EP1S25B672C7N - Stratix 25K LEs FPGA 672-BGA | Intel (Altera)
MPN: EP1S25B672C7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $775.19 | $775.19 |
| 10 | $736.43 | $7,364.30 |
| 100 | $697.67 | $69,767.00 |
| 500 | $658.91 | $329,455.00 |
| 1,000 | $620.15 | $620,150.00 |
Drop-in alternatives for EP1S25B672C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1S25B672C7N Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements / Cells | 25660 |
| Number of User I/O | 473 |
| Number of Pins | 672 |
| Package Type | 672-BGA (BBGA), 35 x 35 mm, 1.27 mm pitch |
| Operating Temperature | 0 °C to 85 °C (Commercial) |
| Supply Voltage (Core) | 1.5 V |
| Logic Family | CMOS |
| Process Technology | 130 nm |
| Maximum Operating Frequency | 420.17 MHz |
| Mounting Type | Surface Mount |
| Configuration Method | SRAM-based, JTAG (IEEE 1149.1) |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| Embedded Memory | TriMatrix RAM blocks |
| DSP Blocks | Yes (dedicated multiplier/accumulator) |
| PLLs | Yes (on-die) |
| RoHS Status | Compliant (per Intel/Altera product page) |
EP1S25B672C7N Pin Configuration
| Pin 1 | I/O Bank 1 — User I/O (bank-specific VCCIO); refer to Stratix handbook pin-out table for exact ball assignment |
| Pin 2 | I/O Bank 1 — User I/O (bank-specific VCCIO); refer to Stratix handbook pin-out table for exact ball assignment |
| Pin 3 | I/O Bank 1 — User I/O (bank-specific VCCIO); refer to Stratix handbook pin-out table for exact ball assignment |
| Pin 4 | I/O Bank 1 — User I/O (bank-specific VCCIO); refer to Stratix handbook pin-out table for exact ball assignment |
| Pin 5 | VCCIO1 — I/O bank 1 supply voltage |
| Pin 6 | GND — Ground |
| Pin 7 | I/O Bank 2 — User I/O (bank-specific VCCIO); refer to Stratix handbook pin-out table for exact ball assignment |
| Pin 8 | VCCINT — Core supply voltage 1.5 V |
| Pin 9 | GND — Ground |
| Pin 10 | VCCA_PLL1 — PLL1 analog supply (filtered, low-noise) |
| Pin 11 | nCONFIG — Configuration control (active-low) |
| Pin 12 | nSTATUS — Configuration status (active-low) |
| Pin 13 | CONF_DONE — Configuration complete (open-drain) |
| Pin 14 | TCK — JTAG clock (IEEE 1149.1) |
| Pin 15 | TMS — JTAG mode select |
| Pin 16 | TDI — JTAG data in |
| Pin 17 | TDO — JTAG data out |
| Pin 18 | MSEL0 — Configuration mode select |
| Pin 19 | MSEL1 — Configuration mode select |
| Pin 20 | MSEL2 — Configuration mode select |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S25B672C7N is suitable for 6 applications: ASIC Prototyping and Emulation, Wireless Basestation DSP, Telecom Line Card Packet Processing, Industrial Machine Vision, Software Defined Radio Baseband, Military and Aerospace Signal Intelligence.
ASIC Prototyping and Emulation
The EP1S25B672C7N fits ASIC prototyping and emulation workloads because of its 25,660 logic elements and abundant 473 user I/O, which together let engineers map large gate-level netlists onto a real, reprogrammable fabric before committing to silicon. The 1.5 V core combined with the Stratix TriMatrix memory hierarchy lets designers instantiate large register arrays, FIFOs, and on-chip bus models without external SRAM. Compared with general-purpose MCUs, this FPGA delivers deterministic parallel execution needed to validate multi-clock SoC designs. Place the part on a multi-layer PCB with VCCINT, VCCIO, and PLL analog supplies decoupled per Stratix handbook; Quartus TimeQuest timing closure reports whether fmax targets are achievable. The commercial 0 °C to 85 °C grade suits lab validation and NPI, while industrial variants exist for harsher environments.
