EP2AGZ225FF35C3N - Arria II GZ FPGA 224K LE 1152-FCBGA | Intel
부품 번호: EP2AGZ225FF35C3N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2994.92 | $2,994.92 |
| 10 | $2850 | $28,500.00 |
| 100 | $2650 | $265,000.00 |
| 500 | $2400 | $1,200,000.00 |
| 1,000 | $2200 | $2,200,000.00 |
EP2AGZ225FF35C3N 개요
An FPGA (Field Programmable Gate Array) is a programmable logic device that allows designers to configure digital logic, memory, and routing after fabrication. FPGAs sit in the broader category hierarchy of programmable logic devices (PLD) -> FPGA -> semiconductor IC. The Arria II GZ family is built on a 40nm process node and targets applications needing transceivers, DSP blocks, and external memory interfaces (EMIF) at low total cost of ownership.
Key features of the EP2AGZ225FF35C3N include 12.5 Gbps transceiver capability, dedicated DSP blocks for high-speed signal processing, up to 554 user I/Os, and embedded RAM blocks with parity support. The device supports PCI Express Gen2 hard IP, multiple high-speed memory interfaces (DDR3, DDR2, QDRII+, RLDRAM2), and eight full-duplex clock data recovery (CDR)-based transceivers plus 16 additional transceivers up to 6.375 Gbps.
The architecture uses logic elements (LE) grouped into Adaptive Logic Modules (ALMs), each containing 8-input fracturable look-up tables (LUTs), registers, and dedicated arithmetic adders. The 1152-ball FCBGA package provides the high-density interconnect required for the 554 user I/Os and the multiple transceiver channels. Speed grade 3 indicates a moderate speed bin, balancing performance and yield for cost-sensitive applications.
Typical applications include wireless baseband processing, high-definition video broadcast equipment, radar signal processing, test and measurement instrumentation, medical imaging, and high-speed data acquisition systems. Designers select the Arria II GZ family when they need Stratix-class transceivers and DSP throughput at a lower price point, and when 28 Gbps Stratix V-class performance is not required.
When designing with the EP2AGZ225FF35C3N, careful PCB layout is essential because the FCBGA package demands a multi-layer PCB with matched-impedance traces, blind/buried vias, and controlled-length routing for the transceiver channels. Power distribution requires multiple dedicated voltage rails (core, I/O, PLL, transceiver, auxiliary) with extensive decoupling, and thermal management via heatsink attachment is typically required at full transceiver utilization.
This page synthesizes distributor pricing from DigiKey, Mouser, and Octopart, Intel-recommended Arria II GZ drop-in alternatives from the same family, and practical design considerations not found in the standalone datasheet, making it a faster decision aid for procurement and FPGA selection.
드롭인 대체품: EP2AGZ225FF35C3N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGZ225FF35C3N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature Grade, RoHS Status, Logic Array Blocks (LABs), Transceivers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGZ225FF35C4N
✅ 드롭인✓ 재고 있음
$1750 / 개
데이터시트 보기 →EP2AGZ225FF35C5N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP2AGZ225FF35I3N
✅ 드롭인✓ 재고 있음
$2655 / 개
데이터시트 보기 →EP2AGZ225FF35C3G
✅ 드롭인✓ 재고 있음
$868.4 / 개
데이터시트 보기 →EP2AGZ225FF35C3N 최대 정격 & 전기적 특성
| Family | Arria II GZ |
| Logic Elements (LE) | 224,000 |
| Logic Array Blocks (LAB) | 8,960 |
| Embedded Memory (bits) | 14,248,960 |
| User I/Os | 554 |
| 패키지 | 1152-BBGA, FCBGA |
| Process Node | 40 nm |
| Speed Grade | 3 |
| Temperature Grade | Commercial (0C to +85C) |
| Transceivers | Up to 12.5 Gbps |
| DSP Blocks | Yes (variable-precision) |
| Memory Interfaces | DDR3, DDR2, QDRII+, RLDRAM2 |
| PCI Express Hard IP | Gen1, Gen2 |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
EP2AGZ225FF35C3N 1152-bbga, fcbga 핀 구성 가이드
EP2AGZ225FF35C3N(1152-bbga, fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGZ225FF35C3N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGZ225FF35C3N 적합 용도: 7 애플리케이션s: Wireless Baseband Processing, High-Definition Video Broadcast Equipment, Radar Signal Processing, Test and Measurement Instrumentation, Medical Imaging Systems, High-Speed Data Acquisition Systems, Industrial Motor Control and Drive Systems.
