MC9S12DJ128BCPV - 16-bit 25MHz HCS12 MCU 128KB Flash | NXP
Référence : MC9S12DJ128BCPV ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.4 | $164,00 |
| 100 | $14.2 | $1 420,00 |
| 500 | $12.1 | $6 050,00 |
| 1 000 | $10.05 | $10 050,00 |
MC9S12DJ128BCPV Présentation
A microcontroller (MCU) is a programmable system-on-a-chip that integrates a CPU, RAM, non-volatile memory (Flash/EEPROM), and peripherals such as timers, ADC, PWM, and communication controllers. The HCS12 sits in the 16-bit MCU category, sitting hierarchically above 8-bit MCUs (e.g., HC11, 8051) and below 32-bit Cortex-M microcontrollers. HCS12 devices use a CISC HCS12 core with BDM (Background Debug Mode) for non-intrusive in-system programming and debug, making them popular in automotive body and chassis modules as well as industrial control.
Key features of the MC9S12DJ128BCPV include the 25 MHz HCS12 CPU core with integrated third-generation Flash, 8 KB of RAM, 2 KB of EEPROM, dual CAN 2.0A/B controllers (msCAN), two SCI, one SPI, an 8-channel 10-bit ADC, an 8-channel PWM, and the BDM/JTAG debug interface. The Flash supports in-application re-programming via the integrated MSCAN module, allowing firmware updates on deployed units.
Architecturally, the device uses a 16-bit HCS12 core with an enhanced XGATE co-processor-free design (the B variant adds 8 KB RAM compared with earlier revs), AGDT-style lockout for safety-critical code, and the 112-LQFP exposes the full peripheral set. The 128 KB Flash is organized as 128K x 8 (single bank), enabling easier in-application reprogramming.
Typical applications include automotive body controllers, instrument clusters, HVAC modules, industrial CAN nodes, and appliance control. The dual CAN interface makes it especially suitable for in-vehicle networking (LIN-CAN gateways).
When designing with this part, allocate adequate decoupling on each VDDR/VSSX pair (4.7 uF bulk + 0.1 uF per pin), respect the PLL electrical characteristics when configuring bus speed up to 25 MHz, and use BDM for field firmware upgrade. Avoid driving unused CMOS inputs above VDDX + 0.3 V to prevent latch-up per the device user guide.
This page synthesizes current distributor pricing, drop-in alternatives from the MC9S12 family, and practical design notes not found on the standalone NXP product page.
Alternatives de remplacement direct pour MC9S12DJ128BCPV — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12DJ128BCPV (même facteur de forme et même empreinte) — différant par Package, ADC, Operating Temperature, Supply Voltage, PWM Channels.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12DJ128CPVE
✅ Remplacement direct✓ En stock
$19.75 / unité
Voir la fiche technique →MC9S12DG128BCPV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12DT128BCPV
✅ Remplacement direct✓ En stock
$18.45 / unité
Voir la fiche technique →MC9S12DB128BCPV
✅ Remplacement direct✓ En stock
$14.2 / unité
Voir la fiche technique →MC9S12DT256CPVE
✅ Remplacement direct✓ En stock
$20.85 / unité
