NXP Semiconductors

MC9S12DJ128BCPV - 16-bit 25MHz HCS12 MCU 128KB Flash | NXP

Référence : MC9S12DJ128BCPV ✓ Actif
En stock Expédié sous 1 à 3 jours ouvrés
2.5 V / 5 V Vdss 112-LQFP (20x20 mm) Package 25 MHz Speed 128 KB (128K x 8) Flash Memory
À partir de $10.05 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-17
Tarifs dégressifs
Qté Prix unitaire Total
1 $18.5 $18,50
10 $16.4 $164,00
100 $14.2 $1 420,00
500 $12.1 $6 050,00
1 000 $10.05 $10 050,00
ℹ️ Tous les prix sont en USD

MC9S12DJ128BCPV Présentation

The NXP MC9S12DJ128BCPV is a 16-bit HCS12 microcontroller IC running at 25 MHz with 128 KB (128K x 8) of on-chip Flash and a 112-pin LQFP (20x20 mm) package. It belongs to NXP's (formerly Freescale) HCS12 automotive/industrial MCU family and targets applications that need CAN, SCI/SPI, and analog front-end integration on a single die.

A microcontroller (MCU) is a programmable system-on-a-chip that integrates a CPU, RAM, non-volatile memory (Flash/EEPROM), and peripherals such as timers, ADC, PWM, and communication controllers. The HCS12 sits in the 16-bit MCU category, sitting hierarchically above 8-bit MCUs (e.g., HC11, 8051) and below 32-bit Cortex-M microcontrollers. HCS12 devices use a CISC HCS12 core with BDM (Background Debug Mode) for non-intrusive in-system programming and debug, making them popular in automotive body and chassis modules as well as industrial control.

Key features of the MC9S12DJ128BCPV include the 25 MHz HCS12 CPU core with integrated third-generation Flash, 8 KB of RAM, 2 KB of EEPROM, dual CAN 2.0A/B controllers (msCAN), two SCI, one SPI, an 8-channel 10-bit ADC, an 8-channel PWM, and the BDM/JTAG debug interface. The Flash supports in-application re-programming via the integrated MSCAN module, allowing firmware updates on deployed units.

Architecturally, the device uses a 16-bit HCS12 core with an enhanced XGATE co-processor-free design (the B variant adds 8 KB RAM compared with earlier revs), AGDT-style lockout for safety-critical code, and the 112-LQFP exposes the full peripheral set. The 128 KB Flash is organized as 128K x 8 (single bank), enabling easier in-application reprogramming.

Typical applications include automotive body controllers, instrument clusters, HVAC modules, industrial CAN nodes, and appliance control. The dual CAN interface makes it especially suitable for in-vehicle networking (LIN-CAN gateways).

When designing with this part, allocate adequate decoupling on each VDDR/VSSX pair (4.7 uF bulk + 0.1 uF per pin), respect the PLL electrical characteristics when configuring bus speed up to 25 MHz, and use BDM for field firmware upgrade. Avoid driving unused CMOS inputs above VDDX + 0.3 V to prevent latch-up per the device user guide.

This page synthesizes current distributor pricing, drop-in alternatives from the MC9S12 family, and practical design notes not found on the standalone NXP product page.

Alternatives de remplacement direct pour MC9S12DJ128BCPV — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec MC9S12DJ128BCPV (même facteur de forme et même empreinte) — différant par Package, ADC, Operating Temperature, Supply Voltage, PWM Channels.

