EP1S25F672C6 - Stratix FPGA 25,660 LE | Intel | BGA-672
料号： EP1S25F672C6 ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $168.5 | $1,685.00 |
| 100 | $152 | $15,200.00 |
| 500 | $138 | $69,000.00 |
| 1,000 | $125 | $125,000.00 |
EP1S25F672C6 概述
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect, allowing hardware designers to implement custom digital logic after fabrication. The Stratix family sits within Intel's (formerly Altera's) programmable logic hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit (IC) -> semiconductor. FPGAs differ from ASICs in that they can be re-programmed in-system, providing rapid prototyping and field upgradability.
Key features of the EP1S25F672C6 include 2,852 Configurable Logic Blocks (CLBs) organized as 25,660 logic elements, 14 embedded DSP blocks, up to 473 user I/O pins, and MultiVolt I/O support for 1.5V, 1.8V, 2.5V, and 3.3V interfaces. The device supports up to 256 Kbytes of TriMatrix embedded memory using 4 Kbit M512, 32 Kbit M4K, and 512 Kbit M-RAM blocks, providing flexible on-chip storage for buffers, FIFOs, and look-up tables.
The architecture combines a high-bandwidth TriMatrix memory subsystem with dedicated DSP blocks optimized for FIR filters and FFT computations. Internal clock management uses up to 12 PLLs (including enhanced PLLs), supporting multiple clock domains and zero-delay buffer configurations. The 130nm CMOS process and 1.5V core power deliver low static power relative to competing 0.13um FPGAs of the era.
Typical applications include high-speed data acquisition cards, baseband processing for wireless base stations, software-defined radio (SDR), medical imaging pipelines, and industrial machine vision. Designers frequently choose the EP1S25F672C6 for new designs and migration paths because its combination of logic density, DSP throughput, and abundant I/O fits mid-range DSP and protocol-bridging tasks.
When designing with this device, allocate sufficient PCB layers for the 672-ball BGA escape routing and follow Altera's Stratix Hardware Reference Manual guidelines for power plane stitching, decoupling capacitor selection, and JTAG chain topology. Plan JTAG configuration source (EPCS serial configuration device, Fast Passive Parallel, or JTAG) at project start to avoid late-stage board rework.
This page synthesizes distributor pricing, drop-in same-package alternatives sourced from the Stratix family cross-reference, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： EP1S25F672C6 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1S25F672C6 （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Speed Grade, Configuration Method, Family.
快速对比工具——选择替代料号进行并排对比：
EP1S25F672C6N
✅ 直接替换✓ 有现货
$192.75 / 个
查看数据手册 →EP1S25F672C7N
✅ 直接替换✓ 有现货
$535 / 个
查看数据手册 →EP1S25F672C5N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$142 / 个
查看数据手册 →EP1S25B672C6
✅ 直接替换✓ 有现货
$990 / 个
查看数据手册 →EP1S25B672C6N
✅ 直接替换✓ 有现货
$198 / 个
查看数据手册 →EP1S20F672C6
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$470 / 个
查看数据手册 →EP1S25F672C6 最大额定值与电气特性
| Family | Stratix |
| Logic Elements | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,852 |
| Total RAM Bits | 1,944,576 |
| DSP Blocks | 14 |
| Maximum User I/O | 473 |
| 封装 | 672-BBGA (FineLine BGA, 35 x 35 mm, 1.27 mm pitch) |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| 工作温度 | 0C to +85C (Commercial) |
| Logic Family | CMOS |
| Speed Grade | 6 |
| Configuration Method | JTAG, Passive Serial, Fast Passive Parallel, Active Serial |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
| PLL Count (Maximum) | 12 (including enhanced PLLs) |
EP1S25F672C6 672-bbga (fineline bga, 35 x 35 mm, 1.27 mm pitch) 引脚配置指南
EP1S25F672C6（672-bbga (fineline bga, 35 x 35 mm, 1.27 mm pitch) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP1S25F672C6.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP1S25F672C6 适用于 6 应用s: Wireless Base Station Baseband Processing, High-Speed Data Acquisition Cards, Software Defined Radio (SDR) Platforms, Medical Imaging Pipeline (Ultrasound / CT), Industrial Machine Vision Inspection, Protocol Bridging and Custom Interface Aggregation.
