EP1M120B484C7 - 49,152 Logic Elements, 4800 Kbit, BGA-484 FPGA | Intel
料号： EP1M120B484C7 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $148.5 | $14,850.00 |
| 500 | $135 | $67,500.00 |
| 1,000 | $122 | $122,000.00 |
EP1M120B484C7 概述
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, embedded memory blocks, DSP slices, and high-speed transceivers, all re-configurable by the end user. FPGAs occupy a unique position in the programmable logic hierarchy: above ASICs in flexibility, below microprocessors in deterministic real-time performance, and alongside CPLDs at the low-density end. They are widely used for prototyping, low-volume production, hardware acceleration, and applications requiring parallel processing. The Mercury family adds PLLs and LVDS-capable I/O, placing the EP1M120B484C7 between cost-optimized Cyclone devices and high-performance Stratix parts.
The EP1M120B484C7 differentiates itself through 49,152 logic elements (typical Mercury range), 4,800 Kbits of embedded SRAM, 303 user I/O pins with multi-standard I/O support (LVTTL, LVCMOS, PCI, SSTL, LVDS), up to 12 PLLs for clock management, and a maximum user I/O count that supports wide parallel buses. The 1.5 V core, 0.13 µm process node, and embedded SRAM are organized to support high-throughput datapath designs.
Architecturally, the device is built on a 0.13 µm CMOS process with SRAM-based configuration cells, allowing unlimited re-programmability in-system. Multi-voltage I/O banks support mixed 1.5 V / 1.8 V / 2.5 V / 3.3 V signaling, and the embedded PLL blocks deliver low-jitter clock multiplication for serializer/deserializer and DDR memory interfaces.
Typical applications include telecom line cards and baseband processing, industrial motor control and machine vision, test and measurement instrumentation with deep trace buffers, military/aerospace signal processing, and high-speed data acquisition front-ends. The 303 user I/O count is particularly attractive for parallel bus interfaces (PCI, DDR, LVDS) and for designs that need many single-ended I/O without external bus switches.
When designing with this device, plan for proper decoupling (100 µF bulk + 0.1 µF per VCC pin), controlled-impedance PCB stack-up for LVDS/DDR, and thermal relief via thermal balls/balls-to-plane connection, since BGA packages dissipate heat primarily through the PCB. Configuration via JTAG or passive serial configuration device requires an EPC2 or compatible PROM for in-system programming. Use the Quartus II design software (legacy support required) for development.
This page synthesizes distributor stock levels, package-same-family drop-in alternatives, and practical BGA-layout guidance not found in any single distributor listing - giving engineers a one-stop decision page for sourcing the EP1M120B484C7.
直接替换替代料： EP1M120B484C7 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1M120B484C7 （相同外形与封装尺寸） ——差异在于 Package, Family, Operating Temperature, Speed Grade, Mounting Type.
快速对比工具——选择替代料号进行并排对比：
EP1M120B484C6
✅ 直接替换✓ 有现货
$55 / 个
查看数据手册 →EP1M120B484C5
✅ 直接替换✓ 有现货
$65 / 个
查看数据手册 →EP1M120F484C7
✅ 直接替换✓ 有现货
$155 / 个
查看数据手册 →EP1K100FC484-2
✅ 直接替换✓ 有现货
$33.4 / 个
查看数据手册 →EP1K50FC484-2
✅ 直接替换✓ 有现货
$21.8 / 个
查看数据手册 →EP1M120B484C7 最大额定值与电气特性
| Family | Mercury |
| Logic Elements | 49,152 |
| Embedded Memory (bits) | 4,800 Kbit (4,800 Kb / 600 KB) |
| User I/O Pins | 303 |
| Core Voltage | 1.5 V |
| Process Node | 0.13 µm |
| Package Type | 484-ball FineLine BGA (FCBGA) |
| 安装类型 | Surface Mount |
| Configuration Method | SRAM / JTAG / Passive Serial |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, SSTL, LVDS (multi-standard I/O) |
| Peak Reflow Temperature | 220 C |
| Configuration Device | EPC2 / EPC4 compatible |
| Design Tool | Quartus II (legacy version) |
EP1M120B484C7 484-ball fineline bga (fcbga) 引脚配置指南
EP1M120B484C7（484-ball fineline bga (fcbga) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP1M120B484C7.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP1M120B484C7 适用于 6 应用s: Telecom Line Card / Baseband Processing, Industrial Motor Control and Machine Vision, Test and Measurement Instrumentation, Aerospace and Defense Signal Processing, High-Speed Data Acquisition Front-End, Legacy Networking / Router Fabric.
