K3LKJKJ0CM-MFCP - 24Gb LPDDR5 DRAM 6400Mbps | Samsung
MPN: K3LKJKJ0CM-MFCP ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $26.8 | $268.00 |
| 100 | $24.9 | $2,490.00 |
| 500 | $23.2 | $11,600.00 |
| 1,000 | $21.9 | $21,900.00 |
Drop-in alternatives for K3LKJKJ0CM-MFCP — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →K3LKJKJ0CM-MFCP Maximum Ratings & Electrical Characteristics
| Manufacturer | Samsung Semiconductor, Inc. |
| Product Family | LPDDR5 (Low Power Double Data Rate 5) |
| Density | 24 Gbit (3 GB) |
| Data Rate | 6400 Mbps |
| Package | 315-ball FBGA |
| Supply Voltage VDD2 | 1.8 V |
| Supply Voltage VDD1 | 1.05 V |
| Supply Voltage VDDQ | 0.9 V |
| Memory Type | LPDDR5 SDRAM |
| Mounting Type | Surface Mount (BGA) |
| Operating Mode | Automotive-grade LPDDR5 (per Samsung automotive LPDDR5 listing) |
K3LKJKJ0CM-MFCP 315-ball fbga Pin Configuration Guide
Complete pinout information for K3LKJKJ0CM-MFCP (315-ball fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for K3LKJKJ0CM-MFCP.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K3LKJKJ0CM-MFCP is suitable for 6 applications: Automotive ADAS Domain Controllers, Automotive Infotainment and Cockpit Systems, High-Performance Smartphones and Tablets, 5G Modems and Network Edge Devices, Edge AI Accelerators and Robotics, Industrial Gateways and Telematics.
Automotive ADAS Domain Controllers
The K3LKJKJ0CM-MFCP fits automotive ADAS domain controllers because it combines 24 Gbit density with 6400 Mbps pin speed in Samsung's automotive LPDDR5 family, providing the memory bandwidth that camera, radar, and lidar fusion pipelines demand. At 6400 Mbps, a 64-bit bus delivers about 51.2 GB/s of aggregate bandwidth, sufficient for feeding multiple high-resolution sensor streams into perception accelerators. The triple-rail power design (1.8V/1.05V/0.9V VDDQ) allows the SoC power tree to scale VDDQ dynamically, cutting memory power during low-activity driving phases. The part is used as the main DRAM beside the ADAS SoC, trained at boot via LPDDR5 read/write leveling; designers must confirm the AEC temperature grade in the official datasheet.
Recommended
Automotive Infotainment and Cockpit Systems
Digital cockpit and infotainment SoCs drive multiple displays, navigation, and voice assistants concurrently, and the K3LKJKJ0CM-MFCP supplies the frame-buffer and application memory for these workloads. Its 6400 Mbps LPDDR5 interface provides the headroom for 4K display composition and simultaneous rear-camera input, while the 24 Gbit (3 GB) density accommodates multi-instance HMI software. Samsung lists this part in its automotive LPDDR5 table (January 2026), indicating suitability for the automotive thermal and reliability environment. Compared with LPDDR4X, LPDDR5's roughly 20% power saving reduces cockpit heat dissipation, easing enclosure thermal design in dashboards with limited airflow.
Recommended
High-Performance Smartphones and Tablets
Flagship mobile SoCs pair with LPDDR5 for application memory, and the 6400 Mbps K3LKJKJ0CM-MFCP supports the bandwidth needed for computational photography, on-device AI inference, and multitasking. Samsung's LPDDR5 platform reaches 51.2 GB/s aggregate transfer on 64-bit buses, roughly 50% above LPDDR4X-4266, directly improving frame rates in camera pipelines and large-language-model inference latency. The 0.9V VDDQ rail and LPDDR5's dynamic voltage scaling cut DRAM active power by about 20% versus the previous generation, extending battery life in a form factor (315-ball FBGA) designed for dense stacked or side-by-side POP-style mounting on mobile PCBs.
Recommended
5G Modems and Network Edge Devices
5G baseband processors and edge network appliances require high-throughput DRAM to buffer packet streams and run MAC-layer processing, and the K3LKJKJ0CM-MFCP's 6400 Mbps interface keeps pace with multi-gigabit radio data rates. The 24 Gbit density supports large buffer descriptors and firmware-working sets without external controllers. Samsung LPDDR5's bank-group architecture and DFE-based receiver maintain signal integrity at speed, which matters in edge hardware with constrained layer stackups. Because this LPDDR5 device sits in the automotive-qualified family, it also suits ruggedized roadside units and vehicle-to-infrastructure (V2X) edge nodes exposed to wide temperature ranges.