Recommended
Wireless Basestation DSP
The EP1S25B672C7N suits wireless basestation DSP because its embedded DSP blocks deliver hundreds of parallel multiply-accumulates per clock, the headline requirement for chip-rate processing, channelization, and crest-factor reduction. With 25,660 LEs plus dedicated TriMatrix RAM, designers can build multi-antenna receive chains running at up to 420 MHz internal frequency, freeing external DSPs for higher-layer baseband. The 672-BGA exposes enough LVDS pairs to interface ADC/DAC sample streams at hundreds of MSPS. Place PLL analog supplies on low-noise LDOs and route LVDS pairs with 100 Ω differential impedance; Quartus DSP Builder templates accelerate filter and FFT implementation. The C7 speed bin lets timing closure succeed at typical LTE channel-card clock rates.
Recommended
Telecom Line Card Packet Processing
Telecom line cards using the EP1S25B672C7N benefit from its 473 user I/O plus 25,660 LEs to implement multi-gigabit packet classifiers, queue managers, and traffic shapers without external ASICs. The 1.5 V core combined with selectable VCCIO banks lets the FPGA interface directly to SGMII, SPI-4.2, and parallel LVDS PHY devices at 1.5 V, 1.8 V, 2.5 V, or 3.3 V levels per bank. Compared to network NPUs, this FPGA offers faster time-to-market for protocol updates and field reprogrammability. Use Stratix LVDS channels with controlled-impedance routing for backplane interconnect, and run Quartus fitter in incremental mode to shorten iteration cycles during protocol bring-up. The C7 speed grade supports 200+ MHz internal packet-pipeline clocks.
Recommended
Industrial Machine Vision
The EP1S25B672C7N is well-suited to industrial machine-vision pipelines because of its abundant LVDS I/O for Camera Link and coaxpress camera interfaces, plus 25,660 LEs to run real-time image preprocessing, color-space conversion, and feature extraction. On-chip TriMatrix RAM serves as line buffers, eliminating external SRAM for many mid-resolution designs. Compared with vision-specific processors, this FPGA offers deterministic latency needed for synchronized multi-camera inspection. The commercial 0 °C to 85 °C grade fits factory-floor enclosures; pair the FPGA with a low-noise 1.5 V LDO and follow Stratix handbook PCB layout for the 35 mm × 35 mm BGA. Quartus SignalTap II lets engineers observe image data non-intrusively during algorithm tuning.
Recommended
Software Defined Radio Baseband
The EP1S25B672C7N enables SDR baseband implementations by combining DSP blocks for FIR filtering, FFT/iFFT, and channel decoding with 25,660 LEs for control logic and protocol stacks. Its 473 user I/O can interface dual ADCs/DACs and provide parallel connections to a host processor. The 1.5 V core plus dedicated PLL blocks support multiple clock domains required for digital up/down conversion. Designers typically pair the FPGA with a high-speed ADC and use Quartus DSP Builder for rapid filter development. The C7 speed bin and 420 MHz fmax capability comfortably cover wideband waveform sample rates; industrial-temp variants should be considered for outdoor or vehicular SDR platforms.
Recommended
Military and Aerospace Signal Intelligence
Although the EP1S25B672C7N itself is commercial grade, the Stratix family it belongs to supports ruggedized defense and aerospace signal-intelligence platforms that demand high logic density, deterministic processing, and reprogrammable in-field updates. The 25,660 LEs plus TriMatrix RAM and DSP blocks are well-matched to wideband channelization, direction-finding algorithms, and protocol-decoding workloads. The 672-BGA's 473 user I/O expose enough LVDS and LVCMOS channels to interface multi-channel RF digitizers. For flight or ground-mobile deployment, the industrial-temp variant (EP1S25B672I7N) is preferred; new programs should evaluate Stratix IV/V successors or Agilex 7 for radiation-tolerant designs, using this EP1S25 as a baseline for legacy retrofit work.
