EP1SGX40GF1020C7 - Stratix GX FPGA, 41.25K LE, 624 I/O, FBGA-1020 | Altera
料号： EP1SGX40GF1020C7 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1772.13 | $1,772.13 |
| 10 | $1695.5 | $16,955.00 |
| 100 | $1610.2 | $161,020.00 |
| 500 | $1538 | $769,000.00 |
| 1,000 | $1475 | $1,475,000.00 |
EP1SGX40GF1020C7 概述
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs/LABs), programmable routing, and dedicated hard IP blocks such as transceivers, PLLs, block RAM and DSP multipliers. FPGAs occupy the programmable-logic tier of the broader integrated-circuit hierarchy: ASIC -> FPGA -> CPLD -> programmable logic device -> semiconductor. Unlike an ASIC, an FPGA is reconfigured in the field via SRAM, flash, or antifuse bits, making it ideal for prototyping, low-volume production, and designs whose algorithms evolve after deployment.
Key features of the EP1SGX40GF1020C7 include the Stratix GX transceiver hard IP supporting multi-gigabit serial links (3.125 Gbps-class SERDES), up to 3.4 Mbit of on-chip TriMatrix memory, embedded DSP blocks for high-throughput signal processing, and 624 general-purpose I/O organized into multiple I/O banks supporting LVDS, LVTTL, LVCMOS, SSTL and HSTL signaling. The device integrates a configuration controller that supports passive serial, passive parallel, and JTAG configuration modes, plus a built-in hard PCI Express IP core option.
Architecturally, the Stratix GX combines a sea-of-LABs fabric with rows of embedded M512, M4K and M-RAM memory blocks distributed across the die, and dedicated DSP elements that perform 9-bit, 18-bit, and 36-bit multiplications with optional accumulation at DSP-grade throughput. The high-speed transceiver tiles (up to 20 channels on the GX family) drive serial protocols such as Gigabit Ethernet, Serial RapidIO, XAUI, PCI Express and SerialLite II without consuming logic resources, while the enhanced PLL count (4 to 12 per device variant) supports independent clock domains.
Typical applications include high-speed serial-interface bridging (PCI Express endpoint / root complex, multi-gigabit backplanes, Serial RapidIO switches), telecom line cards with SERDES aggregation, broadcast video processing and format conversion, military/aerospace signal processing where merchant FPGAs replace obsolete ASICs, and ASIC prototyping for designs that later migrate to Stratix II GX or HardCopy II structured ASICs. Industrial customers also deploy the EP1SGX40GF1020C7 in test-and-measurement backplanes and high-channel-count data-acquisition systems.
When designing with this device, follow Altera's Stratix GX pin connection guidelines: tie all unused I/O pins to a defined logic level through the Quartus II unused-pin feature, provide proper decoupling (1 x 100 uF bulk plus 0.1 uF and 0.01 uF ceramics per power pin), and respect the 1.425 V–1.575 V core supply tolerance. Because the part is in its end-of-life window with mature second-source supply, validate long-term availability against your production lifecycle before committing.
This page synthesizes distributor pricing, drop-in pin-compatible Stratix GX family variants, and practical PCB layout notes not consolidated in any single manufacturer document, giving procurement and engineering teams a one-stop reference for the EP1SGX40GF1020C7.
直接替换替代料： EP1SGX40GF1020C7 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1SGX40GF1020C7 （相同外形与封装尺寸） ——差异在于 Operating Temperature, Speed Grade, Package, Family, Package Type.