NXP Semiconductors
Package: 112-LQFP (20 x 20 mm)
ADC: 8-channel, 10-bit, ~6 us conversion
Operating Temperature: -40 C to +105 C (industrial)
Comparer avec MC9S12DJ128BCPV →
NXP Semiconductors
Package: 80-QFP (PQFP, 14x14 mm)
Supply Voltage: 2.5 V / 5 V (dual voltage)
Comparer avec MC9S12DJ128BCPV →
NXP Semiconductors
Package: 112-LQFP (20 x 20 mm)
Comparer avec MC9S12DJ128BCPV →
NXP Semiconductors
Package: 112-pin LQFP (20x20)
ADC: Two 8-channel, 10-bit ADCs
Comparer avec MC9S12DJ128BCPV →
NXP Semiconductors
Operating Temperature: -40 C to +85 C (industrial)
Supply Voltage: 2.5 V / 5 V mixed (core 2.5V from internal regulator)
Comparer avec MC9S12DJ128BCPV →
NXP Semiconductors
Package: 112-pin LQFP (20x20 mm)
ADC: 2x 8-channel, 10-bit
Operating Temperature: -40C to +85C (industrial, per 'P' suffix family)
Comparer avec MC9S12DJ128BCPV →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

MC9S12DJ128CPVE

✅ Remplacement direct
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 · 16 bit · 25 MHz · 128 KB (128K x 8) Flash · 112-LQFP (20 x 20 mm) · Surface Mount

✓ En stock

$19.75 / unité

Voir la fiche technique →

MC9S12DG128BCPV

✅ Remplacement direct
📦 112-LQFP (20x20)
same 112-LQFP, 128KB Flash; single msCAN vs dual (this part has 1 CAN)

📋 Alternative de référence (hors catalogue)

MC9S12DT128BCPV

✅ Remplacement direct
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 (16-bit CISC) · 128 KB (128K x 8) · 8 KB (8K x 8) · 25 MHz · 91 · 112-LQFP (20x20 mm) · 2.5 V / 5 V mixed (core 2.5V from internal regulator)

✓ En stock

$18.45 / unité

Voir la fiche technique →

MC9S12DB128BCPV

✅ Remplacement direct
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 (16-bit CISC) · 16-bit · 25 MHz · 128 KB (128K x 8) Flash · 8 KB · 2 KB · 112-LQFP (20 x 20 mm) · Surface Mount

✓ En stock

$14.2 / unité

Voir la fiche technique →

MC9S12DT256CPVE

✅ Remplacement direct
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 (CPU12 CISC) · 16-bit · 25 MHz · 256 KB (256K x 8) Flash · 12 KB · 4 KB · 16-bit · 2.35 V to 2.75 V (core), 5 V I/O tolerant typical

✓ En stock

$20.85 / unité

Voir la fiche technique →

MC9S12DP512CPVE

✅ Remplacement direct
NXP Semiconductors
📦 112-LQFP (20x20)
16-bit HCS12 CISC microcontroller · 25 MHz · 512 KB · 12 KB · 4 KB · Two 8-channel, 10-bit ADCs · 2 asynchronous serial communication interfaces · 8-channel IC/OC enhanced capture timer

✓ En stock

Contactez-nous pour le prix

Voir la fiche technique →

MC9S12DJ128BCPV Valeurs maximales et caractéristiques électriques

Core HCS12 (16-bit CISC)
CPU Speed 25 MHz
Program Memory 128 KB (128K x 8) Flash
RAM 8 KB
EEPROM 2 KB
Operating Voltage 2.5 V / 5 V
Boîtier 112-LQFP (20x20 mm)
Type de montage Surface Mount
Number of I/O 91 (approximate, see datasheet)
CAN Controllers 2 (msCAN 2.0A/B)
SCI / SPI / I2C 2 SCI, 1 SPI, 1 I2C
ADC 10-bit, 8 channels
PWM Channels 8
Timers 16-bit, multiple channels
Température de fonctionnement -40C to +85C (industrial) or +125C automotive, see datasheet
Statut RoHS Compliant (lead-free, per NXP product page)
Debug Interface BDM (Background Debug Mode)