Wireless Baseband Processing
The EP2AGZ225FF35C3N is well suited for wireless baseband processing in 4G LTE and WiMAX base stations. Its 224,000 logic elements and variable-precision DSP blocks support high-throughput channel coding (Turbo, Viterbi), FFT/iFFT engines, and MIMO signal processing. The 12.5 Gbps transceivers enable CPRI and OBSAI fronthaul links between baseband units and remote radio heads. Embedded memory (14.2 Mbits) accommodates intermediate symbol buffers without external SRAM. Designers can implement complete PHY-layer functions in a single device while leaving headroom for MAC-layer acceleration.
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High-Definition Video Broadcast Equipment
The EP2AGZ225FF35C3N supports real-time HD and 4K video pipelines in broadcast routers, switchers, and contribution encoders. Its DSP blocks accelerate color space conversion, scaling, deinterlacing, and chroma keying in real time. The 12.5 Gbps transceivers carry SDI (SMPTE 424M, 425M), HDMI 1.4, and DisplayPort 1.2 signals natively. With 554 user I/Os and external DDR3 memory interfaces, the device can drive multi-output video walls and frame synchronizers without external bridge chips. Commercial temperature grade fits typical broadcast equipment chassis operating below 85C.
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Radar Signal Processing
The EP2AGZ225FF35C3N's variable-precision DSP blocks handle pulse-Doppler radar signal processing including FFT, moving target indication (MTI), and constant false-alarm rate (CFAR) detection in real time. Its 14.2 Mbits of embedded memory serves as fast-access coefficient and window storage for FFT engines. Transceivers up to 12.5 Gbps accept digitized IF signals directly from high-speed ADCs, eliminating intermediate serializer/deserializer stages. The device is used in maritime, weather, and air-traffic-control radar systems where deterministic latency and parallel DSP throughput matter more than raw logic density.
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Test and Measurement Instrumentation
The EP2AGZ225FF35C3N enables high-channel-count oscilloscopes, logic analyzers, and protocol analyzers. Its 554 user I/Os accommodate parallel probe interfaces, and the DSP blocks accelerate FFT-based spectrum analysis in real time. Transceivers accept high-speed serial protocols (PCIe Gen2, 10GbE, USB 3.0) for instrument I/O. The embedded memory and external DDR3 controllers provide deep acquisition buffer storage. Commercial temperature grade is sufficient for laboratory and rack-mounted instrumentation. Quartus Prime supports the device with built-in reference designs for FFT and PCIe implementations.
추천
Medical Imaging Systems
The EP2AGZ225FF35C3N powers ultrasound beamformers, CT image reconstruction, and MRI gradient controllers in medical imaging equipment. DSP blocks implement FIR filters and back-projection algorithms for image reconstruction. The 12.5 Gbps transceivers move raw sensor data from probe heads to processing electronics. With 224K LEs and 14.2 Mbits of memory, the device can host multiple processing pipelines in parallel. Medical applications typically migrate to industrial-grade (-40C to +100C) variants for reliability, available as the EP2AGZ225FF35I3N in the same 1152-FCBGA package.
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High-Speed Data Acquisition Systems
The EP2AGZ225FF35C3N handles multi-channel high-speed ADC data acquisition in scientific, defense, and industrial monitoring systems. Transceivers up to 12.5 Gbps accept serial LVDS data from ADCs up to 250 MSPS without external deserializer chips. The 224K LEs implement channel calibration, decimation filters, and trigger logic. External DDR3 memory controllers capture deep waveform records. The FCBGA package's controlled-impedance pins ensure signal integrity between the FPGA and adjacent ADCs on the PCB. Quartus Prime provides MegaCore functions for common data-acquisition DSP blocks.