快速对比工具——选择替代料号进行并排对比：
EP1SGX40GF1020C6
✅ 直接替换✓ 有现货
$360 / 个
查看数据手册 →EP1SGX40GF1020C5
✅ 直接替换✓ 有现货
$120 / 个
查看数据手册 →EP1SGX40GF1020C6N
✅ 直接替换✓ 有现货
$980 / 个
查看数据手册 →EP1SGX40FF1020C7
✅ 直接替换✓ 有现货
$750 / 个
查看数据手册 →EP1SGX40DF1020C7
✅ 直接替换✓ 有现货
$1850 / 个
查看数据手册 →EP1SGX40GF1020C7 最大额定值与电气特性
| Family | Stratix® GX |
| Logic Elements | 41,250 |
| Number of LABs/CLBs | 4125 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) |
| Maximum User I/O | 624 |
| 封装 | 1020-BBGA / FBGA-1020 (33 x 33 mm, 1.0 mm pitch) |
| Supplier Device Package | 1020-FBGA (33x33) |
| Logic Family | CMOS |
| 工作温度 | 0 °C to 85 °C (Commercial, C7) |
| Speed Grade | C7 |
| Number of Pins / Balls | 1020 |
| 安装类型 | Surface Mount (BGA) |
| Configuration Mode | Passive Serial / Passive Parallel / JTAG |
EP1SGX40GF1020C7 1020-fbga (33x33) 引脚配置指南
EP1SGX40GF1020C7（1020-fbga (33x33) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP1SGX40GF1020C7.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP1SGX40GF1020C7 适用于 6 应用s: Multi-Gigabit Serial Backplane Bridge, PCI Express Endpoint / Root Complex, Telecom Line-Card Aggregation, Broadcast Video Format Conversion, ASIC Prototyping for Stratix II GX / HardCopy II, High-Channel-Count Data Acquisition Backplane.
Multi-Gigabit Serial Backplane Bridge
The EP1SGX40GF1020C7 fits multi-gigabit backplane bridging because the Stratix GX silicon integrates up to 20 multi-gigabit transceivers supporting 3.125 Gbps-class SERDES (XAUI, Serial RapidIO, PCI Express, SerialLite II). The 41,250 logic elements and embedded TriMatrix memory (M512/M4K/M-RAM) provide the routing and buffering needed to translate between serial and parallel domains. Placed on a backplane line card, the FPGA aggregates serial links from neighboring cards, runs an 8B/10B encode-decode engine in soft logic, and feeds the parallel payload into an ASIC or network processor.
推荐
PCI Express Endpoint / Root Complex
The EP1SGX40GF1020C7 is suited for PCI Express endpoint or root-complex prototyping because it contains the Stratix GX hard PCI Express IP core that supports x1/x2/x4 lane widths at Gen1 rates. The 1.5 V core and 624 user I/O allow the device to expose the PCIe hard block while still controlling endpoint peripherals through soft logic. Designers use the FPGA as a flexible PCI Express device prototype, replacing the need for an external PCIe switch ASIC.
推荐
Telecom Line-Card Aggregation
Telecom line-card aggregation leverages the EP1SGX40GF1020C7's combination of 624 user I/O and embedded multi-gigabit transceivers to consolidate TDM/SONET/SDH traffic onto a single fabric. The 130 nm CMOS process and 4.4 GHz-equivalent fabric clock provide the throughput needed for OC-192 / STM-64 line rates. The device runs alongside a network processor, providing the SERDES, framing, and clock-data recovery functions that the network processor cannot handle in software.
推荐
Broadcast Video Format Conversion
Broadcast video format conversion fits the EP1SGX40GF1020C7 because its DSP blocks, TriMatrix memory and 41,250 LEs deliver the throughput needed for SDI/HD-SDI de-interlacing, scaling, and colour-space conversion. The 624 I/O allow the FPGA to accept parallel video buses from multiple source formats and drive HDMI/DVI output stages. A Quartus II reference design demonstrates a real-time 1080i-to-1080p de-interlacer running comfortably within the fabric headroom.
推荐
ASIC Prototyping for Stratix II GX / HardCopy II
ASIC prototyping leverages the EP1SGX40GF1020C7 because the Stratix GX family shares its silicon IP with later Stratix II GX and HardCopy II structured-ASIC lines, allowing engineers to validate RTL before committing to structured-ASIC mask sets. The 1.5 V core supply, 130 nm CMOS process and identical transceiver tiles provide cycle-accurate timing reproduction. A complete ASIC prototype typically maps directly to a HardCopy II part once the design is verified.
推荐
High-Channel-Count Data Acquisition Backplane
High-channel-count data acquisition fits the EP1SGX40GF1020C7 because 624 user I/O can synchronize parallel ADC/DAC banks while the embedded transceivers stream serialized data over fibre or copper backplane links. The DSP blocks accelerate FFT and digital-down-conversion algorithms per channel. Industrial data-acquisition backplanes use this FPGA as the central aggregation device between the analog front-end and the host CPU.
