EP1K50FC256-2 - ACEX-1K 50K Gates FPGA 256-BGA | Altera
料号： EP1K50FC256-2 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $88 | $880.00 |
| 100 | $78 | $7,800.00 |
| 500 | $68.5 | $34,250.00 |
| 1,000 | $62 | $62,000.00 |
EP1K50FC256-2 概述
A Field Programmable Gate Array (FPGA) is a programmable logic device that combines the density and flexibility of gate-array ASICs with the in-system reconfigurability of programmable logic. FPGAs sit at the top of the programmable-logic hierarchy (PAL/CPLD → FPGA) and consist of configurable logic blocks (LABs in Altera terminology), programmable interconnect, I/O elements, and optional embedded memory or multipliers. ACEX-1K specifically introduced embedded array blocks (EABs) that serve dual roles as logic or memory, a feature that preceded the modern M9K/M20K RAM blocks found in later Altera/Intel families.
Key features of the EP1K50FC256-2 include 50,000 typical gates, 2,880 logic cells, 360 LABs, 186 user I/Os, 2.5 V core supply with 5 V-tolerant I/O capability, in-system programmability via the IEEE 1149.1 JTAG interface, and on-chip phase-locked loops for clock management. The 256-ball FineLine BGA package enables compact board layouts while exposing enough I/O for wide parallel buses, video interfaces, or multiple serial channels.
Architecturally, the ACEX-1K family uses a 4-input look-up table (LUT) per logic element with cascaded carry chains for arithmetic and dedicated routing for fast local interconnect. The embedded array blocks (EABs) provide 2 Kbits of dual-port RAM each, allowing designers to build FIFO buffers, ROM lookup tables, and arithmetic megafunctions without external memory. The 0.22 µm process delivers a balance of cost and performance suitable for glue logic, bus interfacing, and moderate-complexity DSP pipelines.
Typical applications include industrial control and factory automation systems, telecommunications line cards, low-density digital signal processing, video processing front-ends, and prototype ASIC replacement. The combination of 50K gates, embedded RAM, and 186 I/Os makes the EP1K50 well suited to designs that bridge a microprocessor to legacy parallel buses or custom peripherals.
When designing with the EP1K50FC256-2, ensure proper power decoupling with 0.1 µF and 10 µF capacitors near each VCCINT/VCCIO ball, and follow Altera's JTAG programming guidelines for in-system configuration. Designers migrating from this legacy ACEX-1K device should consider Cyclone series FPGAs for new designs, as ACEX-1K has been superseded for several product generations.
直接替换替代料： EP1K50FC256-2 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1K50FC256-2 （相同外形与封装尺寸） ——差异在于 Process Technology, Configuration Method, Package, Operating Temperature, RoHS Status.
快速对比工具——选择替代料号进行并排对比：
EP1K50FC256-2N
✅ 直接替换✓ 有现货
$17.95 / 个
查看数据手册 →EP1K50FC256-1
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$18.95 / 个
查看数据手册 →EP1K50FC256-1N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$15.1 / 个
查看数据手册 →EP1K50F256-2N
✅ 直接替换✓ 有现货
$21.8 / 个
查看数据手册 →EP1K100FC256-2
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$27.6 / 个
查看数据手册 →EP1K100FC256-2N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$78.1951 / 个
查看数据手册 →EP1K50FC256-2 最大额定值与电气特性
| Series | ACEX-1K |
| Family | ACEX 1K Family |
| Logic Cells / Elements | 2,880 |
| Typical Gates | 50,000 |
| Number of LABs/CLBs | 360 |
| User I/Os | 186 |
| Total RAM Bits | 40,960 |
| Number of Gates | 50,000 |
| Voltage - Supply | 2.375 V to 2.625 V (nominal 2.5 V) |
| Process Technology | 0.22 µm CMOS |
| Propagation Delay | 0.4 ns (per Partstack listing) |
| 工作温度 | 0°C to +70°C (commercial) |
| 封装 / 外壳 | 256-BGA (FineLine BGA, 17x17 mm) |
| 安装类型 | Surface Mount |
| 安装方式 | SMD/SMT |
| Programming Type | In-System Programmable via JTAG (IEEE 1149.1) |
| Configuration Method | SRAM-based, volatile configuration |
| RoHS 状态 | Compliant |
| REACH Status | Compliant |
EP1K50FC256-2 256-bga (fineline bga, 17x17 mm) 引脚配置指南
EP1K50FC256-2（256-bga (fineline bga, 17x17 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP1K50FC256-2.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP1K50FC256-2 适用于 6 应用s: Industrial Control and Factory Automation, Telecommunications Line Cards, Video Processing Front-Ends, ASIC Prototype and Logic Emulation, Legacy Peripheral and Bus Bridging, Embedded Digital Signal Processing.