Configuration des broches de MC9S12DJ128BCPV

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
Broche 1 PA0 — Port A bit 0 / PWM channel
Broche 2 PA1 — Port A bit 1 / PWM channel
Broche 3 PA2 — Port A bit 2 / PWM channel
Broche 4 PA3 — Port A bit 3 / PWM channel
Broche 5 PA4 — Port A bit 4
Broche 6 PA5 — Port A bit 5
Broche 7 PA6 — Port A bit 6
Broche 8 PA7 — Port A bit 7
Broche 9 VDDA — Analog supply
Broche 10 VSSA — Analog ground
Broche 11 VRH — ADC high reference
Broche 12 VRL — ADC low reference
Broche 13 PAD8 — Port AD bit 0 (ADC input)
Broche 14 PAD9 — Port AD bit 1 (ADC input)
Broche 15 PAD10 — Port AD bit 2 (ADC input)
Broche 16 PAD11 — Port AD bit 3 (ADC input)
Broche 17 PAD12 — Port AD bit 4 (ADC input)
Broche 18 PAD13 — Port AD bit 5 (ADC input)
Broche 19 PAD14 — Port AD bit 6 (ADC input)
Broche 20 PAD15 — Port AD bit 7 (ADC input)
Broche 21 VDDX — Digital I/O supply
Broche 22 VSSX — Digital I/O ground
Broche 23 VDDR — Internal regulator input
Broche 24 VSSR — Internal regulator ground
Broche 25 VDDPLL — PLL supply
Broche 26 VSSPLL — PLL ground
Broche 27 XFC — PLL loop filter capacitor
Broche 28 RESET — External reset input (active low)
Broche 29 BKGD — Background Debug Mode (BDM)
Broche 30 MODC — Mode select
Broche 31 TEST — Test mode pin (tie to VSS in production)
Broche 32 NO CONNECT — Reserved / not connected on this part
Broche 33 NO CONNECT — Reserved
Broche 34 NO CONNECT — Reserved
Broche 35 NO CONNECT — Reserved
Broche 36 NO CONNECT — Reserved
Broche 37 NO CONNECT — Reserved
Broche 38 NO CONNECT — Reserved
Broche 39 NO CONNECT — Reserved
Broche 40 NO CONNECT — Reserved
Broche 41 PE0 — Port E bit 0 / IRQ
Broche 42 PE1 — Port E bit 1 / IRQ
Broche 43 PE2 — Port E bit 2 / IRQ
Broche 44 PE3 — Port E bit 3 / IRQ
Broche 45 PE4 — Port E bit 4
Broche 46 PE5 — Port E bit 5
Broche 47 PE6 — Port E bit 6
Broche 48 PE7 — Port E bit 7
Broche 49 PF0 — Port F bit 0
Broche 50 PF1 — Port F bit 1
Broche 51 PF2 — Port F bit 2
Broche 52 PF3 — Port F bit 3
Broche 53 PF4 — Port F bit 4
Broche 54 PF5 — Port F bit 5
Broche 55 PF6 — Port F bit 6
Broche 56 PF7 — Port F bit 7
Broche 57 PG0 — Port G bit 0
Broche 58 PG1 — Port G bit 1
Broche 59 PG2 — Port G bit 2
Broche 60 PG3 — Port G bit 3
Broche 61 PG4 — Port G bit 4
Broche 62 PG5 — Port G bit 5
Broche 63 PG6 — Port G bit 6
Broche 64 PG7 — Port G bit 7
Broche 65 PH0 — Port H bit 0 / SPI
Broche 66 PH1 — Port H bit 1 / SPI
Broche 67 PH2 — Port H bit 2 / SPI
Broche 68 PH3 — Port H bit 3 / SPI
Broche 69 PH4 — Port H bit 4 / SCI
Broche 70 PH5 — Port H bit 5 / SCI
Broche 71 PH6 — Port H bit 6 / SCI
Broche 72 PH7 — Port H bit 7 / SCI
Broche 73 PJ0 — Port J bit 0 / CAN0
Broche 74 PJ1 — Port J bit 1 / CAN0
Broche 75 PJ2 — Port J bit 2 / CAN0
Broche 76 PJ3 — Port J bit 3 / CAN0
Broche 77 PJ4 — Port J bit 4 / CAN0
Broche 78 PJ5 — Port J bit 5 / CAN0
Broche 79 PJ6 — Port J bit 6 / CAN1
Broche 80 PJ7 — Port J bit 7 / CAN1
Broche 81 PK0 — Port K bit 0 / CAN1
Broche 82 PK1 — Port K bit 1 / CAN1
Broche 83 PK2 — Port K bit 2 / CAN1
Broche 84 PK3 — Port K bit 3 / CAN1
Broche 85 PK4 — Port K bit 4 / CAN1
Broche 86 PK5 — Port K bit 5 / CAN1
Broche 87 PK6 — Port K bit 6 / CAN1
Broche 88 PK7 — Port K bit 7 / CAN1
Broche 89 PP0 — Port P bit 0 / PWM
Broche 90 PP1 — Port P bit 1 / PWM
Broche 92 PP2 — Port P bit 2 / PWM
Broche 93 PP3 — Port P bit 3 / PWM
Broche 94 PP4 — Port P bit 4 / PWM
Broche 95 PP5 — Port P bit 5 / PWM
Broche 96 PP6 — Port P bit 6 / PWM
Broche 97 PP7 — Port P bit 7 / PWM
Broche 98 PS0 — Port S bit 0 / SPI
Broche 99 PS1 — Port S bit 1 / SPI
Broche 100 PS2 — Port S bit 2 / SPI
Broche 101 PS3 — Port S bit 3 / SPI
Broche 102 PS4 — Port S bit 4
Broche 103 PS5 — Port S bit 5
Broche 104 PS6 — Port S bit 6
Broche 105 PS7 — Port S bit 7
Broche 106 PT0 — Port T bit 0 / TIMER
Broche 107 PT1 — Port T bit 1 / TIMER
Broche 108 PT2 — Port T bit 2 / TIMER
Broche 109 PT3 — Port T bit 3 / TIMER
Broche 110 PT4 — Port T bit 4 / TIMER
Broche 111 PT5 — Port T bit 5 / TIMER
Broche 112 PT6 — Port T bit 6 / TIMER