Voir la fiche technique →MC9S12DP512CPVE
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MC9S12DJ128BCPV Valeurs maximales et caractéristiques électriques
| Core | HCS12 (16-bit CISC) |
| CPU Speed | 25 MHz |
| Program Memory | 128 KB (128K x 8) Flash |
| RAM | 8 KB |
| EEPROM | 2 KB |
| Operating Voltage | 2.5 V / 5 V |
| Boîtier | 112-LQFP (20x20 mm) |
| Type de montage | Surface Mount |
| Number of I/O | 91 (approximate, see datasheet) |
| CAN Controllers | 2 (msCAN 2.0A/B) |
| SCI / SPI / I2C | 2 SCI, 1 SPI, 1 I2C |
| ADC | 10-bit, 8 channels |
| PWM Channels | 8 |
| Timers | 16-bit, multiple channels |
| Température de fonctionnement | -40C to +85C (industrial) or +125C automotive, see datasheet |
| Statut RoHS | Compliant (lead-free, per NXP product page) |
| Debug Interface | BDM (Background Debug Mode) |
Configuration des broches de MC9S12DJ128BCPV
| Broche 1 | PA0 — Port A bit 0 / PWM channel |
| Broche 2 | PA1 — Port A bit 1 / PWM channel |
| Broche 3 | PA2 — Port A bit 2 / PWM channel |
| Broche 4 | PA3 — Port A bit 3 / PWM channel |
| Broche 5 | PA4 — Port A bit 4 |
| Broche 6 | PA5 — Port A bit 5 |
| Broche 7 | PA6 — Port A bit 6 |
| Broche 8 | PA7 — Port A bit 7 |
| Broche 9 | VDDA — Analog supply |
| Broche 10 | VSSA — Analog ground |
| Broche 11 | VRH — ADC high reference |
| Broche 12 | VRL — ADC low reference |
| Broche 13 | PAD8 — Port AD bit 0 (ADC input) |
| Broche 14 | PAD9 — Port AD bit 1 (ADC input) |
| Broche 15 | PAD10 — Port AD bit 2 (ADC input) |
| Broche 16 | PAD11 — Port AD bit 3 (ADC input) |
| Broche 17 | PAD12 — Port AD bit 4 (ADC input) |
| Broche 18 | PAD13 — Port AD bit 5 (ADC input) |
| Broche 19 | PAD14 — Port AD bit 6 (ADC input) |
| Broche 20 | PAD15 — Port AD bit 7 (ADC input) |
| Broche 21 | VDDX — Digital I/O supply |
| Broche 22 | VSSX — Digital I/O ground |
| Broche 23 | VDDR — Internal regulator input |
| Broche 24 | VSSR — Internal regulator ground |
| Broche 25 | VDDPLL — PLL supply |
| Broche 26 | VSSPLL — PLL ground |
| Broche 27 | XFC — PLL loop filter capacitor |
| Broche 28 | RESET — External reset input (active low) |
| Broche 29 | BKGD — Background Debug Mode (BDM) |
| Broche 30 | MODC — Mode select |
| Broche 31 | TEST — Test mode pin (tie to VSS in production) |
| Broche 32 | NO CONNECT — Reserved / not connected on this part |
| Broche 33 | NO CONNECT — Reserved |
| Broche 34 | NO CONNECT — Reserved |
| Broche 35 | NO CONNECT — Reserved |
| Broche 36 | NO CONNECT — Reserved |
| Broche 37 | NO CONNECT — Reserved |
| Broche 38 | NO CONNECT — Reserved |
| Broche 39 | NO CONNECT — Reserved |
| Broche 40 | NO CONNECT — Reserved |
| Broche 41 | PE0 — Port E bit 0 / IRQ |
| Broche 42 | PE1 — Port E bit 1 / IRQ |
| Broche 43 | PE2 — Port E bit 2 / IRQ |
| Broche 44 | PE3 — Port E bit 3 / IRQ |
| Broche 45 | PE4 — Port E bit 4 |
| Broche 46 | PE5 — Port E bit 5 |
| Broche 47 | PE6 — Port E bit 6 |
| Broche 48 | PE7 — Port E bit 7 |
| Broche 49 | PF0 — Port F bit 0 |
| Broche 50 | PF1 — Port F bit 1 |
