EP20K1000CB652I8 - APEX 20KC 1M Gates FPGA | Intel | BGA-652
MPN: EP20K1000CB652I8 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $248 | $24,800.00 |
| 250 | $232 | $58,000.00 |
| 500 | $218 | $109,000.00 |
Drop-in alternatives for EP20K1000CB652I8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP20K1000CB652I8 Maximum Ratings & Electrical Characteristics
| Family | APEX 20KC |
| Logic Elements / Cells | 38,400 |
| System Gates | 1,000,000 |
| Maximum Operating Frequency | 301.21 MHz |
| Process Technology | 0.15 um CMOS |
| Core Supply Voltage | 1.8 V |
| Number of Terminals | 652 |
| Package Type | FCBGA (LBGA, ball grid array) |
| Package Code | LBGA / S-PBGA-B652 |
| Dedicated Inputs | 4 |
| User I/O Pins | 480 |
| Total I/O Count | 488 (4 dedicated inputs + 484 I/O) |
| Number of PLLs | 4 |
| Embedded System Blocks (ESBs) | Yes (dual-port RAM / CAM) |
| Embedded Memory | 540 kbit maximum (per family datasheet) |
| MultiVolt I/O Support | 1.8 V / 2.5 V / 3.3 V |
| Configuration Interface | JTAG (IEEE 1149.1) / serial / parallel |
| Operating Temperature (Industrial) | -40C to +100C |
| Temperature Grade Suffix | I (Industrial) |
EP20K1000CB652I8 lbga / s-pbga-b652 Pin Configuration Guide
Complete pinout information for EP20K1000CB652I8 (lbga / s-pbga-b652 package) with 480 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K1000CB652I8.
Refer to the datasheet for full pin configuration.
Estimated pin count: 480 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP20K1000CB652I8 is suitable for 6 applications: Telecommunications Line-Card Glue Logic, Industrial Motor Control and Factory Automation, ASIC Prototyping and Pre-Silicon Validation, Military and Aerospace Signal Processing, Test and Measurement Instrumentation Backplane, Legacy Board Replacement and Sustainment.
Telecommunications Line-Card Glue Logic
The EP20K1000CB652I8 fits telecom line-card glue logic because its 38,400 logic elements and 540 kbit embedded RAM provide the FIFO, framing, and clock-domain-crossing resources needed between network processors and SERDES framer ICs. The four integrated PLLs allow jitter-clean clock synthesis from a single backplane reference, while MultiVolt I/O (1.8/2.5/3.3 V) interfaces directly to legacy bus levels without external level shifters. The industrial -40C to +100C temperature grade supports outdoor cabinet and central-office deployments. Designers typically pair the FPGA with a TCM/JTAG configuration PROM and use the 480 user I/O to bridge processor buses and backplane connectors.
Recommended
Industrial Motor Control and Factory Automation
For motor control and factory-automation platforms, the EP20K1000CB652I8 supplies the deterministic PWM generation, encoder decoding, and fieldbus glue that off-the-shelf microcontrollers cannot. The 38,400 cells and embedded dual-port RAM enable multi-axis current-loop control with sub-microsecond update rates, and the 480 I/O support parallel ADC/DAC chains for current sensing and inverter drive. Industrial-grade -40C to +100C operation tolerates cabinet temperatures near motor drives, while the 652-ball BGA provides ample ground balls for low-noise analog sampling. Typical pairings include precision op-amps for current shunts and isolated gate drivers downstream.
Recommended
ASIC Prototyping and Pre-Silicon Validation
The EP20K1000CB652I8 is widely used as an ASIC prototyping vehicle because the APEX 20KC MultiCore architecture allows one-to-one mapping of LUT-based ASIC netlists onto 38,400 logic cells with predictable timing closure. The four PLLs let designers replicate multi-clock ASIC domains, while 480 I/O pins expose wide bus interfaces for ASIC traffic monitoring. Industrial temperature support means prototypes can be validated in real-world environments rather than lab-only. Engineers typically partition the ASIC by function across multiple APEX 20KCs and use JTAG chain stitching for unified debug.
Recommended
Military and Aerospace Signal Processing
Defense signal-processing subsystems historically use the EP20K1000CB652I8 because of its industrial temperature range and the APEX 20KC family's documented long-term support for legacy programs. The 540 kbit of embedded RAM suits digital-IF downconversion, beamforming weight storage, and radar-pulse buffering at sample rates up to 100 MHz in LVDS I/O mode. The four PLLs allow independent clock trees for ADC sampling, DSP datapath, and host interface. Programs requiring modern security features or radiation hardness should migrate to a current Intel Agilex or Microsemi RTG4 device instead.