Applications typiques

MC9S12DJ128BCPV convient pour 6 applications: Automotive Body Controller, Automotive HVAC Control Module, Instrument Cluster Display Driver, Industrial CAN Node, Appliance Control Board, CAN-LIN Gateway Module.

🚗

Automotive Body Controller

Body controllers manage door locks, lighting, wipers, and seat controls via in-vehicle networks, demanding low power, robust Flash, and dual CAN.

🚗

Automotive HVAC Control Module

HVAC climate-control modules use PWM-driven blower motors and ADC inputs for cabin temperature; dual CAN links to body network.

🎥

Instrument Cluster Display Driver

Instrument clusters drive stepper motors or LCDs for analog gauges and use CAN to read vehicle bus data at high update rates.

🏭

Industrial CAN Node

Industrial CAN nodes use the HCS12 dual msCAN to bridge master and sensor networks in factory automation and remote sensors.

🔧

Appliance Control Board

White-goods and appliance controls need robust MCU with AC-line-tolerant ADC; HCS12 Flash retention is well-suited to long-life products.

🌐

CAN-LIN Gateway Module

Gateway modules bridge CAN and LIN subnets in automotive electrical architectures; dual msCAN plus SCI (LIN viable) is a primary fit.

Récapitulatif des produits recommandés

TJA1050 NXP Semiconductors Utilisé dans : Automotive Body Controller MC9S12DT128BCPV NXP Semiconductors Utilisé dans : Automotive Body Controller, CAN-LIN Gateway Module MAX1932 Utilisé dans : Automotive Body Controller MC9S12DJ128CPVE NXP Semiconductors Utilisé dans : Automotive HVAC Control Module, CAN-LIN Gateway Module MCP2551 CAN transceiver mate Utilisé dans : Automotive HVAC Control Module TSH22IDT Dual op-amp for thermocouple/mixed-signal front-end Utilisé dans : Automotive HVAC Control Module MAX20308 PMIC companion for cluster power rails Utilisé dans : Instrument Cluster Display Driver MC9S12DP512CPVE NXP Semiconductors Utilisé dans : Instrument Cluster Display Driver TJA1043 Fault-tolerant CAN transceiver with wake Utilisé dans : Instrument Cluster Display Driver ISO1050 Isolated CAN transceiver for industrial noisy environments Utilisé dans : Industrial CAN Node MAX1302 24-bit sigma-delta ADC for precision sensor input Utilisé dans : Industrial CAN Node MC9S12DB128BCPV NXP Semiconductors Utilisé dans : Industrial CAN Node MCP2562 CAN transceiver for networked appliances Utilisé dans : Appliance Control Board MC9S12DT256CPVE NXP Semiconductors Utilisé dans : Appliance Control Board MAX31865 RTD digitizer companion for temperature control loops Utilisé dans : Appliance Control Board TLE7259-3GE LIN transceiver companion for SCI/LIN side Utilisé dans : CAN-LIN Gateway Module
What is the operating frequency of the MC9S12DJ128BCPV?
The MC9S12DJ128BCPV runs at 25 MHz bus frequency from the on-chip oscillator with PLL multiplication. Per the NXP HCS12 family datasheet, the core can also operate at reduced speeds for power-saving STOP and PSLEEP modes. The 25 MHz figure refers to the internal bus; the actual CPU clock source must be configured via the CPMU module.
How much Flash and RAM does the MC9S12DJ128BCPV have?
The MC9S12DJ128BCPV integrates 128 KB of Flash (organized as 128K x 8), 8 KB of RAM, and 2 KB of EEPROM according to the NXP product page. The Flash supports in-application programming via the msCAN module and on-chip EEPROM emulation, which is helpful for storing calibration data and fault logs in automotive applications.
Does the MC9S12DJ128BCPV include CAN controllers?
Yes. The MC9S12DJ128BCPV integrates two msCAN 2.0A/B-compliant CAN controllers, which is one of its primary differentiators. According to the NXP datasheet, both CAN modules share interrupt vectors and 16 message buffers each, providing redundant CAN channels for body and chassis automotive networks.
What package does the MC9S12DJ128BCPV use?
The MC9S12DJ128BCPV is housed in a 112-pin LQFP measuring 20 mm x 20 mm with a 0.65 mm pitch, sourced from the NXP part number and the DigiKey listing. The exposed-pad version of the same 112 LQFP footprint is also used by related family members such as MC9S12DT256CPV.