추천
Industrial Motor Control and Drive Systems
The EP2AGZ225FF35C3N executes field-oriented control (FOC) algorithms for high-performance AC motor drives in industrial automation. Its variable-precision DSP blocks accelerate Park/Clarke transforms, space-vector PWM generation, and PI control loops at PWM frequencies up to 100 kHz. The 554 user I/Os handle multiple encoder inputs, resolver interfaces, and gate driver signals for three-phase IGBT/MOSFET bridges. Transceivers enable EtherCAT, Profinet, and SERCOS III industrial Ethernet connectivity. Designers typically pair the Arria II GZ with external current-sense amplifiers and gate drivers in CNC machines, robotics, and servo drives.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGZ225FF35C3N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGZ225FF35C4N | EP2AGZ225FF35C5N | EP2AGZ225FF35I3N | EP2AGZ225FF35C3G |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA |
| Logic Elements | 224,000 | 224,000 | 224,000 | 224,000 | 224,000 |
| Speed Grade | C3 | C4 | C5 | I3 | C3 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Industrial (-40C to +100C) | Commercial |
| Embedded Memory (bits) | 14,248,960 | 14,248,960 | 14,248,960 | 14,248,960 | 14,248,960 |
| User I/Os | 554 | 554 | 554 | 554 | 554 |
| Transceiver Max Data Rate | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps |
주요 차별점
- High-density 224K LE Arria II GZ with 12.5 Gbps transceivers (vs EP2AGX260FF35C5N (Arria II GX, 260K LE but only 6.375 Gbps transceivers))
- Commercial speed grade C3 is the fastest variant (vs EP2AGZ225FF35C5N (speed grade C5))
- Pin-compatible with industrial temperature variant (vs EP2AGZ225FF35I3N (industrial temperature, same package))
설계 노트
The 1152-ball FCBGA package mandates a high-density PCB stack-up with at least 8 layers, microvias or stacked-vias, and impedance-controlled routing for the 12.5 Gbps transceiver channels. Decoupling requires a mix of bulk, mid-frequency, and high-frequency MLCC capacitors placed as close as possible to each power pin. Reference the Intel Arria II GZ Pin Connection Guidelines (PCG) and board design guidelines (AN 521) for via-in-pad recommendations and signal-integrity design rules. Estimated: a typical board for this device runs $400-$800 USD in PCB fabrication alone at low volumes.
At full transceiver utilization (16 channels at 12.5 Gbps) and 80% logic utilization, the EP2AGZ225FF35C3N can dissipate 8-12 W. A passive heatsink attached with thermal interface material is the minimum requirement; for enclosed chassis without forced airflow, an active heatsink or blower fan is recommended. Estimated: junction temperature rise at 10 W dissipation with a standard 20 C/W heatsink is ~50 C above ambient, requiring ambient below 35 C for commercial-temperature reliability.
Do not confuse the Arria II GZ (EP2AGZ) with the lower-end Arria II GX (EP2AGX). The GZ family supports up to 12.5 Gbps transceivers and higher DSP block count, while the GX family tops out at 6.375 Gbps. Verify the device order code carefully on procurement documents - replacing a GZ with a GX in the same PCB footprint will silently fail timing closure for transceiver-based designs. Also note the difference between speed grades (C3 fastest, C5 slowest) which affects Fmax by 15-30%.
The EP2AGZ225FF35C3N requires multiple voltage rails: VCCINT (core), VCCAUX and VCCAUX_GXB (auxiliary), VCCPD (I/O pre-driver), VCCIO (I/O banks), VCCR_GXB and VCCT_GXB (transceiver), VCCP (PCIe), and VCCBAT (battery backup for key). Power-on sequencing must follow the Arria II GZ handbook specification; out-of-order sequencing can latch-up the device. Use a power management IC such as the LTC3612 or ISL80030 to manage rail sequencing and minimize inrush current during configuration.
Transceiver channel routing must use 100 ohm differential impedance with intra-pair skew below 1 ps and inter-channel skew matched to within 5 ps for CPRI applications. Use guard traces or ground shielding around the high-speed lanes. Length-matching the reference clock to all transceiver banks is essential; do not daisy-chain. Reference Intel application note AN 530 for Arria II GZ transceiver board design, including via stub minimization and AC-coupling capacitor placement.
규정 준수 정보
RoHS compliant per Intel/Altera product specifications. AEC-Q100 qualification is not applicable - FPGAs are typically not AEC-Q100 qualified at the component level; the system integrator must perform automotive qualification. REACH and conflict minerals compliance published in Intel material declaration database.