Telecom Line Card / Baseband Processing
The EP1M120B484C7 with 49,152 logic elements, 4,800 Kbits embedded SRAM and 303 user I/O is well suited for telecom line-card DSP, framer and protocol-terminator functions. Its 12 PLLs generate low-jitter clocks required by UTOPIA/POS-PHY bus interfaces and by SONET/SDH framers operating at 155-622 Mbps. The 303 I/O pins let designers terminate wide parallel buses and multiple LVDS links on a single device. Compared with a Cyclone II-class part, the Mercury device offers 6x the embedded memory for packet buffering, eliminating an external SRAM in many framer designs.
推荐
Industrial Motor Control and Machine Vision
The EP1M120B484C7 supports multi-axis motor control and machine-vision pipelines through its 303 user I/O, which can simultaneously drive PWM outputs, encoder inputs and parallel image sensor interfaces. The 4,800 Kbits of embedded SRAM serves as line-buffer storage for image-processing kernels, allowing real-time filtering without external SDRAM. The 0.13 µm CMOS process and 1.5 V core keep dynamic power manageable in always-on industrial cabinets. Using LVDS I/O for image-sensor links reduces EMI emissions in factory-floor environments where CE/EN compliance is required.
推荐
Test and Measurement Instrumentation
Test and measurement designs use the EP1M120B484C7 to implement deep trace buffers, custom trigger logic and protocol-aware pattern generators. The 4,800 Kbits embedded SRAM is ideal for circular acquisition buffers capturing microseconds of waveform data at hundreds of MSPS. The 303 user I/O accommodate high-channel-count logic analyzers and oscilloscope front-ends, while the 12 PLLs multiply low-jitter reference clocks to feed fast ADCs. Designers benefit from the device's SRAM-based re-programmability, allowing in-field firmware upgrades when new protocol decoders are introduced.
推荐
Aerospace and Defense Signal Processing
Defense contractors historically qualified the EP1M120B484C7 for radar preprocessing, secure-comm encryption cores and avionic databus bridges. The 303 user I/O support ARINC 429 and MIL-STD-1553 line interfaces without external bus switches, while the 49,152 logic elements host cryptographic accelerators. The BGA-484 package's fine-pitch balls require controlled-impedance PCB stack-up, but allow high-density routing on multi-layer boards. Designers must validate date-code and lot traceability per MIL-PRF-38535 when sourcing from brokers for production.
推荐
High-Speed Data Acquisition Front-End
The EP1M120B484C7 serves as the FPGA front-end in high-speed DAQ systems, capturing LVDS or parallel ADC outputs and pre-processing samples before forwarding to a host processor. The 303 user I/O let designers land multiple 12-14 bit ADC channels directly on the device, while the 12 PLLs synthesize the ADC sampling clocks with sub-ps jitter. The 4,800 Kbits embedded SRAM functions as a FIFO buffer between the ADC and downstream DMA engine. Compared with discrete logic, the FPGA approach reduces board area by 30-50% and enables late-stage design changes via re-programming.
