K3LKJKJ0CM-MUCP - 24Gb LPDDR5 DRAM 6400Mbps | Samsung
料号： K3LKJKJ0CM-MUCP ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
K3LKJKJ0CM-MUCP 概述
LPDDR5 (Low Power Double Data Rate 5) is a JEDEC-defined DRAM interface standard optimized for mobile, automotive and edge-computing platforms. In the memory hierarchy it sits as the main system DRAM: a volatile, high-bandwidth working memory positioned below CPU caches but above storage such as UFS or eMMC. Compared with LPDDR4X, LPDDR5 raises pin speed to 6400 Mbps, adds deep-sleep modes and per-bank refresh for roughly 20% power savings at comparable workloads.
Key features of the K3LKJKJ0CM-MUCP include 24 Gbit density per package, 315-ball fine-pitch BGA surface-mount packaging, 6400 Mbps maximum transfer rate, and the LPDDR5 triple-rail voltage scheme (1.8 V / 1.05 V / 0.9 V) that separates core and I/O domains for dynamic power optimization. Samsung lists related automotive-grade variants in the same K3LKJ family on a 315 FBGA footprint, enabling common-board designs across temperature grades.
Architecturally, LPDDR5 devices use bank-group organization, a link ECC option and WCK/flexible clocking to sustain high bandwidth at low idle power. The 24 Gbit organization (x32-class mobile DRAM interface) makes the part suitable for stacking or pairing to reach 6 GB and 12 GB system memory configurations in SoC platforms from Qualcomm, MediaTek and similar vendors.
Typical applications include automotive ADAS and infotainment memory subsystems, flagship smartphone and tablet main memory, and embedded edge-AI computing modules where bandwidth-to-power ratio is critical.
A key design consideration is power integrity: the separated 0.9 V VDDQ rail demands tight decoupling and careful length-matched fly-by-style routing to the SoC memory controller at 6400 Mbps.
This page synthesizes verified distributor data, same-family drop-in alternatives, and sourcing guidance not found in any single datasheet excerpt.
直接替换替代料： K3LKJKJ0CM-MUCP ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： K3LKJKJ0CM-MUCP （相同外形与封装尺寸） ——差异在于 Interface, Package, Density, Operating Temperature, Mounting Type.
快速对比工具——选择替代料号进行并排对比：
K3LKJKJ0CM-MFCP
✅ 直接替换✓ 有现货
$21.9 / 个
查看数据手册 →K3LKJKJ0CM-MHCP
✅ 直接替换📋 参考替代料（不在目录中）
K3LK8K80CM-MFCP
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
联系询价
查看数据手册 →K3LK4K40CM-BGCP
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$37.8 / 个
查看数据手册 →K3LK2K20CM-JFCP
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
联系询价
查看数据手册 →K3LKJKJ0CM-MUCP 规格参数
| Manufacturer | Samsung Electronics |
| Product Type | LPDDR5 SDRAM |
| Density | 24 Gbit (3 GB) |
| 封装 | 315-ball FBGA |
| Maximum Data Rate | 6400 Mbps |
| VDD2 Supply Voltage | 1.8 V |
| VDD1 Supply Voltage | 1.05 V |
| VDDQ Supply Voltage | 0.9 V |
| 接口 | LPDDR5 (JEDEC standard) |
| Memory Category | DRAM (volatile memory) |
| 安装类型 | Surface Mount |
| Product Status | Active (per Samsung LPDDR5 family listings) |
K3LKJKJ0CM-MUCP 315-ball fbga 引脚配置指南
K3LKJKJ0CM-MUCP（315-ball fbga 封装）的引脚配置。 引脚编号、功能和连接图在制造商数据手册中定义。请参阅该手册以了解确切的封装尺寸和焊接指南。
暂无详细引脚数据： K3LKJKJ0CM-MUCP.
请参阅 数据手册 以查看完整引脚配置。
典型应用
K3LKJKJ0CM-MUCP 适用于 6 应用s: Automotive ADAS and Sensor Fusion, Automotive Infotainment and Cockpit, Smartphone and Tablet Main Memory, Edge-AI and Embedded Computing Modules, Telematics and Connectivity Gateways, Test, Measurement and Prototyping Platforms.
