EP1SGX25DF800I6N - Stratix GX FPGA, 25K LE, 20x 3.1875 Gbps Transceivers | Intel / Altera
料号： EP1SGX25DF800I6N ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 25 | $1620 | $40,500.00 |
| 50 | $1535 | $76,750.00 |
| 100 | $1450 | $145,000.00 |
EP1SGX25DF800I6N 概述
A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks that can be reconfigured after manufacturing to implement arbitrary digital logic. FPGAs occupy the high-performance, low-volume tier of the programmable logic hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor), bridging the gap between ASICs and microcontrollers for applications that demand parallel processing, deterministic timing, and reconfigurable hardware acceleration.
The Stratix GX architecture embeds up to 22 DSP blocks, TriMatrix memory with up to 2 Mbits of RAM, and high-speed I/O elements supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL standards. The device also integrates a hard PCI Express PHY, external memory interfaces (DDR, DDR-II, QDR-II, RLDRAM-II), and 8 source-synchronous channels for high-speed parallel expansion. The transceiver block supports multiple protocol data rates including 1.25 Gbps, 2.5 Gbps, and 3.1875 Gbps with built-in 8B/10B encoding.
Typical Stratix GX deployment scenarios include multi-gigabit serial backplanes in telecom switches, 10-Gigabit Ethernet MAC/PHY bridging, SONET/SDH framer interfaces, and custom high-speed bus bridges in storage and broadcast equipment. The -6 speed grade (I6N) indicates an industrial temperature range of -40C to +100C with a moderate speed bin suitable for production-grade designs.
When designing with this device, ensure that the high-speed transceiver channels are routed with controlled-impedance differential pairs (typically 100 ohm differential) and that the on-chip PLL reference clock jitter meets the protocol-specific mask. Adequate decoupling (bulk + 0.1 uF + 0.01 uF) is critical near the transceiver power pins. This page synthesizes distributor pricing, pin-compatible Stratix GX family members, and practical design notes not consolidated in the original Altera datasheet.
直接替换替代料： EP1SGX25DF800I6N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1SGX25DF800I6N （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Operating Temperature, DSP Blocks, Process Technology.
快速对比工具——选择替代料号进行并排对比：
EP1SGX25DF800C6N
✅ 直接替换✓ 有现货
$118 / 个
查看数据手册 →EP1SGX25DF800C5N
✅ 直接替换✓ 有现货
$158 / 个
查看数据手册 →EP1SGX25DF672C7N
✅ 直接替换✓ 有现货
$245 / 个
查看数据手册 →EP1SGX25DF672I6N
✅ 直接替换✓ 有现货
$298 / 个
查看数据手册 →EP1SGX25CF672I6
✅ 直接替换✓ 有现货
$171 / 个
查看数据手册 →EP1SGX25DF800I6N 最大额定值与电气特性
| Family | Stratix GX |
| Transceiver Channels | 4 to 20 channels |
| Maximum Transceiver Data Rate | 3.1875 Gbps per channel |
| CDR / SERDES | Embedded clock-data recovery and SERDES |
| Memory | TriMatrix memory, up to 2 Mbits |
| DSP Blocks | Up to 22 DSP blocks |
| Hard IP | PCI Express PHY, external memory interfaces (DDR, DDR-II, QDR-II, RLDRAM-II) |
| Source-Synchronous Channels | 8 channels |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| 封装 | 800-pin FineLine BGA (DF800) |
| Speed Grade | -6 (production grade) |
| Temperature Range | Industrial -40C to +100C |
| Protocol Support | Gigabit Ethernet, SONET/SDH, PCI Express, custom serial |
EP1SGX25DF800I6N 800-pin fineline bga (df800) 引脚配置指南
EP1SGX25DF800I6N（800-pin fineline bga (df800) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP1SGX25DF800I6N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP1SGX25DF800I6N 适用于 7 应用s: 10G / Multi-Gigabit Backplane Routing, SONET / SDH Framer Interfaces, Storage Area Network (SAN) Bridges, PCI Express Endpoint / Root Complex, Broadcast Video Processing, Industrial Test & Measurement Instrumentation, Aerospace & Defense High-Speed Links.
10G / Multi-Gigabit Backplane Routing
The EP1SGX25DF800I6N integrates up to 20 transceiver channels at 3.1875 Gbps each, providing the channel density needed for multi-gigabit serial backplanes in core routers, switches, and ATCA chassis. The on-chip CDR, 8B/10B encoder, and rate-matching FIFO simplify PHY implementation, eliminating the external SERDES ICs and reducing BOM cost by 30-50% versus a discrete transceiver approach.
推荐
SONET / SDH Framer Interfaces
The Stratix GX transceiver block supports OC-48 (2.488 Gbps) and OC-96 rates that map directly to SONET/SDH framer interfaces in optical transport equipment. The device's built-in 8B/10B coding, programmable pre-emphasis, and adjustable receiver equalization compensate for FR-4 backplane loss, while the industrial temperature grade (-40C to +100C) suits outdoor telecom cabinets.
推荐
Storage Area Network (SAN) Bridges
The EP1SGX25DF800I6N's high-speed transceivers enable SAS, SATA, Fibre Channel, and custom serial bridges for enterprise storage arrays. Its hard PCI Express endpoint PHY supports x4 PCIe at 10 Gbps aggregate, allowing direct host interface integration, while the TriMatrix memory blocks (up to 2 Mbits) provide buffering for protocol translation. The -6 industrial speed grade handles demanding thermal environments.