| Broche 51 | PF2 — Port F bit 2 |
| Broche 52 | PF3 — Port F bit 3 |
| Broche 53 | PF4 — Port F bit 4 |
| Broche 54 | PF5 — Port F bit 5 |
| Broche 55 | PF6 — Port F bit 6 |
| Broche 56 | PF7 — Port F bit 7 |
| Broche 57 | PG0 — Port G bit 0 |
| Broche 58 | PG1 — Port G bit 1 |
| Broche 59 | PG2 — Port G bit 2 |
| Broche 60 | PG3 — Port G bit 3 |
| Broche 61 | PG4 — Port G bit 4 |
| Broche 62 | PG5 — Port G bit 5 |
| Broche 63 | PG6 — Port G bit 6 |
| Broche 64 | PG7 — Port G bit 7 |
| Broche 65 | PH0 — Port H bit 0 / SPI |
| Broche 66 | PH1 — Port H bit 1 / SPI |
| Broche 67 | PH2 — Port H bit 2 / SPI |
| Broche 68 | PH3 — Port H bit 3 / SPI |
| Broche 69 | PH4 — Port H bit 4 / SCI |
| Broche 70 | PH5 — Port H bit 5 / SCI |
| Broche 71 | PH6 — Port H bit 6 / SCI |
| Broche 72 | PH7 — Port H bit 7 / SCI |
| Broche 73 | PJ0 — Port J bit 0 / CAN0 |
| Broche 74 | PJ1 — Port J bit 1 / CAN0 |
| Broche 75 | PJ2 — Port J bit 2 / CAN0 |
| Broche 76 | PJ3 — Port J bit 3 / CAN0 |
| Broche 77 | PJ4 — Port J bit 4 / CAN0 |
| Broche 78 | PJ5 — Port J bit 5 / CAN0 |
| Broche 79 | PJ6 — Port J bit 6 / CAN1 |
| Broche 80 | PJ7 — Port J bit 7 / CAN1 |
| Broche 81 | PK0 — Port K bit 0 / CAN1 |
| Broche 82 | PK1 — Port K bit 1 / CAN1 |
| Broche 83 | PK2 — Port K bit 2 / CAN1 |
| Broche 84 | PK3 — Port K bit 3 / CAN1 |
| Broche 85 | PK4 — Port K bit 4 / CAN1 |
| Broche 86 | PK5 — Port K bit 5 / CAN1 |
| Broche 87 | PK6 — Port K bit 6 / CAN1 |
| Broche 88 | PK7 — Port K bit 7 / CAN1 |
| Broche 89 | PP0 — Port P bit 0 / PWM |
| Broche 90 | PP1 — Port P bit 1 / PWM |
| Broche 92 | PP2 — Port P bit 2 / PWM |
| Broche 93 | PP3 — Port P bit 3 / PWM |
| Broche 94 | PP4 — Port P bit 4 / PWM |
| Broche 95 | PP5 — Port P bit 5 / PWM |
| Broche 96 | PP6 — Port P bit 6 / PWM |
| Broche 97 | PP7 — Port P bit 7 / PWM |
| Broche 98 | PS0 — Port S bit 0 / SPI |
| Broche 99 | PS1 — Port S bit 1 / SPI |
| Broche 100 | PS2 — Port S bit 2 / SPI |
| Broche 101 | PS3 — Port S bit 3 / SPI |
| Broche 102 | PS4 — Port S bit 4 |
| Broche 103 | PS5 — Port S bit 5 |
| Broche 104 | PS6 — Port S bit 6 |
| Broche 105 | PS7 — Port S bit 7 |
| Broche 106 | PT0 — Port T bit 0 / TIMER |
| Broche 107 | PT1 — Port T bit 1 / TIMER |
| Broche 108 | PT2 — Port T bit 2 / TIMER |
| Broche 109 | PT3 — Port T bit 3 / TIMER |
| Broche 110 | PT4 — Port T bit 4 / TIMER |
| Broche 111 | PT5 — Port T bit 5 / TIMER |
| Broche 112 | PT6 — Port T bit 6 / TIMER |
Applications typiques
MC9S12DJ128BCPV convient pour 6 applications: Automotive Body Controller, Automotive HVAC Control Module, Instrument Cluster Display Driver, Industrial CAN Node, Appliance Control Board, CAN-LIN Gateway Module.
Automotive Body Controller
Body controllers manage door locks, lighting, wipers, and seat controls via in-vehicle networks, demanding low power, robust Flash, and dual CAN.
Recommandé
Automotive HVAC Control Module
HVAC climate-control modules use PWM-driven blower motors and ADC inputs for cabin temperature; dual CAN links to body network.