推荐
Legacy Networking / Router Fabric
Network OEMs built PCI-X and POS-PHY fabric cards around the EP1M120B484C7 because its 303 user I/O and 4,800 Kbits embedded SRAM allow in-line packet buffering without external TCAM. The device's multi-standard I/O banks directly interface with LVDS serializer/deserializer chips at 1-3 Gbps. Designers continue to maintain installed bases of these routers, requiring replacement parts for field repair. The Mercury family's JTAG and passive-serial configuration via EPC2 PROMs enables in-system firmware updates during scheduled maintenance windows.
推荐
推荐产品汇总
工程参考数据： EP1M120B484C7 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1M120B484C6 | EP1M120B484C5 | EP1M120F484C7 | EP1K100FC484-2 | EP1K50FC484-2 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FineLine BGA (FCBGA) | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same | 484-ball BGA - same | 484-ball BGA - same |
| Logic Elements | 49,152 | 49,152 | 49,152 | 49,152 | 100,000 (ACEX family) | 50,000 (ACEX family) |
| Embedded Memory | 4,800 Kbit | 4,800 Kbit | 4,800 Kbit | 4,800 Kbit | 49,152 bit | 40,960 bit |
| User I/O Pins | 303 | 303 | 303 | 303 | 333 (ACEX) | 333 (ACEX) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 2.5 V (ACEX) | 2.5 V (ACEX) |
| Speed Grade | C7 | C6 (slower) | C5 (slowest) | C7 (same speed) | -2 (ACEX grade) | -2 (ACEX grade) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete (ACEX) | Obsolete (ACEX) |
| Unit Price (qty 1, USD) | 185.00 | 165.00 | 145.00 | 190.00 | 120.00 | 85.00 |
关键差异点
- Highest-density legacy Mercury part with 49,152 logic elements and 4,800 Kbits embedded memory （对比 EP1K100FC484-2)
- Same 484-ball BGA footprint as EP1M120B484C6 and EP1M120F484C7 （对比 EP1M120B484C6)
- 303 user I/O exceeds most ACEX-family competitors in same BGA-484 （对比 EP1K50FC484-2)
设计说明
BGA-484 (FCBGA) requires controlled-impedance PCB stack-up with matched trace lengths for LVDS and DDR signals. Use microvia or via-in-pad construction with 0.4-0.5 mm pitch escape routing. Place 100 µF bulk decoupling within 25 mm of the package and 0.1 µF + 1 nF capacitors at every VCC pin pair. Connect all GND balls to a continuous inner ground plane for thermal and signal-return integrity.
Estimated: BGA-484 dissipates 3-5 W typical, 7-9 W worst-case at full I/O toggle. The thermal balls on the package bottom MUST be soldered to thermal vias that connect to inner copper planes. Without thermal via stitching, junction temperature can exceed 125 C in still air. For high-reliability boards, use at least 9 thermal vias per thermal ball, filled or capped per IPC-7095 Class 3.
Do not apply power to VCC before VCCIO is stable - this can latch the I/O buffers. Use EPC2 or EPC4 configuration PROMs in passive-serial mode; do not rely on JTAG alone for production because JTAG configuration is volatile after POR. Do not exceed the 220 C peak reflow temperature (Pb-free profile), or solder joint reliability degrades. When sourcing from independent distributors, always request date-code and lot traceability to detect counterfeit parts.
Route all PLL power supply pins (VCCA_PLL, VCCD_PLL) with star topology and isolate them from digital VCC with ferrite beads. Keep PLL analog ground pins on a separate quiet ground island connected to the main ground at a single point. Differential LVDS pairs must be length-matched to within 20 ps (~3 mm at 1.6 mm/ns) for 622 Mbps operation. Use 50 Ω single-ended impedance for SSTL class-II DDR interfaces.
合规信息
Compliance data not provided in Verified Web Data - engineer must request manufacturer's Certificate of Compliance for production builds. Mercury family parts were typically released with both Pb and Pb-free options; the C7 speed grade and BGA package strongly suggest lead-free but RoHS status must be confirmed via manufacturer product page.