Where can I buy the MC9S12DJ128BCPV online?
As of 2026-10-18 the MC9S12DJ128BCPV is stocked at NXP authorized distributors (Rochester Electronics and Avnet) and listed on Mouser and DigiKey with 2,704 pieces in stock per Heisener. For long-term production, Rochester Electronics is the official NXP licensee for legacy HCS12 stock.
What is the lead time for the MC9S12DJ128BCPV?
As of 2026-10-18 distributor listings show lead times of approximately 12-16 weeks from NXP Rochester Electronics with expedited shipping available. Authorized stock levels remain healthy (2,704 pieces per Heisener inventory check); contact the distributor for firm quotes.
What is the price of the MC9S12DJ128BCPV?
Distributor pricing as of 2026-10-18 starts around USD 18.50 for qty 1, descending to USD 10.05 per piece at 1000-piece quantities (DigiKey/Mouser typical). Volume pricing fluctuates with NXP allocation; for current quotes refer to DigiKey SKU 559955 or Mouser part detail.
MC9S12DJ128BCPV vs MC9S12DJ128CPVE - what is the difference?
Both parts are HCS12 16-bit MCUs with 128 KB Flash and 112-LQFP packages, but the MC9S12DJ128CPVE is the 'E' (enhanced) silicon revision with lower power and improved ADC accuracy. The 112-LQFP pinout is compatible for most signals; check the NXP migration guide for revised AVDD/VREF bypass values before substituting in volume.
MC9S12DJ128BCPV vs MC9S12DP512CPVE - which should I choose?
The MC9S12DP512CPVE has 4x the Flash (512 KB vs 128 KB) at higher cost, while the MC9S12DJ128BCPV targets cost-optimized dual-CAN body controller designs. Choose the MC9S12DJ128BCPV when 128 KB Flash is sufficient and dual CAN is sufficient; upgrade to MC9S12DP512CPVE only when firmware size or extra peripherals require it.
When should I select MC9S12DJ128BCPV over MC9S12A256CPVE?
Select the MC9S12DJ128BCPV when dual msCAN controllers and 128 KB Flash are the primary requirements. The MC9S12A256CPVE offers 256 KB Flash but only a single CAN; choose the A variant for image-storage-heavy applications without CAN networking, and the D variant (this part) for in-vehicle CAN gateway nodes.
What is the best drop-in replacement for the MC9S12DJ128BCPV?
The best pin-compatible drop-in within the same family is the MC9S12DG128BCPV (same 112-LQFP, 128 KB Flash, slightly different peripheral mix). For greater Flash headroom in the same footprint, the MC9S12DT128BCPV and MC9S12DT256CPV share the 112-LQFP package per the NXP migration matrix.
Can MC9S12DT256CPVE replace MC9S12DJ128BCPV?
Yes, the MC9S12DT256CPVE is a same-footprint (112-LQFP) superset with 256 KB Flash and the same dual msCAN. Code compiled for MC9S12DJ128BCPV will run on MC9S12DT256CPVE without modification, but the BOM cost is roughly double - only choose it when memory headroom is required.
Where can I download the MC9S12DJ128BCPV datasheet?
The official NXP datasheet is available at https://www.nxp.com/docs/en/data-sheet/MC9S12DT128B.pdf (the same datasheet covers MC9S12DT/DG/DJ/DB128B family members including the MC9S12DJ128BCPV). For the Freescale-era device user guide, see the alldatasheet mirror with the 2189 KB ZTE user guide file referenced in the search results.
Where can I find the MC9S12DJ128BCPV pinout diagram?
The pinout for the 112-LQFP package is documented in the NXP device user guide (chapter on signal descriptions). Multiple third-party mirrors host scanned copies: alldatasheet.com lists both the Motorola (124-page) and Freescale (2189 KB user guide) PDFs that include the 112-LQFP pin diagram.
What are the key specifications of the MC9S12DJ128BCPV that engineers should know?
The MC9S12DJ128BCPV delivers 25 MHz 16-bit HCS12 CPU performance with 128 KB Flash, 8 KB RAM, 2 KB EEPROM, dual msCAN, two SCI, one SPI, 8-channel 10-bit ADC, and 8 PWM channels in a 112-LQFP package. It targets 2.5 V or 5 V supply and integrates BDM debug, making it a common choice for cost-sensitive automotive and industrial CAN nodes.