Recommended
Edge AI Accelerators and Robotics
Edge AI modules for robotics and industrial vision need bandwidth-hungry DRAM close to the NPU, and the K3LKJKJ0CM-MFCP provides 24 Gbit of LPDDR5 at 6400 Mbps, feeding activation tensors and model weights at up to 51.2 GB/s on a wide bus. The automotive-family qualification makes it appropriate for autonomous mobile robots and factory AGVs where reliability requirements approach automotive levels. Its triple supply rails (1.8V/1.05V/0.9V) let designers balance performance and thermal budget in sealed enclosures without fans. Boot-time LPDDR5 training must be supported by the companion SoC's memory controller, so verify controller compatibility during platform selection.
Recommended
Industrial Gateways and Telematics
Industrial IoT gateways and vehicle telematics units log sensor data, run local analytics, and maintain secure communication stacks, all of which benefit from the K3LKJKJ0CM-MFCP's combination of 3 GB capacity and 6400 Mbps bandwidth. Samsung's automotive LPDDR5 listing supports use in extended-temperature telematics hardware, and LPDDR5's power efficiency suits always-on designs that monitor fleets continuously. The 315-ball FBGA package mounts on standard SMD lines, simplifying manufacturing. For designs where cost dominates and bandwidth needs are modest, the same Samsung LPDDR5 family offers smaller-density SKUs on related packages, letting procurement consolidate suppliers while matching memory size to the application.
Recommended
Recommended Products Summary
Engineering reference data for K3LKJKJ0CM-MFCP — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K3LK8L80CM-MGCT | K3LKCKC0BM-MGCP | K3LKBKB0BM-MGCP |
|---|---|---|---|---|
| Package | 315-ball FBGA | FBGA (LPDDR5 family - verify ball count) | FBGA (LPDDR5 family - verify ball count) | FBGA (LPDDR5 family - verify ball count) |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Memory Type | LPDDR5 | LPDDR5 | LPDDR5 | LPDDR5 |
| Density | 24 Gbit (3 GB) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Data Rate | 6400 Mbps | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| VDD2 / VDD1 / VDDQ | 1.8 V / 1.05 V / 0.9 V | 1.8 V / 1.05 V / 0.9 V (LPDDR5 standard) | 1.8 V / 1.05 V / 0.9 V (LPDDR5 standard) | 1.8 V / 1.05 V / 0.9 V (LPDDR5 standard) |
| Automotive Grade | Yes (Samsung automotive LPDDR5 list) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Approx. Price (qty 1) | USD 28.50 (as of 2026-09-04) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Maximum JEDEC LPDDR5 speed bin (vs K3LK8L80CM-MGCT)
- Automotive-family qualification (vs Consumer-grade LPDDR5 parts)
- Triple-rail power architecture (vs LPDDR4X alternatives)
Design Notes
The K3LKJKJ0CM-MFCP requires three supply rails: 1.8V (VDD2), 1.05V (VDD1), and 0.9V (VDDQ). Power each rail with a dedicated buck converter capable of handling LPDDR5 peak currents during simultaneous read/write bursts; sequencing between VDD2 and VDDQ must follow the Samsung datasheet power-up procedure to avoid latch-up. Estimated: a 64-bit LPDDR5-6400 interface at full utilization can draw several hundred milliamps on VDDQ, so budget the 0.9V rail with at least 50% headroom and place bulk capacitance near the regulator output.
At 6400 Mbps, LPDDR5 signal integrity dominates the design. Match trace lengths within the datasheet skew budget for CA, DQ, DQS, and WCK groups, use ODT settings from the controller training algorithm, and reference all high-speed traces to a solid ground plane. The 315-ball FBGA requires via-in-pad or fan-out microvias; keep stub lengths minimal. Follow the Samsung LPDDR5 layout application note for impedance targets (typically 40 ohms for DQ at these rates) and simulate the eye diagram at the corner process points.
The full datasheet for this exact part number is distributed under NDA; do not copy ball maps or timing parameters from other LPDDR5 part numbers or vendors, as they differ between densities and packages. The MFCP suffix defines the specific package and revision. Verify the automotive temperature grade, refresh scheme, and AC timings with the official Samsung document before tape-out, and reserve controller firmware flexibility for different density organization in case of supply substitutions.
Compliance Information
Compliance declarations were not found in the provided public web data for this exact part number. The part appears in Samsung's automotive LPDDR5 listing, suggesting automotive qualification, but formal AEC-Q100 grade must be confirmed from the official datasheet or Samsung documentation. Obtain RoHS/REACH declarations from Samsung or your distributor.