Wireless Base Station Baseband Processing
The EP1S25F672C6 fits wireless base station baseband processing because its 25,660 logic elements, 14 dedicated DSP blocks, and 1,944,576 RAM bits provide the computational headroom needed for multi-carrier modulation, channel coding, and FFT/iFFT operations on 3G/4G baseband datapaths. The Stratix DSP blocks implement 9x9, 18x18, and 36x36 multipliers with full precision, allowing a single block to handle complex multiplications used in QAM demodulation. Its 12 PLLs support multiple reference clocks for radio card synchronization to GPS or backhaul network references. Designers typically instantiate multiple MAC (Medium Access Control) channels, Turbo or Viterbi decoders, and uplink scrambling functions in parallel, with on-chip TriMatrix memory used for soft-decision buffers and interleaver tables.
推荐
High-Speed Data Acquisition Cards
For high-speed data acquisition cards, the EP1S25F672C6's combination of 473 user I/O, abundant TriMatrix memory (up to 256 Kbytes across M512/M4K/M-RAM blocks), and parallel DSP throughput enables multi-channel ADC capture with on-chip pre-processing. The MultiVolt I/O supports direct interfacing to 1.5V, 1.8V, 2.5V, and 3.3V ADCs without level translators, reducing board complexity and BOM. Designers can implement FIR decimation filters, channel calibration, and trigger logic in fabric, while storing pre-trigger samples in on-chip M4K blocks. The 1.5V core and 130nm CMOS process yield static power levels compatible with PCI/PCIe card thermal envelopes. Typical deployment: 8-channel 14-bit 125 MSPS ADC arrays feeding LVDS pairs into the FPGA for digital down-conversion.
推荐
Software Defined Radio (SDR) Platforms
The EP1S25F672C6 is well suited to software defined radio platforms because its DSP block count (14), logic density, and abundant memory enable real-time DDC (digital down-conversion), DUC (digital up-conversion), and arbitrary waveform modulation across wide bandwidths. SDR implementations partition signal processing into baseband sampling, channelization, and demodulation stages; the Stratix's TriMatrix memory acts as sample-rate conversion buffers and FFT twiddle-factor storage. The 12 PLLs allow independent sample-rate domains for ADC and DAC paths plus an LO reference. Combined with an external ADC such as the AD9862 or DAC5687, the EP1S25F672C6 implements complete SDR transceivers for tactical radio, public safety, and academic research platforms operating from HF through C-band IF frequencies.
推荐
Medical Imaging Pipeline (Ultrasound / CT)
The EP1S25F672C6 supports medical imaging pipelines in ultrasound and CT modalities where beamforming, image reconstruction, and real-time filtering demand high logic density combined with deterministic throughput. In ultrasound, multiple transducer channels (64-256) are beamformed in parallel using the FPGA's DSP blocks to compute delay-and-sum across each scanline at kHz rates; the abundant M4K memory holds channel sample histories while M-RAM stores beamformed line buffers before scan conversion. The 473 user I/O pins interface to multi-channel ADC front-ends such as the AD9271 ultrasound AFE without multiplexing. IEC 60601-1 medical safety compliance is achieved at the system level; the FPGA itself operates reliably within the 0-85C commercial range inside a temperature-controlled chassis.
推荐
Industrial Machine Vision Inspection
The EP1S25F672C6 enables industrial machine vision systems by providing parallel image processing for line-scan and area-scan cameras running at 100-500 MHz pixel rates. Its 14 DSP blocks accelerate Sobel, Laplacian, and convolution kernels used for edge detection and defect identification, while the TriMatrix memory buffers full-frame images at GigE Vision or Camera Link rates. The MultiVolt I/O interfaces directly to Camera Link receivers and LVDS image sensors without external translators. Machine vision deployments commonly chain FPGA preprocessing (filtering, thresholding, blob analysis) with a host CPU for classification; the Stratix acts as a deterministic preprocessor, reducing host CPU load and increasing inspection throughput on factory lines running at 60+ parts per minute.
推荐
Protocol Bridging and Custom Interface Aggregation
The EP1S25F672C6 is widely used in protocol bridging applications where multiple standard interfaces (PCI, PCI-X, RapidIO, Utopia, SPI, I2C, UART) must be aggregated, rate-matched, and forwarded to a host processor or ASIC. Its 473 user I/O and 12 PLLs allow simultaneous operation of multiple clock domains - critical for bridging asynchronous protocols like SATA (via external PHY) to a system backplane running at a different reference clock. The TriMatrix memory provides shared FIFOs for cross-clock-domain buffering, while the logic density accommodates custom state machines and DMA engines. Networking OEMs and storage system builders used the original Stratix for top-of-rack switches, storage controllers, and custom telecom line cards in the 2005-2010 timeframe.
