EP1SGX25DF1020C6ESL - Stratix GX FPGA, 25K LE, 1020-BGA | Altera/Intel
料号： EP1SGX25DF1020C6ESL ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1450 | $1,450.00 |
| 10 | $1380 | $13,800.00 |
| 100 | $1290 | $129,000.00 |
| 500 | $1180 | $590,000.00 |
| 1,000 | $1095 | $1,095,000.00 |
EP1SGX25DF1020C6ESL 概述
An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines configurable logic blocks (LABs/CLBs), programmable interconnects, and dedicated hardware blocks such as memory, transceivers, and DSP elements. FPGAs sit at the top of the digital IC hierarchy alongside ASICs and CPLDs, offering higher logic density and performance than CPLDs while providing faster time-to-market than ASICs. The Stratix GX family specifically adds multi-gigabit transceivers for high-speed serial I/O.
Key features of the EP1SGX25DF1020C6ESL include embedded high-speed transceivers supporting 500 MHz operation (per family capability), dedicated DSP blocks for high-throughput arithmetic, distributed and block RAM totaling 1,944,576 bits, and 607 general-purpose user I/O pins distributed across multiple I/O banks supporting LVTTL, LVCMOS, SSTL, HSTL, LVDS, and other interface standards. The device also supports configuration via passive serial, fast passive parallel, and JTAG modes.
The EP1SGX25DF1020C6ESL is implemented on a 1.5 V core, 0.13-micrometer CMOS process with copper interconnect layers, providing a balance of performance, integration, and power efficiency for its generation. The 1020-ball FineLine BGA package enables dense board routing while supporting high pin-count applications.
Typical applications include high-speed serial interface bridging, custom communications backplanes, prototype ASIC validation, image and video processing pipelines, and embedded computing platforms. The combination of logic density, embedded transceivers, and rich I/O makes this device particularly suited for telecom infrastructure, test and measurement equipment, and defense applications.
When designing with this device, ensure signal integrity analysis is performed on high-speed serial links and that PCB layout adheres to BGA fanout and decoupling guidelines specified in the device handbook. Thermal management must consider the 1020-BGA thermal characteristics and any required heatsinking or airflow.
This page synthesizes distributor pricing data, drop-in same-package alternatives from the Stratix family, and practical design considerations not consolidated in the manufacturer datasheet alone.
直接替换替代料： EP1SGX25DF1020C6ESL ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1SGX25DF1020C6ESL （相同外形与封装尺寸） ——差异在于 Operating Temperature, Speed Grade, Package, Package Type, DSP Blocks.
快速对比工具——选择替代料号进行并排对比：
EP1SGX25DF1020C6
✅ 直接替换✓ 有现货
$289 / 个
查看数据手册 →EP1SGX25DF1020C6BN
✅ 直接替换✓ 有现货
$290 / 个
查看数据手册 →EP1SGX25DF1020C6ES
✅ 直接替换✓ 有现货
$285 / 个
查看数据手册 →EP1SGX25DF1020C6B
✅ 直接替换✓ 有现货
$175 / 个
查看数据手册 →EP1SGX25DF1020C5
✅ 直接替换✓ 有现货
$1720 / 个
查看数据手册 →EP1SGX25DF1020C5N
✅ 直接替换✓ 有现货
$650 / 个
查看数据手册 →EP1SGX25DF1020C5ES
✅ 直接替换✓ 有现货
$171 / 个
查看数据手册 →EP1SGX25DF1020C4
✅ 直接替换✓ 有现货
$1180 / 个
查看数据手册 →EP1SGX25DF1020C6ESL 最大额定值与电气特性
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Total RAM Bits | 1,944,576 bits |
| User I/O Pins | 607 |
| LABs/CLBs | 2,566 |
| 封装 | 1020-BBGA (FineLine BGA) |
| Core Voltage | 1.5 V |
| 工作结温 | 0 C to 85 C |
| 安装类型 | Surface Mount |
| Configuration Method | Passive Serial / Fast Passive Parallel / JTAG |
| Process Node | 0.13 um CMOS |
| Transceivers | Embedded multi-gigabit transceivers (per Stratix GX family) |
| DSP Blocks | Yes (embedded DSP blocks) |
| Speed Grade | C6 |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL, HSTL, LVDS (per family) |
EP1SGX25DF1020C6ESL 1020-bbga (fineline bga) 引脚配置指南
EP1SGX25DF1020C6ESL（1020-bbga (fineline bga) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP1SGX25DF1020C6ESL.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP1SGX25DF1020C6ESL 适用于 6 应用s: Telecom Backplane Bridging, Test and Measurement Equipment, Defense and Aerospace Signal Processing, Video and Image Processing Pipelines, ASIC Prototype Validation, Embedded Industrial Controller.
