EPF81500ARI240-3 - FLEX 8000 FPGA 16K Gates 240-RQFP | Intel
料号: EPF81500ARI240-3 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $85.5 | $855.00 |
| 100 | $76 | $7,600.00 |
| 500 | $67.5 | $33,750.00 |
| 1,000 | $60 | $60,000.00 |
EPF81500ARI240-3 概述
A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and configurable I/O cells. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> programmable logic -> logic ICs -> integrated circuits, and are widely used to implement glue logic, custom state machines, bus bridges, and DSP datapaths without the cost and lead time of an ASIC. SRAM-based FPGAs like the FLEX 8000 family are volatile and must be configured at every power-up from an external memory or configuration device.
Key features include in-circuit reconfigurability (ICR) via Altera EPC1, EPC1064, EPC1213, or EPC1441 configuration devices, fine-grained register-rich architecture, JTAG-based boundary-scan test support, and tri-state/registered I/O with selectable drive strength. The RQFP-240 package provides high pin density for I/O-intensive designs and uses an exposed pad to improve thermal dissipation during continuous switching.
The FLEX 8000 architecture uses continuous FastTrack interconnect routing with predictable delay, allowing designers to balance logic density and timing closure. With 1,296 logic elements and 16,000 usable gates, the device targets medium-complexity glue-logic, communications protocol bridging, and industrial control designs that require more than a CPLD but less than a modern high-density FPGA.
Typical applications include industrial control boards, telecommunications glue logic, bus bridge interfaces, embedded processor peripheral expansion, and legacy replacement of discrete SSI/MSI logic. The wide 5 V tolerance of the I/O ring simplifies interfacing with TTL/CMOS peripherals of its era.
When designing with this device, ensure a valid configuration source is present at every power-up because the SRAM configuration memory is volatile. Maintain a ground return path under the exposed pad and follow Altera's recommended decoupling scheme of 0.1 µF + bulk capacitors placed adjacent to each power pin.
直接替换替代料: EPF81500ARI240-3 ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号: EPF81500ARI240-3 (相同外形与封装尺寸) ——差异在于 Package, Process Technology, Configuration Method, In-Circuit Reconfigurability, Mounting Type.
快速对比工具——选择替代料号进行并排对比:
EPF81500ARC240-3
✅ 直接替换✓ 有现货
$25 / 个
查看数据手册 →EPF81500ARC240-2
✅ 直接替换✓ 有现货
$61.75 / 个
查看数据手册 →EPF81500ARC240-4
✅ 直接替换✓ 有现货
$19.75 / 个
查看数据手册 →EPF81500AQC240-2
✅ 直接替换✓ 有现货
$61.4 / 个
查看数据手册 →EPF81500AQC240-3
✅ 直接替换✓ 有现货
$21.75 / 个
查看数据手册 →EPF81500ARC240-2A
✅ 直接替换✓ 有现货
$44.2 / 个
查看数据手册 →EPF81500ARI240-3 最大额定值与电气特性
| Family | FLEX 8000 |
| Device | EPF81500 |
| Usable Gates | 16,000 |
| Logic Elements / Cells | 1,296 |
| Number of Registers | 1,500 (max) |
| Maximum User I/O | 181 |
| Maximum Internal Clock Frequency | 125 MHz |
| Process Technology | 0.42 µm CMOS SRAM |
| 电源电压 | 5 V |
| 封装 | 240-pin RQFP (Power Quad Flat Pack) with exposed pad |
| Configuration Method | Serial or parallel EPROM / Altera EPC1, EPC1064, EPC1213, EPC1441 |
| In-Circuit Reconfigurability | Yes |
| JTAG / Boundary Scan | Supported |
| 安装类型 | Surface Mount |
EPF81500ARI240-3 引脚配置
| 引脚 1 | I/O — User I/O pin |
| 引脚 2 | I/O — User I/O pin |
| 引脚 3 | I/O — User I/O pin |
| 引脚 4 | I/O — User I/O pin |
| 引脚 5 | I/O — User I/O pin |
| 引脚 6 | VCCINT — Internal core supply voltage (5V) |
| 引脚 7 | GND — Ground |
| 引脚 8 | I/O — User I/O pin |
| 引脚 9 | I/O — User I/O pin |
| 引脚 10 | I/O — User I/O pin |
| 引脚 11 | I/O — User I/O pin |
| 引脚 12 | I/O — User I/O pin |
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| 引脚 58 | I/O — User I/O pin |