Automotive ADAS and Sensor Fusion
The K3LKJKJ0CM-MUCP provides 3 GB of LPDDR5 working memory for ADAS domain controllers that fuse camera, radar and lidar data. Its 6400 Mbps pin speed and the LPDDR5 family's up to 51.2 GB/s aggregate bandwidth sustain the sustained-read workloads of perception pipelines on Qualcomm Ride or similar automotive SoCs. The 1.8/1.05/0.9 V triple-rail scheme allows the PMIC to scale VDDQ in low-duty scenarios, trimming system power. Samsung lists the related K3LKJKJ0CM-MFCP in its automotive LPDDR5 table, and the shared 315-ball FBGA footprint lets one PCB serve both grade variants - designers should qualify the suffix that matches the program's AEC-Q100 requirement.
推荐
Automotive Infotainment and Cockpit
Digital cockpit and infotainment head units require memory that can feed multiple high-resolution displays and audio streams simultaneously. The K3LKJKJ0CM-MUCP's 24 Gbit (3 GB) density and 6400 Mbps interface give cockpit SoCs the bandwidth for GPU frame buffers and map rendering, while LPDDR5 deep-sleep modes keep standby current low enough for always-on wake-word designs. Because the 315-ball FBGA footprint is common across the Samsung K3LK LPDDR5 family, a single infotainment PCB can be populated with different densities to create trim-level variants. Designers must budget careful VDDQ decoupling, since display bandwidth spikes stress the 0.9 V rail during frame transitions.
推荐
Smartphone and Tablet Main Memory
In flagship and premium-tier smartphones, LPDDR5 is the main system DRAM, and the K3LKJKJ0CM-MUCP supplies 3 GB per package at 6400 Mbps - the speed class Samsung cites as delivering roughly 20% power savings over LPDDR4X for equivalent workloads. The package mounts directly beside or under the application processor (PoP or side-by-side) with the 0.9 V VDDQ rail routed on the shortest possible stubs. Per-bank refresh improves effective bandwidth during mixed app usage, and the 315-ball FBGA is the standard mobile footprint that contract manufacturers already support. Multiple packages can be stacked or paired to reach 6 GB or 9 GB configurations.
推荐
Edge-AI and Embedded Computing Modules
Edge-AI compute modules (SMARC, COM Express compact carriers) pair an LPDDR5 DRAM such as the K3LKJKJ0CM-MUCP with an AI-capable SoC to run vision and speech models locally. The 24 Gbit package provides enough working set for quantized CNN feature maps while the 6400 Mbps interface keeps inference latency bounded by compute, not memory. The triple-rail power architecture (1.8 V / 1.05 V / 0.9 V) lets module designers gate VDD1 and VDDQ independently for aggressive idle power targets in battery-backed gateways. The common 315-ball FBGA footprint across the Samsung LPDDR5 family enables one carrier PCB design to scale from 1.5 GB to 6 GB across product tiers.
推荐
Telematics and Connectivity Gateways
Automotive telematics control units and 5G gateways buffer large packet streams and support secure OTA update staging, which favors the K3LKJKJ0CM-MUCP's 3 GB capacity and high sustained bandwidth. LPDDR5's deep-sleep and per-bank refresh features matter here because telematics units must remain responsive in parked vehicles with strict quiescent budgets; the 0.9 V VDDQ domain can be throttled between communication windows. The 315-ball FBGA package is proven in automotive reflow flows, and Samsung's automotive family listing confirms the platform's automotive pedigree. Use the same footprint with grade variants (MFCP) to unify the BOM across consumer and automotive programs.
推荐
Test, Measurement and Prototyping Platforms
Development boards and validation platforms for new LPDDR5 SoCs frequently use the K3LKJKJ0CM-MUCP because its 24 Gbit density and 6400 Mbps rate represent the mainstream automotive/mobile operating point. Lab teams exercise eye-margin, write-leveling and power-mode transition tests across the 1.8/1.05/0.9 V rails, and the standard 315-ball FBGA footprint allows swapping in other K3LK-family densities to characterize firmware across configurations. Measurement instrumentation benefits from the part's well-defined JEDEC LPDDR5 protocol compliance, making it a reference vehicle for controller bring-up. Stock the MFCP grade alongside the MUCP to validate temperature-dependent timing on one PCB.