Telecom Backplane Bridging
The EP1SGX25DF1020C6ESL's embedded multi-gigabit transceivers and 25,660 logic elements make it a strong fit for telecom backplane bridging between legacy parallel buses and high-speed serial links. With 607 user I/O pins and 1,944,576 bits of embedded RAM, it can aggregate multiple lower-speed data streams into a single high-speed serial pipe while performing protocol conversion and buffering. Placed on a line card with dedicated SerDes channels routed with controlled-impedance differential pairs, the FPGA eliminates the need for a separate bridge ASIC. The wide I/O bank count supports multiple voltage standards, allowing direct connection to LVDS, HSTL, and SSTL PHY interfaces. Consider Stratix II GX for new designs needing lower power and higher transceiver rates.
推荐
Test and Measurement Equipment
In test and measurement platforms, the EP1SGX25DF1020C6ESL serves as a flexible pattern generator, signal processor, and data acquisition controller. Its 25,660 logic elements accommodate custom DSP pipelines, while 1,944,576 bits of embedded RAM provide deep capture buffers for high-sample-rate ADCs. The 607 I/O pins enable parallel interface to multiple front-end channels, and the embedded transceivers stream aggregated data to host processors over high-speed serial links. The 1.5 V core and commercial 0 C to 85 C junction range suit laboratory and production-floor environments. Designers should plan for a Stratix II GX or Stratix III migration in next-generation platforms for active long-term supply.
推荐
Defense and Aerospace Signal Processing
The EP1SGX25DF1020C6ESL is used in defense and aerospace subsystems for radar signal preprocessing, image fusion, and secure communication interfaces. Its 25,660 logic elements handle real-time FIR filtering, FFT preprocessing, and protocol encryption, while the embedded transceivers link to RF front-ends over gigabit serial links. The 607 I/O pins provide ample LVDS connectivity to high-speed ADCs and DACs. Note that this part is commercial temperature grade (0 C to 85 C junction) per the Stratix GX datasheet; designers needing full military temperature ranges should source an industrial-grade variant or specify a screened part from a defense supplier.
推荐
Video and Image Processing Pipelines
The EP1SGX25DF1020C6ESL's combination of 25,660 logic elements and 1,944,576 bits of embedded RAM supports multi-channel video processing pipelines, including scaling, color-space conversion, and on-the-fly overlay composition. The 607 user I/O pins accept Camera Link, LVDS-based video buses, and HDMI/DisplayPort companion interfaces through external bridge chips. The embedded DSP blocks accelerate motion estimation and deinterlacing, while the multi-gigabit transceivers carry uncompressed video streams to display controllers. Designers should verify PCB layout for the 1020-BGA fanout and provide matched-length routing for high-speed LVDS pairs per Stratix GX handbook guidelines.
推荐
ASIC Prototype Validation
The EP1SGX25DF1020C6ESL is commonly used as an ASIC prototype platform before committing to a custom mask set, because its 25,660 logic elements and rich I/O can emulate most mid-complexity ASICs in-system. Engineers map RTL designs to the FPGA, validate functional behavior at near-ASIC clock rates, and iterate rapidly without fabrication cost. The 607 I/O pins mirror common ASIC pad counts, and the embedded transceivers validate serial PHY interfaces during prototype bring-up. The 1020-BGA package provides strong signal integrity for high-speed prototype validation. Once the design is stable, migrate to a Stratix II GX or HardCopy ASIC for production volumes.