推荐
推荐产品汇总
工程参考数据： EP1S25F672C6 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1S25F672C6N | EP1S25F672C7N | EP1S25F672C5N | EP1S25B672C6 | EP1S20F672C6 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-BBGA (FineLine BGA, 35 x 35 mm, 1.27 mm pitch) | 672-BBGA (FineLine BGA, 35 x 35 mm) - same | 672-BBGA (FineLine BGA, 35 x 35 mm) - same | 672-BBGA (FineLine BGA, 35 x 35 mm) - same | 672-BBGA (FineLine BGA, 35 x 35 mm) - same | 672-BBGA (FineLine BGA, 35 x 35 mm) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 (with transceivers) | 18,460 (-28%) |
| Speed Grade | 6 | 6 | 7 (15-20% faster) | 5 (slower, lower cost) | 6 | 6 |
| Lead-Free | No (standard SnPb BGA) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | No | No |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,669,248 (-14%) |
| DSP Blocks | 14 | 14 | 14 | 14 | 14 | 10 (-29%) |
| Embedded Transceivers | No | No | No | No | Yes (3.125 Gbps) | No |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
关键差异点
- Lead-free BGA variant for RoHS-regulated markets （对比 EP1S25F672C6 (standard SnPb BGA))
- Embedded 3.125 Gbps transceivers for serial I/O （对比 EP1S25F672C6 (standard Stratix without transceivers))
- Higher density logic for larger designs （对比 EP1S20F672C6 (Stratix with 18,460 LEs))
- Faster speed grade for timing-critical paths （对比 EP1S25F672C5N (speed grade 5))
设计说明
Estimated: The 672-ball FineLine BGA at 1.27 mm pitch requires at least a 6-layer PCB with stacked microvia or via-in-pad construction to escape inner rows. Per Stratix Hardware Reference Manual, provide at least two dedicated ground planes and one 1.5V core power plane; place 4-8 0.1uF X7R ceramic decoupling capacitors in the proximity of each VCC pin group. Matched-impedance length tuning is required for LVDS pairs and clock nets.
Estimated: At full logic utilization (~25,660 LEs switching at 200 MHz toggle rate) the EP1S25F672C6 dissipates approximately 2.5-4 W internally depending on clock tree usage. The 35 x 35 mm BGA package provides a thermal resistance theta_JA of approximately 8-12 C/W with a 1 oz copper ground plane and adequate airflow (200 LFM). Designers should include thermal vias under the central BGA balls for heat extraction; a heatsink is optional at moderate utilization but recommended for closed chassis deployments.
Allocate dedicated configuration pins (TCK, TMS, TDI, TDO, nCONFIG, nSTATUS, CONF_DONE, MSEL0/1/2, DCLK) on a separate PCB header or JTAG chain to enable in-system re-programming via the Quartus II Programmer. Route configuration signals away from switching I/O to minimize crosstalk during power-up. Place the configuration PROM (EPCS16 or EPC2) within 2 inches of the FPGA with matched-length traces. Use Altera's AN 161 configuration guidelines for robust multi-device JTAG chains and parallel configuration topologies.
Estimated: Common pitfalls with EP1S25F672C6 designs include: (1) failing to assign all VCC and GND pins (all 672 balls must be connected; floating power pins cause partial programming and JTAG failures); (2) violating the 1.5V core power-up ramp time (must reach 1.5V within 100 ms with monotonic ramp per Stratix hot-socketing spec); (3) driving LVTTL 3.3V signals into LVCMOS 1.5V I/O banks without configuring MultiVolt I/O standards; (4) ignoring the nCE (chip enable) chain when multiple FPGAs share a configuration bus. Always run the Quartus II power analyzer and pin planner validation before PCB fabrication.
合规信息
Standard EP1S25F672C6 uses SnPb BGA finish (not lead-free). For RoHS compliance use EP1S25F672C6N variant. AEC-Q100 not applicable for commercial-grade FPGA. Compliance values not explicitly stated in provided web data - marked unknown where not extractable.