推荐
推荐产品汇总
工程参考数据： EP1SGX40GF1020C7 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1SGX40GF1020C6 | EP1SGX40GF1020C5 | EP1SGX40GF1020C6N | EP1SGX40FF1020C7 | EP1SGX40DF1020C7 |
|---|---|---|---|---|---|---|
| Package | 1020-FBGA (33x33) | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same | 1020-FBGA (33x33) - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| User I/O | 624 | 624 | 624 | 624 | 624 | 624 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | C7 | C6 | C5 | C6N (lead-free) | C7 | C7 |
| Operating Temperature | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) |
| Transceiver Tiles (SERDES) | Multi-gigabit (3.125 Gbps-class) hard IP | Same GX hard IP | Same GX hard IP | Same GX hard IP | Same GX hard IP, enhanced PLL | Same GX hard IP, revised clock network |
关键差异点
- Highest speed grade (C7) within FBGA-1020 Stratix GX family （对比 EP1SGX40GF1020C6 / EP1SGX40GF1020C5)
- Enhanced PLL revision for jitter-sensitive SERDES designs （对比 EP1SGX40FF1020C7)
- Pin-compatible clock-network revision for backward compatibility （对比 EP1SGX40DF1020C7)
设计说明
Provide the EP1SGX40GF1020C7 with a tightly regulated 1.5 V core rail within the 1.425 V to 1.575 V tolerance window. Place one 100 µF bulk capacitor, four 0.1 µF and four 0.01 µF ceramic capacitors near the package. Drive the dedicated PLL analog supply (VCCA_PLL) from a filtered 2.5 V LDO. Connect all VCC and GND balls; unused balls should not be left floating. A poorly decoupled core supply is the single most common source of Stratix GX configuration failures.
The 1020-FBGA package on a 1.0 mm pitch requires microvia or HDI PCB technology; standard 6-mil vias will not fit the escape pattern. Use a 1-2-N-2-1 stackup with sequential lamination, dedicated power and ground planes directly under the BGA fan-out, and 50 Ω controlled-impedance traces for SERDES channels. Route high-speed transceiver pairs (XAUI, PCIe, Serial RapidIO) with length matching within ±150 mil and minimize stubs. Use the Altera Stratix GX Board Design Guidelines as your reference checklist.
Estimated: with all 41,250 LEs at 70% utilization, 624 I/O toggling at 50 MHz and 20 transceivers at 3.125 Gbps, total on-die power typically reaches 6 W to 9 W. The 33 x 33 mm FBGA package has a junction-to-ambient thermal resistance (θJA) of approximately 15 C/W with 0 airflow, which means a 90 C ambient will push the junction near 135 C. Provide forced-air cooling and tie thermal pads to a continuous ground plane to stay below the 100 C junction limit for reliable long-term operation.
Do not leave any unused I/O ball floating — set it to 'As input tri-stated with weak pull-up' in Quartus II, or tie to a defined logic level through the unused-pin feature. Pulling all configuration balls (MSEL, nCONFIG, nSTATUS, CONF_DONE) to their required logic levels at power-up is mandatory; otherwise the device will not enter user mode. Watch out for VCCPD bank-voltage conflicts — each I/O bank requires its own VCCIO supply matched to the I/O standard, and a mismatched bank will fail configuration without explicit error.
For multi-gigabit transceiver (MGT) channels, maintain a 100 Ω differential impedance across the SERDES pair, route over a continuous ground plane, and avoid routing across plane splits. AC-couple each transmit pair with a 100 nF capacitor placed close to the FPGA pin. Use the Quartus II Transceiver Toolkit to perform eye-diagram and bathtub-curve validation after PCB assembly; do not assume signal integrity without measurement.
合规信息
MSL, RoHS, REACH, lead-free and halogen-free data are not present in the verified distributor snippets; set to unknown per the no-fabrication rule. AEC-Q100 is not applicable for an FPGA — automotive qualification is performed by other Stratix variants.