推荐
Embedded Industrial Controller
In embedded industrial controllers, the EP1SGX25DF1020C6ESL executes custom real-time control loops, manages multi-protocol fieldbus interfaces, and aggregates sensor data from dozens of nodes. Its 25,660 logic elements accommodate soft-core CPUs (Nios II), custom state machines, and protocol stacks concurrently, while 1,944,576 bits of RAM buffer high-rate sensor streams. The 607 I/O pins interface directly to LVTTL/LVCMOS industrial sensors, encoders, and actuators, eliminating the need for many external glue logic devices. Engineers designing new industrial systems should evaluate Cyclone IV or Cyclone V for cost-optimized active-production alternatives, reserving Stratix GX for high-throughput applications.
推荐
推荐产品汇总
工程参考数据： EP1SGX25DF1020C6ESL ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1SGX25DF1020C6 | EP1SGX25DF1020C6BN | EP1SGX25DF1020C6ES | EP1SGX25DF1020C5 | EP1SGX25DF1020C4 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1020-BBGA (FineLine BGA) | 1020-BBGA (FineLine BGA) - same | 1020-BBGA (FineLine BGA) - same | 1020-BBGA (FineLine BGA) - same | 1020-BBGA (FineLine BGA) - same | 1020-BBGA (FineLine BGA) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| User I/O Pins | 607 | 607 | 607 | 607 | 607 | 607 |
| Speed Grade | C6 | C6 | C6 | C6 | C5 (-1 grade) | C4 (-2 grades) |
| Operating Temperature | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
关键差异点
- Identical silicon and footprint as standard EP1SGX25DF1020C6 （对比 EP1SGX25DF1020C6)
- C6 speed grade retains highest performance in Stratix GX family （对比 EP1SGX25DF1020C5 / C4)
- Large 607 I/O count enables single-chip integration （对比 Smaller Stratix GX siblings (e.g. EP1SGX10))
设计说明
The 1020-BGA FineLine package requires via-in-pad or microvia technology for fanout, with controlled-impedance routing for high-speed transceiver channels. Per the Stratix GX device handbook, BGA ball pitch and signal-integrity recommendations must be observed for gigabit serial links; recommend 8-layer PCB minimum with continuous ground planes beneath the BGA. Matched-length differential pair routing within 5 mil tolerance is critical for the embedded multi-gigabit transceivers. Decoupling capacitors should be placed directly beneath or adjacent to BGA balls with short, wide traces.
The 1020-BGA package dissipates heat through the balls and the PCB copper area; per the Stratix GX datasheet, junction-to-ambient thermal resistance depends strongly on board design. Estimated: with a 1020-BGA and a 4-layer PCB with 1 oz copper and minimal airflow, theta_JA can exceed 15 C/W. For high-utilization designs, forced airflow or a heatsink attached to the package lid may be required to keep junction temperature below 85 C.
Configuration mode selection (Passive Serial, Fast Passive Parallel, or JTAG) must match the bitstream storage device and board-level pull-ups; misconfiguration causes the FPGA to fail initialization. Do not assume C-grade parts are interchangeable with I-grade (industrial) variants - speed and temperature characteristics differ. When migrating from C6 to C5 or C4 speed grades, verify that all timing constraints still close, because the slower grade may break critical paths at the original clock rate. Plan for Stratix II GX or later family migration to avoid being stranded on an obsolete part.
合规信息
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status are not specified in the provided Verified Web Data. The 'BN' suffix variants in the family are typically associated with lead-free builds, but this specific MPN's compliance is flagged [DATA_NEEDED]. AEC-Q100 not applicable - this is a commercial-grade FPGA.