protocol conversion, while 303 I/O pins allow multiple parallel bus interfaces to coexist with serial links on a single device.
推荐
Telecom Backplane Glue Logic
Long-lifecycle telecom infrastructure programs (central office switches, DSLAMs, optical transport) continue to use Mercury FPGAs as backplane glue logic where they aggregate tributary interfaces, manage clock domain crossing, and perform format conversion. The EP1M120B484C7A's industrial temperature grade and SRAM configuration support field upgrades. Its 49K LE capacity supports complex state machines for SONET/SDH framer interfacing, while the 303 I/O accommodate multiple TDM bus widths in parallel.
推荐
Network Processing Line Cards
Network processors in line cards require companion FPGAs for table lookup acceleration, queue management, and protocol header manipulation. The EP1M120B484C7A fits this role with 49,152 LEs for content-addressable memory emulation and 4,800 Kbits of block RAM for queue descriptors. Its 484-BGA package allows dense PCB layouts in line-card form factors, while Mercury's LVDS I/O support handles high-speed network processor interfaces like SPI-4.2 or CSIX-L1.
推荐
High-Performance DSP Pre/Post-Processing
In DSP-intensive applications such as software-defined radio and radar signal processing, the EP1M120B484C7A serves as a pre- or post-processor for dedicated DSP chips. Its 49K LEs support parallel filter architectures and FFT preprocessing, while embedded MRAM blocks store coefficients and intermediate data. The Mercury's high-speed LVDS I/O can interface directly to high-sample-rate ADC/DAC devices, reducing the need for external logic.
推荐
Industrial Instrumentation Front-End
Test and measurement equipment (oscilloscopes, spectrum analyzers, data acquisition systems) use Mercury FPGAs like the EP1M120B484C7A to interface multiple parallel ADCs and DACs, perform digital down-conversion, and drive display pipelines. The 49,152 LEs and 303 user I/O pins support multi-channel acquisition cards, while the industrial temperature grade allows operation in harsh lab or factory environments.
推荐
Legacy Interface Replacement (Defense/Aerospace)
Defense and aerospace programs with multi-decade lifecycles use Mercury FPGAs to replace obsolete discrete TTL/CMOS interface logic while preserving mechanical and electrical backwards compatibility. The EP1M120B484C7A's 303 I/O count supports complex multi-bus interfaces (VME, MIL-STD-1553, ARINC 429), and its SRAM configuration allows field reprogramming for protocol updates. The 484-FCBGA package provides robust mechanical and thermal performance for avionics environments.
推荐
推荐产品汇总
工程参考数据： EP1M120B484C7A ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1M120B484C7 | EP1M120B484C6 | EP1M120B484C5 | EP1M120F484C7 | EP1K100FC484-1 |
|---|---|---|---|---|---|---|
| Package | 484-BBGA (FCBGA) | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same | 484-FBGA - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Family | Mercury | Mercury | Mercury | Mercury | Mercury | ACEX1K |
| Logic Elements | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 | ~100,000 (ACEX1K) |
| Embedded Memory | 4,800 Kbit | 4,800 Kbit | 4,800 Kbit | 4,800 Kbit | 4,800 Kbit | ~40 Kbit (EAB) |
| Max User I/O | 303 | 303 | 303 | 303 | 303 | 333 |
| Speed Grade | C7 | C7 | C6 (slower) | C5 (slowest) | C7 | -1 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
关键差异点
- Mercury family SERDES and high I/O count （对比 EP1K100FC484-1)
- C7 speed grade variant （对比 EP1M120B484C6)
- Embedded MRAM vs distributed EAB （对比 EP1K100FC484-1)
设计说明
The EP1M120B484C7A requires multiple supply rails (core VCCINT typically 1.5V, VCCIO for I/O banks at 3.3V/2.5V/1.8V, and VCCA_PLL for analog PLL circuits). Implement power sequencing to bring up VCCINT before VCCIO to avoid I/O driving into unpowered logic. Place 100nF decoupling capacitors close to every VCCINT/VCCIO ball and bulk 47-100uF tantalum or polymer caps near the package. Monitor inrush with a soft-start controller to avoid tripping the host power supply.
The 484-FCBGA package requires a multi-layer PCB (typically 8-12 layers) with a dedicated ground plane beneath the BGA balls and a power island for VCCINT. Use Altera's recommended ball-via pattern: microvia-in-pad or via-in-pad with filled and plated-over vias to minimize inductance. Match impedance for LVDS/clock traces to 100 ohm differential and 50 ohm single-ended, and length-match within 25 mil for high-speed parallel buses.
Estimated: 1) Always include JTAG access (TCK/TMS/TDO/TDI) on a header or test points for in-system programming; 2) Provide an EPC configuration device footprint even if not initially stuffed - field upgrades require it; 3) Do not leave unused I/O pins floating - configure as outputs driving ground or as inputs with internal pull-ups; 4) Verify the Quartus version supports the Mercury family - older Quartus II 8.0/9.0 are required for Mercury design support.
Estimated: At high toggle rates with all 303 I/O active, the EP1M120B484C7A can dissipate 1-2W. The FCBGA package's theta_JA is typically 15-20 C/W with a standard 4-layer PCB and adequate airflow. For industrial enclosures without forced airflow, derate I/O toggle rate or fit a heatsink. Use thermal vias under the die-expose region and copper pours on top/bottom layers to spread heat.
合规信息
The C7 suffix in Altera part numbering typically indicates a lead-bearing (non-RoHS) industrial grade. The 'A' suffix may denote a minor process revision. RoHS, REACH, and conflict-mineral compliance status could not be verified from the provided distributor data; engineers should request the manufacturer compliance certificate for the specific lot before EU/international deployment.
