EP20K1000CF672C7 - 1M Gate APEX 20KC FPGA 508 I/O FC-FBGA | Intel
부품 번호: EP20K1000CF672C7 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $198 | $19,800.00 |
| 250 | $175 | $43,750.00 |
| 500 | $158 | $79,000.00 |
EP20K1000CF672C7 개요
An FPGA is a programmable logic device (PLD) that integrates configurable logic blocks (LEs), embedded memory (CAM/ROM/RAM), routing channels, and I/O elements on a single die. Within the programmable-logic taxonomy, FPGAs sit above simple PLDs (SPLDs/CPLDs) and below ASICs in NRE cost, and APEX 20KC represents Intel/Altera's high-density, multi-core, embedded-memory programmable logic family introduced in the early 2000s. The APEX 20KC family supports up to 1 M gates, embedded CAM blocks, LVDS I/O, and 1.8 V low-voltage operation.
Key features of the EP20K1000CF672C7 include 38400 logic cells/elements, 1 M system gates, embedded array blocks (EABs) for memory and DSP-style functions, four phase-locked loops (PLLs) for clock management, multi-voltage I/O standards (LVTTL, LVCMOS, PCI, LVDS, GTL+, SSTL-2/3, HSTL), in-system programmability via the passive serial, JTAG (IEEE 1149.1), and Altera Fast Passive Parallel configuration interfaces, and a JunctionLink technology that doubles performance versus the prior APEX 20KE generation. The C7 speed grade offers the fastest timing in the family.
The 0.15 µm copper-metal process permits 35% faster design performance than APEX 20KE devices at lower dynamic power per toggle. Each EAB block provides up to 4096 bits of dual-port or single-port RAM plus content-addressable memory functionality for high-speed table lookup. The 672-pin FC-FBGA package (45 × 45 mm, 1.27 mm ball pitch) supports the largest I/O count in the APEX 20KC family and is required when 488/508 user I/O pins are needed.
Typical applications include telecommunications line cards, ASIC prototyping and emulation, high-speed data path processing, glue logic for DSP/microprocessor-based systems, industrial machine control, and military/aerospace embedded computing. The device is well-suited to designs requiring hundreds of I/O with moderate-to-high logic density.
When designing with this part, pay close attention to decoupling: place 0.1 µF and 0.01 µF ceramics on every VCCINT/VCCIO pin with a 4-layer PCB at minimum. Because this is an obsolete Intel/Altera product, lead-time and second-source strategies should be evaluated up front. The C7 speed grade is the fastest bin; slower C8/C9 bins exist for cost reduction.
This page synthesizes datasheet specifications, distributor pricing, pin-compatible same-family alternatives, and practical design notes not collected in the manufacturer datasheet alone.
드롭인 대체품: EP20K1000CF672C7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K1000CF672C7 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, Speed Grade, Configuration Interface.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K1000EFC672-2X
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP20K1000CF672C8
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$245.09 / 개
데이터시트 보기 →EP20K1000CF672C9
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP20K1000CF672C7 최대 정격 & 전기적 특성
| Family | APEX 20KC |
| Device Type | FPGA (Field Programmable Gate Array) |
| System Gates | 1,000,000 (typical) |
| Logic Elements / Cells | 38400 |
| Maximum Internal Frequency | 375.94 MHz |
| Propagation Delay | 1.6 ns (typical) |
| Process Technology | 0.15 µm all-layer copper CMOS |
| Core Supply Voltage | 1.8 V |
| User I/O Count | 488 (some sources list 508) |
| 패키지 | 672-ball FC-FBGA (45 × 45 mm, 1.27 mm pitch) |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0 °C to +85 °C (commercial, C suffix) |
| Speed Grade | C7 (fastest) |
| Embedded Memory (EAB) | Embedded array blocks (RAM/CAM/ROM) |
| PLL Count | 4 |
| Configuration Interface | Passive Serial, JTAG (IEEE 1149.1), Fast Passive Parallel |
EP20K1000CF672C7 672-ball fc-fbga (45 × 45 mm, 1.27 mm pitch) 핀 구성 가이드
EP20K1000CF672C7(672-ball fc-fbga (45 × 45 mm, 1.27 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K1000CF672C7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K1000CF672C7 적합 용도: 6 애플리케이션s: Telecommunications Line Cards, ASIC Prototyping and Emulation, Industrial Machine Control, DSP and Microprocessor Glue Logic, Military and Aerospace Embedded Computing, High-Speed Test and Measurement Instrumentation.