| 引脚 59 | I/O — User I/O pin |
| 引脚 60 | I/O — User I/O pin |
| 引脚 61 | VCCIO — I/O supply voltage (5V) |
| 引脚 62 | GND — Ground |
| 引脚 63 | I/O — User I/O pin |
| 引脚 64 | I/O — User I/O pin |
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| 引脚 119 | I/O — User I/O pin |
| 引脚 120 | I/O — User I/O pin |
| 引脚 121 | VCCINT — Internal core supply voltage (5V) |
| 引脚 122 | GND — Ground |
| 引脚 123 | I/O — User I/O pin |
| 引脚 124 | I/O — User I/O pin |
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| 引脚 179 | I/O — User I/O pin |
| 引脚 180 | I/O — User I/O pin |
| 引脚 181 | VCCIO — I/O supply voltage (5V) |
| 引脚 182 | GND — Ground |
| 引脚 183 | nCONFIG — Configuration control (active low) |
| 引脚 184 | nSTATUS — Configuration status (active low) |
| 引脚 185 | CONF_DONE — Configuration complete indicator |
| 引脚 186 | DCLK — Configuration clock input |
| 引脚 187 | DATA0 — Configuration data input |
| 引脚 188 | TCK — JTAG test clock |
| 引脚 189 | TMS — JTAG test mode select |
| 引脚 190 | TDI — JTAG test data input |
| 引脚 191 | TDO — JTAG test data output |
| 引脚 192 | CLK0 — Dedicated clock input 0 |
| 引脚 193 | CLK1 — Dedicated clock input 1 |
| 引脚 194 | CLK2 — Dedicated clock input 2 |
| 引脚 195 | CLK3 — Dedicated clock input 3 |
| 引脚 196 | I/O — User I/O pin |
| 引脚 197 | I/O — User I/O pin |
| 引脚 198 | I/O — User I/O pin |
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| 引脚 239 | I/O — User I/O pin |
| 引脚 240 | I/O — User I/O pin |
典型应用
EPF81500ARI240-3 适用于 6 应用s: Industrial Control Glue Logic, Telecommunications Bus Bridge, Embedded Processor Peripheral Expansion, Legacy Replacement of Discrete SSI/MSI Logic, Test and Measurement Front-End, Aerospace and Defense Avionics Interfaces.
Industrial Control Glue Logic
The EPF81500ARI240-3's 16,000 usable gates and 181 user I/O make it well-suited for industrial control glue-logic applications where it bridges microcontrollers to legacy peripherals, decodes address lines, and generates timing waveforms. Its 5 V I/O tolerance simplifies interfacing with classic TTL/CMOS sensors, optocouplers, and motor-driver ICs typical of factory-floor designs. The exposed pad on the RQFP-240 package aids thermal dissipation for continuously switching outputs. Source: FLEX 8000 industrial reference designs.
推荐
Telecommunications Bus Bridge
The EPF81500ARI240-3's 125 MHz maximum internal clock and 181 I/O enable telecom bus-bridge designs that translate between parallel backplanes, serial links, and processor buses. Its register-rich architecture efficiently implements byte-parity logic, FIFO buffers, and protocol state machines. The 240-pin RQFP provides enough I/O to bridge legacy 8/16/32-bit buses concurrently, reducing board area versus discrete SSI/MSI logic.
推荐
Embedded Processor Peripheral Expansion
The EPF81500ARI240-3 expands embedded processor I/O count and adds custom peripherals without redesigning the processor board. Engineers offload I/O expansion, timer/counter banks, PWM generators, and interrupt controllers to the FPGA, freeing processor pins and reducing CPU cycle overhead. Its in-circuit reconfigurability via EPC1/EPC1441 allows firmware-style updates to peripheral logic in the field, simplifying end-product maintenance.
推荐
Legacy Replacement of Discrete SSI/MSI Logic
The EPF81500ARI240-3 consolidates dozens of 74-series TTL/MSI packages - decoders, multiplexers, counters, and latches - into a single programmable device, dramatically reducing PCB area, power, and assembly cost. Its 16K usable gates accommodate designs that previously required multiple logic boards, and the JTAG/boundary-scan support simplifies board-level test. The 5 V supply matches classic TTL power rails, easing migration of legacy boards.