推荐
PCI Express Endpoint / Root Complex
The hard PCI Express PHY integrated in the Stratix GX family supports endpoint and root-complex configurations at x1 / x4 lane widths up to 2.5 Gbps per lane. This eliminates the need for an external PCIe PHY IC, reducing board area and BOM. Combined with the TriMatrix memory and 22 DSP blocks, the device serves as a complete PCIe card controller in test, instrumentation, and telecom applications.
推荐
Broadcast Video Processing
The Stratix GX DSP blocks and high-speed serial I/O make the EP1SGX25DF800I6N well suited for HD-SDI (1.485 Gbps) and 3G-SDI (2.97 Gbps) video processing, frame synchronizers, and broadcast routers. The 8 source-synchronous channels support parallel LVDS interfaces to camera sensors and HDMI transmitters. Industrial temperature rating supports live-event broadcast equipment.
推荐
Industrial Test & Measurement Instrumentation
The industrial -40C to +100C temperature range and the high-speed transceivers of the EP1SGX25DF800I6N make it suitable for portable protocol analyzers, oscilloscope acquisition modules, and bit-error-rate testers in industrial labs. The on-chip DSP blocks accelerate real-time protocol decoding, while the 800-pin BGA package supports the high pin count required by parallel test interfaces.
推荐
Aerospace & Defense High-Speed Links
The EP1SGX25DF800I6N's industrial temperature range and rugged BGA package suit aerospace and defense applications such as avionics data buses, radar signal processing, and secure communications. The transceiver block supports custom serial protocols used in MIL-STD-1553 derivatives and proprietary high-speed links. Note that this is a commercial-grade part; full MIL-PRF qualification requires a different part designation.
推荐
推荐产品汇总
工程参考数据： EP1SGX25DF800I6N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1SGX25DF800C6N | EP1SGX25DF800C5N | EP1SGX25DF672C7N | EP1SGX25DF672I6N | EP1SGX25CF672I6 |
|---|---|---|---|---|---|---|
| Package | FineLine BGA-800 (DF800) | FineLine BGA-800 (DF800) | FineLine BGA-800 (DF800) | FineLine BGA-672 (DF672) | FineLine BGA-672 (DF672) | FineLine BGA-672 (CF672) |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Temperature Range | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C |
| Speed Grade | -6 (production) | -6 (production) | -5 (slower) | -7 (faster) | -6 (production) | -6 (production) |
| Family / Family Member | Stratix GX EP1SGX25 | Stratix GX EP1SGX25 | Stratix GX EP1SGX25 | Stratix GX EP1SGX25 | Stratix GX EP1SGX25 | Stratix GX EP1SGX25 |
| Pin Count | 800 | 800 | 800 | 672 | 672 | 672 |
| Lifecycle Status (2026) | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
| Transceiver Data Rate | up to 3.1875 Gbps | up to 3.1875 Gbps | up to 3.1875 Gbps | up to 3.1875 Gbps | up to 3.1875 Gbps | up to 3.1875 Gbps |
关键差异点
- Industrial temperature grade with -6 speed （对比 EP1SGX25DF800C6N)
- Faster speed grade with industrial temperature （对比 EP1SGX25DF800C5N)
- Larger 800-pin BGA footprint with full transceiver count （对比 EP1SGX25DF672C7N)
设计说明
Route all high-speed transceiver channels as 100 ohm differential pairs with controlled impedance. Use a stripline or microstrip stack-up with reference planes on adjacent layers; maintain 8x to 10x trace width to dielectric thickness for microstrip. The CDR performance depends on intra-pair skew below 5 ps, so use length matching within 0.5 mm across all TX/RX pairs. AC-couple the lines with 100 nF 0402 capacitors if the protocol requires it (PCIe, XAUI).
Place a 100 uF bulk tantalum plus 10 uF and 0.1 uF ceramic capacitors within 5 mm of each VCC/GND pin pair. The transceiver supply (VCCE_GXB) is sensitive to switching noise; isolate it from the logic supply with a ferrite bead and a dedicated regulator (Linear Technology LT1963-1.5 / equivalent). Insufficient decoupling is the #1 cause of marginal BER performance in production. Always verify VCCE_GXB ripple is below 50 mVpp at full data rate.
Do not exceed the Stratix GX maximum data rate of 3.1875 Gbps per channel - the -6 speed grade is the upper limit. Using 'fastest' prototype settings in Quartus can lead to non-deterministic bit errors in production. When migrating between EP1SGX25 DF800 and DF672 packages, the bitstream is identical but the configuration pin assignments and JTAG ID differ. Re-generate the SOF/POF file after each package change.
The 800-pin FineLine BGA has a thermal resistance of approximately 0.6 C/W junction-to-case with proper thermal via array. Use 4 thermal vias per pad array under the die footprint, connecting the BGA thermal pad to the inner ground plane. With a 30 W typical Stratix GX power dissipation, expect 18C junction rise above case temperature - well within the 100C industrial limit.
合规信息
RoHS / lead-free per Altera product markings (Pb-free BGA finish). Reach compliance and conflict-minerals statement per Intel Product Change Notification archive. AEC-Q100 is not applicable - this is a logic IC for telecom and industrial. Halogen-free status [DATA_NEEDED].
