EPF81500ARI240-3 - FLEX 8000 FPGA 16K Gates 240-RQFP | Intel
MPN: EPF81500ARI240-3 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $85.5 | $855.00 |
| 100 | $76 | $7,600.00 |
| 500 | $67.5 | $33,750.00 |
| 1,000 | $60 | $60,000.00 |
Drop-in alternatives for EPF81500ARI240-3 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EPF81500ARC240-3
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View Datasheet βEPF81500AQC240-2
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View Datasheet βEPF81500AQC240-3
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View Datasheet βEPF81500ARI240-3 Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Device | EPF81500 |
| Usable Gates | 16,000 |
| Logic Elements / Cells | 1,296 |
| Number of Registers | 1,500 (max) |
| Maximum User I/O | 181 |
| Maximum Internal Clock Frequency | 125 MHz |
| Process Technology | 0.42 Β΅m CMOS SRAM |
| Supply Voltage | 5 V |
| Package | 240-pin RQFP (Power Quad Flat Pack) with exposed pad |
| Configuration Method | Serial or parallel EPROM / Altera EPC1, EPC1064, EPC1213, EPC1441 |
| In-Circuit Reconfigurability | Yes |
| JTAG / Boundary Scan | Supported |
| Mounting Type | Surface Mount |
EPF81500ARI240-3 Pin Configuration
| Pin 1 | I/O β User I/O pin |
| Pin 2 | I/O β User I/O pin |
| Pin 3 | I/O β User I/O pin |
| Pin 4 | I/O β User I/O pin |
| Pin 5 | I/O β User I/O pin |
| Pin 6 | VCCINT β Internal core supply voltage (5V) |
| Pin 7 | GND β Ground |
| Pin 8 | I/O β User I/O pin |
| Pin 9 | I/O β User I/O pin |
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| Pin 60 | I/O β User I/O pin |
| Pin 61 | VCCIO β I/O supply voltage (5V) |
| Pin 62 | GND β Ground |
| Pin 63 | I/O β User I/O pin |
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| Pin 121 | VCCINT β Internal core supply voltage (5V) |
| Pin 122 | GND β Ground |
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| Pin 180 | I/O β User I/O pin |
| Pin 181 | VCCIO β I/O supply voltage (5V) |
| Pin 182 | GND β Ground |
| Pin 183 | nCONFIG β Configuration control (active low) |
| Pin 184 | nSTATUS β Configuration status (active low) |
| Pin 185 | CONF_DONE β Configuration complete indicator |
| Pin 186 | DCLK β Configuration clock input |
| Pin 187 | DATA0 β Configuration data input |
| Pin 188 | TCK β JTAG test clock |
| Pin 189 | TMS β JTAG test mode select |
| Pin 190 | TDI β JTAG test data input |
| Pin 191 | TDO β JTAG test data output |
| Pin 192 | CLK0 β Dedicated clock input 0 |
| Pin 193 | CLK1 β Dedicated clock input 1 |
| Pin 194 | CLK2 β Dedicated clock input 2 |
| Pin 195 | CLK3 β Dedicated clock input 3 |
| Pin 196 | I/O β User I/O pin |
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Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPF81500ARI240-3 is suitable for 6 applications: Industrial Control Glue Logic, Telecommunications Bus Bridge, Embedded Processor Peripheral Expansion, Legacy Replacement of Discrete SSI/MSI Logic, Test and Measurement Front-End, Aerospace and Defense Avionics Interfaces.
Industrial Control Glue Logic
The EPF81500ARI240-3's 16,000 usable gates and 181 user I/O make it well-suited for industrial control glue-logic applications where it bridges microcontrollers to legacy peripherals, decodes address lines, and generates timing waveforms. Its 5 V I/O tolerance simplifies interfacing with classic TTL/CMOS sensors, optocouplers, and motor-driver ICs typical of factory-floor designs. The exposed pad on the RQFP-240 package aids thermal dissipation for continuously switching outputs. Source: FLEX 8000 industrial reference designs.
Recommended
Telecommunications Bus Bridge
The EPF81500ARI240-3's 125 MHz maximum internal clock and 181 I/O enable telecom bus-bridge designs that translate between parallel backplanes, serial links, and processor buses. Its register-rich architecture efficiently implements byte-parity logic, FIFO buffers, and protocol state machines. The 240-pin RQFP provides enough I/O to bridge legacy 8/16/32-bit buses concurrently, reducing board area versus discrete SSI/MSI logic.
Recommended
Embedded Processor Peripheral Expansion
The EPF81500ARI240-3 expands embedded processor I/O count and adds custom peripherals without redesigning the processor board. Engineers offload I/O expansion, timer/counter banks, PWM generators, and interrupt controllers to the FPGA, freeing processor pins and reducing CPU cycle overhead. Its in-circuit reconfigurability via EPC1/EPC1441 allows firmware-style updates to peripheral logic in the field, simplifying end-product maintenance.