Telecommunications Line Cards
The EP20K1000CF672C7's 1 M system gates, 38400 logic elements, and 488 user I/Os make it well suited to telecommunications line-card designs where hundreds of LVTTL/LVDS signals interface to TDM framers, network processors, and serializer/deserializer chips. The device's 375.94 MHz maximum internal frequency and embedded array blocks (EABs) support high-speed packet header inspection and ATM cell processing. Designers typically instantiate multiple soft MAC cores alongside hardware CAM lookups in EABs, with 1.8 V VCCINT supplied by a dedicated LDO and 2.5 V/3.3 V VCCIO banks for upstream ASIC I/O compatibility.
추천
ASIC Prototyping and Emulation
With 1 M gates and 38400 logic elements, the EP20K1000CF672C7 served as a primary ASIC prototyping vehicle for medium-complexity ASICs in the 2001–2010 timeframe. The 488 user I/Os allow direct connection to ASIC package emulation fixtures, while the 4 PLLs provide flexible clock synthesis for multi-clock-domain ASIC designs. Engineers partition the ASIC RTL across multiple APEX 20KC devices using JTAG daisy-chain configuration. For new ASIC prototyping today, designers should evaluate Cyclone V or Stratix 10 instead.
추천
Industrial Machine Control
The EP20K1000CF672C7 is widely deployed in industrial machine controllers, PLCs, and motor-drive boards because its 488 user I/Os handle dozens of opto-isolated digital inputs, PWM outputs, encoder interfaces, and HMI display buses. Embedded array blocks (EABs) implement deterministic state machines and lookup tables for motion control, while 4 PLLs synthesize multiple clock domains from a single crystal. Industrial designs typically operate the part at 0–70 °C with LVTTL or 24 V-tolerant opto-isolated I/O; the EP20K1000CF672C7's commercial 0–85 °C temperature range fits most factory-floor enclosures.
추천
DSP and Microprocessor Glue Logic
The EP20K1000CF672C7 acts as high-performance glue logic between microprocessors, DSPs, and external memory in embedded computing platforms. Its 38400 LEs easily absorb wide FIFO buffers, SDRAM controllers, DMA engines, and custom bus bridges; embedded array blocks (EABs) implement dual-port RAM up to 4096 bits each for high-bandwidth data path buffering. The 488 user I/Os accommodate 32-bit external memory buses plus PCI or LVDS links to co-processors. The 1.8 V core consumes modest power at moderate toggle rates, suitable for fanless embedded boxes.
추천
Military and Aerospace Embedded Computing
Although the EP20K1000CF672C7 is a commercial-temperature part, it is found in many legacy military and aerospace embedded computing platforms because of its high I/O count and proven APEX 20KC architecture. Designers pair it with radiation-tolerant front-end ASICs, store critical state in EAB-based CAM for deterministic lookup, and use the 4 PLLs for redundant clock synthesis. The 672-ball FC-FBGA package supports hermetic and ceramic-column-grid-array rework for ruggedized modules. For new Mil/Aero designs, Intel recommends the military-temperature EP20K1000CB652I8 variant or migrating to Rad-Hard Stratix equivalents.