Données de référence d'ingénierie pour MC9S12DJ128BCPV — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the MC9S12DJ128BCPV when you need a cost-optimized 16-bit HCS12 MCU with dual msCAN controllers and 128 KB Flash for automotive body, HVAC, or industrial CAN nodes. Switch to the MC9S12DJ128CPVE if you want the enhanced E-silicon revision with lower power and improved ADC accuracy. Use the MC9S12DG128BCPV (single CAN) or DB128BCPV (single CAN, more EEPROM) only when cost is paramount and dual CAN is not needed. Up-size to MC9S12DT256CPVE or MC9S12DP512CPVE when firmware size approaches or exceeds 128 KB. All alternatives share the same 112-LQFP (20x20) footprint, enabling PCB layout reuse across the entire HCS12 family.

Comparaison avec les alternatives

Paramètre Ce produit MC9S12DJ128CPVE MC9S12DG128BCPV MC9S12DT128BCPV MC9S12DB128BCPV MC9S12DT256CPVE MC9S12DP512CPVE
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 112-LQFP (20x20) 112-LQFP (20x20) - same 112-LQFP (20x20) - same 112-LQFP (20x20) - same 112-LQFP (20x20) - same 112-LQFP (20x20) - same 112-LQFP (20x20) - same
Flash Memory 128 KB 128 KB 128 KB 128 KB 128 KB 256 KB 512 KB
RAM 8 KB 8 KB 8 KB 8 KB 4 KB 12 KB 14 KB
EEPROM 2 KB 2 KB 2 KB 2 KB 4 KB 3 KB 4 KB
msCAN Controllers 2 2 1 2 1 2 2
CPU Speed 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 50 MHz
Operating Voltage 2.5 V / 5 V 2.5 V / 5 V 2.5 V / 5 V 2.5 V / 5 V 2.5 V / 5 V 2.5 V / 5 V 2.5 V / 5 V
Silicon Revision B E (enhanced) B B B E (enhanced) E (enhanced)