Recommandé
Instrument Cluster Display Driver
Instrument clusters drive stepper motors or LCDs for analog gauges and use CAN to read vehicle bus data at high update rates.
Recommandé
Industrial CAN Node
Industrial CAN nodes use the HCS12 dual msCAN to bridge master and sensor networks in factory automation and remote sensors.
Recommandé
Appliance Control Board
White-goods and appliance controls need robust MCU with AC-line-tolerant ADC; HCS12 Flash retention is well-suited to long-life products.
Recommandé
CAN-LIN Gateway Module
Gateway modules bridge CAN and LIN subnets in automotive electrical architectures; dual msCAN plus SCI (LIN viable) is a primary fit.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12DJ128BCPV — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12DJ128CPVE | MC9S12DG128BCPV | MC9S12DT128BCPV | MC9S12DB128BCPV | MC9S12DT256CPVE | MC9S12DP512CPVE |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20) | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same |
| Flash Memory | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 256 KB | 512 KB |
| RAM | 8 KB | 8 KB | 8 KB | 8 KB | 4 KB | 12 KB | 14 KB |
| EEPROM | 2 KB | 2 KB | 2 KB | 2 KB | 4 KB | 3 KB | 4 KB |
| msCAN Controllers | 2 | 2 | 1 | 2 | 1 | 2 | 2 |
| CPU Speed | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 50 MHz |
| Operating Voltage | 2.5 V / 5 V | 2.5 V / 5 V | 2.5 V / 5 V | 2.5 V / 5 V | 2.5 V / 5 V | 2.5 V / 5 V | 2.5 V / 5 V |
| Silicon Revision | B | E (enhanced) | B | B | B | E (enhanced) | E (enhanced) |
Principaux différenciateurs
- Dual msCAN for in-vehicle networking (vs MC9S12A256CPVE)
- B silicon revision with third-generation Flash (vs MC9S12DP512CPVE)
- 128 KB Flash with 8 KB RAM and 2 KB EEPROM (vs MC9S12DB128BCPV)
Notes de conception
The MC9S12DJ128BCPV uses an on-chip 2.5V regulator (VDDR/VSSR for the core) and a separate I/O ring (VDDX/VSSX). Place a 4.7 uF bulk plus 0.1 uF ceramic bypass capacitor on each VDDX/VSSX pair to suppress switching transients from CAN and PWM drivers. The PLL supply (VDDPLL) requires its own 0.1 uF and 4.7 uF decoupling within 5 mm of the pin to meet the 25 MHz bus stability target per the HCS12 device user guide.
Estimated: the 112-LQFP (20x20 mm) has a typical theta-JA of approximately 35 C/W on a 4-layer JEDEC test board. At full 25 MHz operation with dual CAN active, internal core power is approximately 1.2 W, giving a ~42C junction rise over 25C ambient. Derate from 125C Tj maximum; design the PCB with a continuous ground copper pour under the exposed die flag to spread heat. Actual measurements will vary with board copper and air flow.
Route the BDM (background debug mode) signals BKGD and RESET to a 2x5 0.1-inch header on the board edge to enable in-system field updates. Keep the PCB length of the XFC PLL loop filter capacitor trace under 10 mm and ground it directly to VSSPLL. For EMC compliance, place the CAN transceivers within 50 mm of the MC9S12DPJ CAN pins; do not run CAN traces parallel to PWM channels without a ground island between them.
Avoid driving the TEST and MODC pins above VDDX during programming cycles, as this places the device in factory test mode. Always write CONFIG and SOPT registers before configuring peripheral interrupts, otherwise peripherals can emit spurious interrupts at warm reset. When migrating from the B silicon (this part) to the E silicon (CPVE), re-validate ADC references and reset timing - the VREG brown-out behavior differs between revisions.
Informations de conformité
Lead-free and RoHS compliant per NXP product page. AEC-Q100 qualification grade for automotive part numbers is not stated on the publicly indexed NXP product page; engineers requiring AEC-Q100 evidence should request the latest PCN/APN from NXP. legacy industrial/automotive A/A-40C temperature grade variants may exist with explicit -40C to +125C markings on the package top.