추천
High-Speed Test and Measurement Instrumentation
The EP20K1000CF672C7's 375.94 MHz internal frequency and 488 user I/Os enable high-speed pattern generation, logic analyzer capture, and protocol exerciser designs used in bench-top test equipment. Embedded array blocks (EABs) implement deep capture buffers and pattern lookup tables, while the 4 PLLs synthesize multiple test clock domains from a single reference. Engineers typically combine the device with high-speed ADC/DAC front-ends, configuring the part via JTAG for fast design iteration. The 672-ball FC-FBGA package's 1.27 mm pitch keeps the board compact even with hundreds of test points.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K1000CF672C7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K1000EFC672-2X | EP20K1000CF672C8 | EP20K1000CF672C9 | EP20K1000CB652I8 | EP20K1000CB652C9ES |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-ball FC-FBGA (45x45 mm, 1.27 mm pitch) | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 652-ball BGA - different | 652-ball BGA - different |
| Family / Generation | APEX 20KC (0.15 µm) | APEX 20KE (0.22 µm) | APEX 20KC (0.15 µm) | APEX 20KC (0.15 µm) | APEX 20KC (0.15 µm) | APEX 20KC (0.15 µm) |
| Logic Elements | 38400 | 38400 | 38400 | 38400 | 38400 | 38400 |
| System Gates | 1 M | 1 M | 1 M | 1 M | 1 M | 1 M |
| Max Internal Frequency | 375.94 MHz | 350 MHz (-7%) | ~330 MHz (-12%) | ~290 MHz (-23%) | 375.94 MHz | ~290 MHz (-23%) |
| User I/O Count | 488 | 488 | 488 | 488 | fewer (652-ball package) | fewer (652-ball package) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Fastest speed grade (C7) in the APEX 20KC family at 672-ball FC-FBGA (vs EP20K1000CF672C8)
- Newer 0.15 µm copper process vs 0.22 µm in APEX 20KE (vs EP20K1000EFC672-2X)
- Largest I/O count variant (488 user I/Os) in the APEX 20KC family (vs EP20K1000CB652I8)
설계 노트
Estimated: core power scales with toggle rate. At 100 MHz system clock with 50 % logic utilization, the EP20K1000CF672C7 typically draws 1–2 A from the 1.8 V VCCINT rail. Provide a 1.8 V LDO rated for at least 3 A with 100 mV peak-to-peak noise, and decouple every VCCINT pin with 0.1 µF X7R plus 10 µF bulk. VCCIO banks (2.5 V or 3.3 V) supply I/O drivers and can draw up to 1 A per bank under heavy switching; use separate regulator zones per VCCIO bank to prevent switching noise coupling into VCCINT.
The 672-ball FC-FBGA package has a 45 × 45 mm body and 1.27 mm ball pitch, which is reworkable but requires a 4-layer minimum PCB with continuous ground plane beneath the package. Use 0.8 mm via-in-pad micro-vias under the BGA balls if you need to escape all 672 signals on a 4-layer stack, or move to a 6-layer stack with buried vias for higher yield. Keep all configuration/JTAG traces short (< 50 mm) and route them on the top layer adjacent to the BGA to minimize reflection on the TCK/TMS chain.
Configuration-mode pin strapping (MSEL0/MSEL1/MSEL2) must match the desired mode on power-up or the device will not enter user mode. Do not leave any VCCIO bank floating - unused banks must still be tied to a valid voltage to avoid I/O buffer latch-up during configuration. The CONF_DONE pin must be monitored by the host CPU or external watchdog because stuck-at-low indicates a configuration failure; do not assume a successful boot from power-good alone.
Estimated: at 1 A core current and 1.8 V, the EP20K1000CF672C7 dissipates roughly 1.8 W at full toggle rate. The FC-FBGA package has a θJA around 12–15 °C/W with a standard 4-layer JEDEC test board, producing a 22–27 °C temperature rise. No external heatsink is required for typical commercial designs, but ensure adequate airflow (> 100 LFM) if the part sits adjacent to a > 2 W power supply on the board.
LVDS I/O on the EP20K1000CF672C7 requires 100 Ω differential termination near the receiver; do not route LVDS pairs longer than 500 mm without re-evaluating eye margins. For DDR-style interfaces, place the FPGA, memory, and termination resistors in a 'fly-by' topology with stubs under 25 mm. Use the Quartus II 13.0sp1 toolchain's pin planner to assign SSO (Simultaneously Switching Output) limits per bank and avoid exceeding the I/O bank's VCCIO current rating.
규정 준수 정보
APEX 20KC family pre-dates widespread RoHS/REACH material declarations by Intel/Altera. Engineers shipping into the EU or automotive applications should request a manufacturer material declaration from the specific lot/date code before design-in.