推荐
推荐产品汇总
工程参考数据： K3LKJKJ0CM-MUCP ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | K3LKJKJ0CM-MFCP | K3LKJKJ0CM-MHCP | K3LK8K80CM-MFCP | K3LK4K40CM-BGCP | K3LK2K20CM-JFCP |
|---|---|---|---|---|---|---|
| Package | 315-ball FBGA | 315-ball FBGA - same | 315-ball FBGA - same | 315-ball FBGA - same | 315-ball FBGA - same | 315-ball FBGA - same |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Density | 24 Gbit (3 GB) | 24 Gbit (3 GB) | 24 Gbit (3 GB) | 16 Gbit class | 8 Gbit class | 4 Gbit class |
| Supply Rails | 1.8 V / 1.05 V / 0.9 V | 1.8 V / 1.05 V / 0.9 V | 1.8 V / 1.05 V / 0.9 V | 1.8 V / 1.05 V / 0.9 V | 1.8 V / 1.05 V / 0.9 V | 1.8 V / 1.05 V / 0.9 V |
| Temperature/Grade Suffix | MUCP | MFCP (automotive-listed) | MHCP | MFCP | BGCP | JFCP |
| Interface Standard | LPDDR5 | LPDDR5 | LPDDR5 | LPDDR5 | LPDDR5 | LPDDR5 |
| Product Status | Active | Active | Active (distributor stocked) | Active | Active | Active |
关键差异点
- Identical die with grade flexibility （对比 K3LKJKJ0CM-MFCP)
- Higher per-package density than same-footprint siblings （对比 K3LK8K80CM-MFCP)
- LPDDR5 power efficiency over prior generation （对比 LPDDR4X equivalents)
设计说明
The K3LKJKJ0CM-MUCP requires three rails - 1.8 V (VDD2), 1.05 V (VDD1) and 0.9 V (VDDQ). Use a PMIC with dedicated LPDDR5 rail outputs so sequencing and voltage scaling follow the JEDEC LPDDR5 power-state machine. Place bulk capacitance (e.g., 22-47 uF class) per rail near the DRAM plus dense 0.1 uF ceramics at each ball cluster, concentrating the largest count on VDDQ, which carries the fastest switching currents at 6400 Mbps. Estimated: at full-bandwidth bursts, VDDQ transient droop must stay within the LPDDR5 eye diagram budget - verify with the controller's write-leveling and read-training results.
Route the LPDDR5 command/address and data bus with length-matched traces; keep data-line skew within the controller's training window and reference DQ traces to a solid VSS plane beneath the 315-ball FBGA. Avoid routing high-speed signals under the package center where the ball array is densest. For 6400 Mbps operation, fly-by-style CA routing with on-die termination (ODT) settings from the Samsung datasheet simplifies topology versus LPDDR4 designs. Recommended stack-up is at least 4 layers with dedicated power/ground planes; follow your SoC vendor's LPDDR5 layout application note.
Do not treat Samsung suffix codes as interchangeable: MUCP, MFCP and MHCP encode different temperature/qualification grades on the same 24 Gbit die, and automotive programs typically require the MFCP variant listed in Samsung's automotive LPDDR5 table. When sourcing on the open market, demand date-code and COC documentation - LPDDR5 is a frequent target for remarked parts. Finally, confirm your SoC memory controller supports the part's speed bin and organization before BOM release; a footprint-compatible part with an unsupported bin will fail training at 6400 Mbps.
合规信息
Verified distributor data does not include explicit RoHS/REACH/AEC-Q100 statements for the MUCP suffix. The related K3LKJKJ0CM-MFCP appears in Samsung's automotive LPDDR5 list; automotive qualification must be confirmed per suffix from official Samsung documentation.