Industrial Control and Factory Automation
The EP1K50FC256-2's 50K gates and 186 user I/Os make it well suited for industrial PLCs, motor-control boards, and factory automation controllers where multiple parallel I/O channels drive sensors, relays, and stepper motors. Its 2.5 V core and 3.3 V-tolerant I/O align with industrial logic-level standards, while embedded array blocks (EABs) provide on-chip dual-port RAM for FIFO buffering of sensor data streams. Compared with discrete glue logic, the EP1K50FC256-2 reduces PCB area by integrating address decoding, bus arbitration, and timing logic into a single 256-ball BGA. Designers migrating legacy ACEX-1K designs should retain the device when form-fit-function compatibility is required by long-life industrial programs.
推荐
Telecommunications Line Cards
The EP1K50FC256-2 targets telecom line-interface cards where moderate logic density combines with many I/Os for TDM bus multiplexing, framing, and protocol conversion. Its 40,960 bits of embedded RAM implement small lookup tables and elastic FIFOs needed for HDLC/SDLC framing, while 186 I/Os fan out to multiple E1/T1 transceiver channels. The 256-ball BGA package supports compact card designs with controlled impedance routing. Engineers maintaining legacy telecom infrastructure value the EP1K50FC256-2 for its deterministic SRAM configuration and proven Quartus II toolchain support, though new designs should evaluate Cyclone IV or Cyclone V for active power savings.
推荐
Video Processing Front-Ends
The EP1K50FC256-2 delivers the logic and I/O bandwidth required for video processing front-ends such as NTSC/PAL decoders, video format converters, and LCD timing controllers. Its 50K gates comfortably implement line buffers, de-interlacers, and color-space converters, while the 256-ball BGA exposes enough I/O for 24-bit parallel RGB plus control signals. Embedded RAM blocks (EABs) implement dual-port line buffers without external SRAM. Designers must consider the device's 2.5 V core and configure I/O banks at 3.3 V to interface with legacy video ADCs. For modern HDMI/MIPI designs, migration to Cyclone IV GX or Cyclone V is recommended.
推荐
ASIC Prototype and Logic Emulation
The EP1K50FC256-2 serves as a cost-effective prototype vehicle for ASIC and ASSP designs up to 50,000 gates. Engineers port RTL from simulation to FPGA for real-time verification at near-ASIC speeds, validate I/O protocols with actual peripherals, and run software on embedded processors before tape-out. The 186 I/Os accommodate wide processor buses, while embedded RAM supports register files and cache emulation. The SRAM-based configuration allows rapid design iteration with JTAG programming. This prototyping use case remains popular in aerospace, medical, and industrial programs where design-for-FPGA prototypes reduce ASIC respin risk.
推荐
Legacy Peripheral and Bus Bridging
The EP1K50FC256-2 excels at bridging between modern processors and legacy peripherals such as ISA bus devices, parallel ATA drives, VMEbus cards, or proprietary backplanes. Its 186 user I/Os and 360 LABs implement bus arbiters, address decoders, and protocol converters in a single chip. The device's 0.4 ns propagation delay (per Partstack listings) supports 50 MHz operation sufficient for ISA and VMEbus timing. Aerospace and defense programs with long lifecycles continue to specify ACEX-1K FPGAs because the qualified silicon and toolchain have decades of reliability data. Stock availability is the main constraint.