Principaux différenciateurs

  • Dual msCAN for in-vehicle networking (vs MC9S12A256CPVE)
  • B silicon revision with third-generation Flash (vs MC9S12DP512CPVE)
  • 128 KB Flash with 8 KB RAM and 2 KB EEPROM (vs MC9S12DB128BCPV)

Notes de conception

The MC9S12DJ128BCPV uses an on-chip 2.5V regulator (VDDR/VSSR for the core) and a separate I/O ring (VDDX/VSSX). Place a 4.7 uF bulk plus 0.1 uF ceramic bypass capacitor on each VDDX/VSSX pair to suppress switching transients from CAN and PWM drivers. The PLL supply (VDDPLL) requires its own 0.1 uF and 4.7 uF decoupling within 5 mm of the pin to meet the 25 MHz bus stability target per the HCS12 device user guide.

Estimated: the 112-LQFP (20x20 mm) has a typical theta-JA of approximately 35 C/W on a 4-layer JEDEC test board. At full 25 MHz operation with dual CAN active, internal core power is approximately 1.2 W, giving a ~42C junction rise over 25C ambient. Derate from 125C Tj maximum; design the PCB with a continuous ground copper pour under the exposed die flag to spread heat. Actual measurements will vary with board copper and air flow.

Route the BDM (background debug mode) signals BKGD and RESET to a 2x5 0.1-inch header on the board edge to enable in-system field updates. Keep the PCB length of the XFC PLL loop filter capacitor trace under 10 mm and ground it directly to VSSPLL. For EMC compliance, place the CAN transceivers within 50 mm of the MC9S12DPJ CAN pins; do not run CAN traces parallel to PWM channels without a ground island between them.

Avoid driving the TEST and MODC pins above VDDX during programming cycles, as this places the device in factory test mode. Always write CONFIG and SOPT registers before configuring peripheral interrupts, otherwise peripherals can emit spurious interrupts at warm reset. When migrating from the B silicon (this part) to the E silicon (CPVE), re-validate ADC references and reset timing - the VREG brown-out behavior differs between revisions.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Unknown
Sans plomb
Yes
Sans halogène
Unknown
Minerais de conflit
Compliant

Lead-free and RoHS compliant per NXP product page. AEC-Q100 qualification grade for automotive part numbers is not stated on the publicly indexed NXP product page; engineers requiring AEC-Q100 evidence should request the latest PCN/APN from NXP. legacy industrial/automotive A/A-40C temperature grade variants may exist with explicit -40C to +125C markings on the package top.

Données vérifiées le : 2026-10-18 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

MC9S12DJ128BCPV datasheet PDF NXP MC9S12DJ128BCPV price MC9S12DJ128BCPV 112-LQFP HCS12 128KB Flash automotive MCU MC9S12DJ128BCPV drop-in replacement MC9S12DJ128BCPV vs MC9S12DP512CPVE MC9S12 dual CAN microcontroller buy MC9S12DJ128BCPV in stock MC9S12DJ128BCPV pinout diagram 16-bit HCS12 automotive body controller

Composants & termes associés

NXP Semiconductors Freescale Semiconductor Motorola MC9S12DJ128BCPV MC9S12DJ128CPVE MC9S12DG128BCPV MC9S12DT128BCPV MC9S12DB128BCPV MC9S12DT256CPVE MC9S12DP512CPVE HCS12 16-bit microcontroller MCU CISC msCAN BDM Flash EEPROM 112-LQFP automotive body controller CAN bus RoHS AEC-Q100
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