Recommended
Legacy Replacement of Discrete SSI/MSI Logic
The EPF81500ARI240-3 consolidates dozens of 74-series TTL/MSI packages - decoders, multiplexers, counters, and latches - into a single programmable device, dramatically reducing PCB area, power, and assembly cost. Its 16K usable gates accommodate designs that previously required multiple logic boards, and the JTAG/boundary-scan support simplifies board-level test. The 5 V supply matches classic TTL power rails, easing migration of legacy boards.
Recommended
Test and Measurement Front-End
The EPF81500ARI240-3 implements custom measurement front-ends - pattern generators, counter banks, trigger logic, and timing sequencers - where its 125 MHz fMAX and 181 I/O enable multi-channel stimulus and capture. Its deterministic FastTrack interconnect simplifies timing analysis for T&M designs requiring repeatable edge placement. Legacy T&M equipment widely uses FLEX 8000 parts in long-life programs where redesign costs outweigh modern migration.
Recommended
Aerospace and Defense Avionics Interfaces
The EPF81500ARI240-3 continues to serve long-life aerospace and defense programs because avionics and MIL-spec systems often retain FLEX 8000 designs for 20+ years to avoid re-certification costs. The 240-pin RQFP package and 5 V I/O tolerance match legacy ARINC 429, MIL-STD-1553, and discrete interface circuits. Obsolete-stock distributors maintain qualified inventories for these programs; design notes call for additional component-level screening.
Recommended
Recommended Products Summary
Engineering reference data for EPF81500ARI240-3 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF81500ARC240-3 | EPF81500ARC240-2 | EPF81500ARC240-4 | EPF81500AQC240-2 | EPF81500AQC240-3 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 240-pin RQFP | 240-pin RQFP - same | 240-pin RQFP - same | 240-pin RQFP - same | 240-pin RQFP - same | 240-pin RQFP - same |
| Family | FLEX 8000 | FLEX 8000 - same | FLEX 8000 - same | FLEX 8000 - same | FLEX 8000 - same | FLEX 8000 - same |
| Usable Gates | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 |
| Logic Elements | 1,296 | 1,296 | 1,296 | 1,296 | 1,296 | 1,296 |
| Maximum User I/O | 181 | 181 | 181 | 181 | 181 | 181 |
| Maximum fMAX | 125 MHz (-3 speed grade) | 125 MHz (-3) | higher (-2) | lower (-4) | higher (-2) | 125 MHz (-3) |
| Temperature Grade | Industrial | Commercial | Commercial | Commercial | Commercial | Commercial |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Industrial temperature grade (vs EPF81500ARC240-3)
- Balanced -3 speed grade for typical glue logic (vs EPF81500ARC240-2)
- Largest FLEX 8000 density (vs EPF81188ARI240-4)
Design Notes
The FLEX 8000 family requires a stable 5 V supply on VCCINT and VCCIO with strict tolerance per the datasheet. Place one 0.1 Β΅F ceramic decoupling capacitor adjacent to every VCC pin and one bulk tantalum or electrolytic capacitor (β₯ 22 Β΅F) near the package. Power sequencing is not required between VCCINT and VCCIO. Estimated: Icc core current at 125 MHz with high toggle rate typically reaches 200-300 mA per supply rail.
The 240-pin RQFP package has a 0.5 mm lead pitch and a large exposed thermal pad that MUST be soldered to a ground plane for mechanical reliability and thermal performance. Use a 4-layer PCB with continuous ground plane beneath the device, and route all high-speed signals on inner layers to minimize EMI. Keep configuration traces (DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE) short and away from switching I/O.
Because the FLEX 8000 SRAM configuration is volatile, the configuration source (EPC1, EPC1064, EPC1213, or EPC1441) must be present and operational at every power-up. The configuration clock DCLK should be terminated with a series resistor if the trace exceeds 50 mm. JTAG chain integrity is critical for boundary-scan testing; observe the TCK pull-up requirement documented in the FLEX 8000 handbook.
Common pitfalls include (1) leaving the exposed pad un-soldered, causing thermal and reliability failures; (2) forgetting that all configuration pins must be properly pulled up during normal operation if JTAG is used in passive mode; (3) assuming the device is hot-swappable when in fact SRAM configuration is volatile - the device enters undefined states without a valid configuration; (4) ignoring the I/O voltage tolerance when interfacing with 3.3 V logic.
Compliance Information
EPF81500ARI240-3 was introduced in the mid-1990s before RoHS compliance was standardized. Compliance status for RoHS/REACH/lead-free is not explicitly published in the FLEX 8000 datasheet or current product page; treat as 'unknown' and verify with the distributor or supplier for new designs requiring compliance attestation.