推荐
Embedded Digital Signal Processing
The EP1K50FC256-2 supports moderate-complexity DSP applications such as audio processing, motor-control PWM generation, and low-rate communications modulation. Each LAB implements 16-bit multipliers and adders via cascaded carry chains, while EABs provide dual-port RAM for coefficient storage and delay lines. The 256-ball BGA package and 2.5 V core suit fan-less embedded boards. For sample rates above 10 MSPS, designers should evaluate Cyclone II DSP blocks or dedicated DSP chips, but the EP1K50FC256-2 remains a cost-effective choice for control-loop DSP where flexibility matters more than raw throughput.
推荐
推荐产品汇总
工程参考数据： EP1K50FC256-2 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1K50FC256-2N | EP1K50FC256-1 | EP1K50FC256-1N | EP1K50F256-2N | EP1K100FC256-2 | EP1K100FC256-2N |
|---|---|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | 256-BGA (FineLine BGA) | 256-BGA (FineLine BGA) - same | 256-BGA (FineLine BGA) - same | 256-BGA (FineLine BGA) - same | 256-BGA (FineLine BGA) - same | 256-BGA (FineLine BGA) - same | 256-BGA (FineLine BGA) - same |
| Typical Gates | 50,000 | 50,000 | 50,000 | 50,000 | 50,000 | 100,000 | 100,000 |
| Logic Elements / Cells | 2,880 | 2,880 | 2,880 | 2,880 | 2,880 | 4,992 | 4,992 |
| User I/Os | 186 | 186 | 186 | 186 | 186 | 186 | 186 |
| Speed Grade | -2 | -2 | -1 (slower) | -1 (slower) | -2 | -2 | -2 |
| Lead-Free / RoHS | No (SnPb finish) | Yes (lead-free) | No (SnPb finish) | Yes (lead-free) | Yes (lead-free) | No (SnPb finish) | Yes (lead-free) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
关键差异点
- Lead-free / RoHS-compliant equivalent available （对比 EP1K50FC256-2N)
- Pin-compatible speed grade options （对比 EP1K50FC256-1)
- Higher-density migration path within same package （对比 EP1K100FC256-2)
设计说明
Estimated: the EP1K50FC256-2 core draws roughly 200-400 mA at 2.5 V during typical operation, plus I/O current proportional to switching frequency. Place 0.1 µF ceramic decoupling capacitors within 5 mm of each VCCINT ball, and add 10 µF bulk capacitors per power quadrant. Use a star-ground topology to separate the FPGA's analog/digital grounds if the design has PLLs (ACE-1K has optional PLL support).
The 256-ball FineLine BGA requires careful PCB layout with via-in-pad techniques for proper thermal relief and signal integrity. Use 4-6 layer PCB with continuous ground plane beneath the BGA; escape traces on inner layers reduce crosstalk. Maintain 50 Ω controlled impedance for high-speed I/O signals. JTAG header must be accessible for in-system programming; route TCK, TMS, TDI, TDO with short stubs to minimize reflection.
Do not assume ACEX-1K FPGAs ship with preloaded configuration - they are SRAM-based and require configuration on every power-up. Add a configuration device (EPC2, EPC4, or compatible) or implement a microcontroller-based JTAG loader. Confirm VCCIO voltage matches connected logic levels; the EP1K50FC256-2 I/O banks can be configured for 2.5 V or 3.3 V operation. Programming via Quartus II (legacy) ensures proper bitstream generation.
Estimated: at 50K-gate utilization and 50 MHz operation, the EP1K50FC256-2 dissipates approximately 1-1.5 W of power. The 256-ball BGA package provides adequate thermal dissipation with a 4-layer PCB and ground plane; no external heatsink is typically required. For industrial applications with high ambient temperatures, ensure the PCB thermal vias beneath the BGA thermal balls reduce theta-JA by 30-50%.
合规信息
Original EP1K50FC256-2 uses SnPb terminal finish and is not RoHS compliant per Altera nomenclature (no 'N' suffix). RoHS-compliant equivalent is EP1K50FC256-2N. REACH compliance unknown per the verified web data. Not AEC-Q100 qualified; ACEX-1K is commercial/industrial grade only.