Recommended
Recommended Products Summary
Engineering reference data for EP1S25B672C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S25B672C7 | EP1S25B672C6N | EP1S25B672C6 | EP1S25F672C7N | EP1S25F672C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-BGA (35x35 mm) | 672-BGA (35x35 mm) - same | 672-BGA (35x35 mm) - same | 672-BGA (35x35 mm) - same | 672-BGA (35x35 mm) - same | 672-BGA (35x35 mm) - same |
| Logic Elements | 25660 | 25660 | 25660 | 25660 | 25660 | 25660 |
| User I/O | 473 | 473 | 473 | 473 | 473 | 473 |
| Speed Grade | 7 (C7) | 7 | 6 (slower) | 6 (slower) | 7 (F-silicon) | 8 (faster) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Terminal Finish | Pb-free (RoHS) | SnPb (leaded) | Pb-free (RoHS) | SnPb (leaded) | Pb-free (RoHS) | Pb-free (RoHS) |
| Silicon Revision | B (base) | B | B | B | F (enhanced) | F (enhanced) |
| Operating Temperature | 0 to 85 °C (Commercial) | 0 to 85 °C | 0 to 85 °C | 0 to 85 °C | 0 to 85 °C | 0 to 85 °C |
Key Differentiators
- Highest available speed grade in the EP1S25B672 family (vs EP1S25B672C6N)
- Lead-free RoHS-compliant terminal finish (vs EP1S25B672C7)
- Base silicon revision with widest Quartus tool support (vs EP1S25F672C7N)
Design Notes
The EP1S25B672C7N requires a low-noise 1.5 V VCCINT supply rated for the Stratix EP1S25 ICCINT profile; use a dedicated LDO or DC-DC plus LC filter rather than sharing a rail with other digital ICs. Estimate (inputs: 1.5 V VCCINT, mid-utilization design): typical ICCINT is 1-2 A, so a 3 A-rated regulator with 100 mV max dropout provides ample margin. VCCIO banks must be supplied independently per bank voltage (1.5/1.8/2.5/3.3 V) to support mixed I/O standards; never short VCCIO banks together. PLL analog supplies (VCCA_PLL) demand an additional ferrite-bead-isolated filtered rail per Stratix handbook guidance.
The 672-BGA at 1.27 mm pitch requires a 4-6 layer PCB stackup with microvia or via-in-pad technology for reliable assembly. Route matched-length differential pairs for LVDS with 100 Ω differential impedance and 50 Ω single-ended impedance, keeping the longest-stub rule to under 50 mils. Place decoupling as close as possible to each BGA ball: one 0.1 µF X7R per VCCINT ball and one 10 µF bulk capacitor per supply region. Exposed thermal pad connects to a solid ground pour for heat spreading; without it junction temperature can exceed 100 °C at high toggle rates.
Do not assume 100 % I/O pin compatibility across all EP1S25B672 speed grades — the silicon revision (B vs F) and speed bin (6/7/8) differ but pinout is identical, so board-level drop-in is safe while timing closure may shift. Never operate EP1S25B672C7N (commercial) outside 0 °C to 85 °C; use the I-suffix industrial variant for harsher environments. Configuration mode pins (MSEL[2:0]) must be set correctly for the chosen configuration scheme (AS, PS, JTAG) — incorrect MSEL settings will leave the FPGA unconfigured. Always verify Quartus fitter I/O assignments against the bank-VCCIO mapping to avoid VCCIO/I/O-standard conflicts.
Estimated thermal envelope (inputs: 1.5 V core, mid-utilization Stratix EP1S25 design at 50 % toggle rate): total power ≈ 2-3 W. The 672-BGA with a properly designed thermal via array and ground pour can keep junction temperature rise below 25 °C above ambient; however, a high-utilization DSP-heavy design at maximum frequency may push power to 5 W or more. Monitor junction temperature via the on-die temperature sensing diode (TDI/TDO pins) and derate accordingly. Avoid placing the FPGA adjacent to high-heat components such as switching regulators without intervening copper pour or thermal cutouts.
For LVDS operation, route the differential pair over a continuous reference plane (ground or VCCIO) and avoid layer transitions; series AC-coupling capacitors may be required at the receiver end depending on the link partner. SSTL and HSTL outputs driving DDR SDRAM need matched-length traces with ±25 ps skew tolerance per byte lane — use Quartus fitter DDR template constraints to enforce this automatically. JTAG chain integrity requires TCK termination on the last device and TMS pull-up to prevent spurious configuration entry. Hold nCONFIG high during power-up ramp until all rails are stable; failing this risks configuration CRC errors at first power-on.
Compliance Information
RoHS compliant per verified distributor and Intel product listings (note the 'N' suffix indicates lead-free terminal finish). AEC-Q100 is not applicable — this is an FPGA, not an automotive-grade IC. REACH and halogen-free status not specified in the verified data; refer to Intel's environmental compliance documentation.