Recommended
Test and Measurement Instrumentation Backplane
The EP20K1000CB652I8 fits instrumentation backplanes where a single device must aggregate multiple test channels, route triggers, and bridge to a controller CPU. Its 488 I/O provide direct connections to ADC front ends, DAC calibrators, and trigger fan-out buffers, while the embedded RAMs act as deep capture buffers or pattern generators. The industrial temperature grade supports bench-to-chamber transitions without re-characterization, and JTAG-based configuration enables remote firmware updates in deployed testers. Design-in practice pairs the FPGA with low-jitter clock PLLs and LVDS serializers.
Recommended
Legacy Board Replacement and Sustainment
The most common application for the EP20K1000CB652I8 today is sustaining legacy boards where the original Altera FPGA has failed and the OEM is no longer active. Because the 652-ball FCBGA footprint is shared across APEX 20KC and 20KE families, direct reball or hot-air rework can swap the I8 temperature grade for the commercial C7/C8/C9 or the 20KE upgrade. Designers should re-validate timing closure if changing speed grades, and re-validate thermal performance if switching from industrial to commercial temperature. Procurement teams should request lot date codes and traceability documentation for brokers.
Recommended
Recommended Products Summary
Engineering reference data for EP20K1000CB652I8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K1000CB652C9ES | EP20K1000CB652C8ES | EP20K1000CB652C7NJ | EP20K1000EBC652-2X | EP20K1000CF672C7 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | FCBGA-652 (LBGA) | FCBGA-652 - same | FCBGA-652 - same | FCBGA-652 - same | FCBGA-652 - same | FCBGA-672 - larger |
| Family | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KE (enhanced) | APEX 20KC |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| Logic Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| Speed Grade | -8 | -9 (faster) | -8 | -7 (slower) | -2X | -7 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Number of PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Qty-1 Unit Price (USD, as of 2026-09-07) | 285.00 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Industrial temperature grade at the same speed grade (-8) as commercial variants (vs EP20K1000CB652C8ES)
- Same 652-ball FCBGA footprint across the entire APEX 20KC 1M-gate lineup (vs EP20K1000CF672C7)
- Four PLLs and MultiVolt I/O consolidated in one 1M-gate device (vs EP20K400CB652C7)
Design Notes
The EP20K1000CB652I8 separates VCCINT (1.8 V core) and VCCIO (1.8/2.5/3.3 V I/O banks). Place a minimum of one 100 uF bulk tantalum plus ten 0.1 uF X7R 0402/0603 ceramics per VCCIO bank, distributed around the BGA perimeter. PLLs require their own filtered analog supply (VCC_PLL) with a ferrite bead and 10 uF + 0.1 uF RC decoupling; sharing PLL analog VCC with digital VCCIO introduces jitter.
The 652-ball FCBGA requires a 1.0 mm or finer pitch PCB land pattern with NSMD (non-solder-mask-defined) pads for reliable assembly. Match BGA pad diameter to the APEX 20KC package specification (typically 0.5 mm ball on 1.0 mm pitch). Stack-up must provide continuous ground planes under the BGA; route all high-speed signals on stripline layers referenced to those grounds. Microvia-in-pad is recommended for inner balls.
Estimated: at 301 MHz internal clock with 480 LVDS I/O switching simultaneously, expect ~3-5 W dynamic power plus ~1 W static; budget 6-8 W total worst-case dissipation. Derate the BGA's theta_JA (~15-20 C/W with proper thermal via array under the exposed die) accordingly. Without a thermal via array, junction temperature may exceed 100C even at industrial ambient - place at least a 4x4 thermal via farm (0.3 mm drill, 1.0 mm pitch) under the package center.
The 'I8' suffix denotes industrial temperature AND -8 speed grade; ordering a 'C8' commercial-temperature part as a substitute without re-qualifying will fail thermal testing in cold-start scenarios. The APEX 20KC configuration bitstream is NOT compatible with APEX 20KE (despite same package); use the correct Quartus version for the target family. JTAG pins (TCK/TMS/TDO/TDI) must not be left floating - tie TMS and TDI through 10 kohm pull-ups to VCCIO.
LVDS and GTL+ I/O standards on the EP20K1000CB652I8 require 100 ohm differential (LVDS) or 25 ohm single-ended (GTL+) termination near the receiver. Run length matching within 150 mils for LVDS pairs. Place series AC-coupling capacitors (0.1 uF) on LVDS receive pairs when connecting to a separate-voltage driver. Simulate with IBIS models from Intel; field-deployed designs without SI simulation commonly fail at >200 MHz LVDS.
Compliance Information
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status were not documented in the Verified Web Data retrieved 2026-09-07; manufacturer disclosure for the obsolete APEX 20KC family predates current compliance-reporting formats. Request the lot-specific certificate of compliance from the seller for any RoHS- or REACH-mandated order.