推荐
Test and Measurement Front-End
The EPF81500ARI240-3 implements custom measurement front-ends - pattern generators, counter banks, trigger logic, and timing sequencers - where its 125 MHz fMAX and 181 I/O enable multi-channel stimulus and capture. Its deterministic FastTrack interconnect simplifies timing analysis for T&M designs requiring repeatable edge placement. Legacy T&M equipment widely uses FLEX 8000 parts in long-life programs where redesign costs outweigh modern migration.
推荐
Aerospace and Defense Avionics Interfaces
The EPF81500ARI240-3 continues to serve long-life aerospace and defense programs because avionics and MIL-spec systems often retain FLEX 8000 designs for 20+ years to avoid re-certification costs. The 240-pin RQFP package and 5 V I/O tolerance match legacy ARINC 429, MIL-STD-1553, and discrete interface circuits. Obsolete-stock distributors maintain qualified inventories for these programs; design notes call for additional component-level screening.
推荐
推荐产品汇总
工程参考数据: EPF81500ARI240-3 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EPF81500ARC240-3 | EPF81500ARC240-2 | EPF81500ARC240-4 | EPF81500AQC240-2 | EPF81500AQC240-3 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 240-pin RQFP | 240-pin RQFP - same | 240-pin RQFP - same | 240-pin RQFP - same | 240-pin RQFP - same | 240-pin RQFP - same |
| Family | FLEX 8000 | FLEX 8000 - same | FLEX 8000 - same | FLEX 8000 - same | FLEX 8000 - same | FLEX 8000 - same |
| Usable Gates | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 |
| Logic Elements | 1,296 | 1,296 | 1,296 | 1,296 | 1,296 | 1,296 |
| Maximum User I/O | 181 | 181 | 181 | 181 | 181 | 181 |
| Maximum fMAX | 125 MHz (-3 speed grade) | 125 MHz (-3) | higher (-2) | lower (-4) | higher (-2) | 125 MHz (-3) |
| Temperature Grade | Industrial | Commercial | Commercial | Commercial | Commercial | Commercial |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
关键差异点
- Industrial temperature grade (对比 EPF81500ARC240-3)
- Balanced -3 speed grade for typical glue logic (对比 EPF81500ARC240-2)
- Largest FLEX 8000 density (对比 EPF81188ARI240-4)
设计说明
The FLEX 8000 family requires a stable 5 V supply on VCCINT and VCCIO with strict tolerance per the datasheet. Place one 0.1 µF ceramic decoupling capacitor adjacent to every VCC pin and one bulk tantalum or electrolytic capacitor (≥ 22 µF) near the package. Power sequencing is not required between VCCINT and VCCIO. Estimated: Icc core current at 125 MHz with high toggle rate typically reaches 200-300 mA per supply rail.
The 240-pin RQFP package has a 0.5 mm lead pitch and a large exposed thermal pad that MUST be soldered to a ground plane for mechanical reliability and thermal performance. Use a 4-layer PCB with continuous ground plane beneath the device, and route all high-speed signals on inner layers to minimize EMI. Keep configuration traces (DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE) short and away from switching I/O.
Because the FLEX 8000 SRAM configuration is volatile, the configuration source (EPC1, EPC1064, EPC1213, or EPC1441) must be present and operational at every power-up. The configuration clock DCLK should be terminated with a series resistor if the trace exceeds 50 mm. JTAG chain integrity is critical for boundary-scan testing; observe the TCK pull-up requirement documented in the FLEX 8000 handbook.
Common pitfalls include (1) leaving the exposed pad un-soldered, causing thermal and reliability failures; (2) forgetting that all configuration pins must be properly pulled up during normal operation if JTAG is used in passive mode; (3) assuming the device is hot-swappable when in fact SRAM configuration is volatile - the device enters undefined states without a valid configuration; (4) ignoring the I/O voltage tolerance when interfacing with 3.3 V logic.
合规信息
EPF81500ARI240-3 was introduced in the mid-1990s before RoHS compliance was standardized. Compliance status for RoHS/REACH/lead-free is not explicitly published in the FLEX 8000 datasheet or current product page; treat as 'unknown' and verify with the distributor or supplier for new designs requiring compliance attestation.