EP20K600CEF672C7 vs EP20K600CF672 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP20K600CEF672C7 بواسطة Intel و EP20K600CF672 بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
Intel
EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel
EP20K600CF672 [data_needed: lifecycle status]مقارنة المواصفات
| المعامل | EP20K600CEF672C7 | EP20K600CF672 |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | Obsolete | [DATA NEEDED: Lifecycle Status] |
| Manufacturer | Intel (formerly Altera) | Altera / Intel |
| Series | APEX 20KC | — |
| Family | APEX 20KC (Enhanced Configuration) | — |
| Device Type | FPGA / Loadable PLD | — |
| Logic Elements / Cells | 24,320 | — |
| Gate Count (typical) | 600,000 gates | — |
| Maximum Operating Frequency | 375.94 MHz | — |
| Propagation Delay | 1.48 ns (typ) | 1.48 ns for supplied EP20K600CF672C9N/C8N references |
| User I/Os | 488 | — |
| Core Supply Voltage | 1.8 V | — |
| Process Technology | 0.15 µm CMOS, all-layer copper | 0.15 um all-layer copper-metal process for supplied family references |
| العلبة | 672-ball FineLine BGA (FC-FBGA) | — |
| Package Code | BGA-652, 45 x 45 mm, 1.27 mm pitch | — |
| درجة حرارة التشغيل | 0 °C to +85 °C (commercial) | 0 C to 85 C for supplied EP20K600CF672C9N/C8N references |
| Configuration | SRAM-based, serial or parallel (EPC) | — |
| Embedded Memory | EAB blocks (dual-port RAM with byte enables) | [DATA_NEEDED: embedded memory capacity] |
| LVDS Support | True-LVDS channels integrated | — |
| MultiVolt I/O | 1.8 V, 2.5 V, 3.3 V interfaces | — |
| External Memory Interface | DDR SDRAM, QDR SRAM | — |
| JTAG Support | IEEE 1149.1 boundary-scan | — |
| حالة RoHS | [DATA_NEEDED: RoHS status] | unknown |
| Product Type | — | Field-Programmable Gate Array (FPGA) |
| Product Family | — | APEX-20KC |
| User I/O Lines | — | 508 I/O |
| Logic Elements | — | [DATA_NEEDED: logic element count] |
| Device Type Listed by Supplied References | — | SPLD |
| Performance Claim | — | Up to 35% faster than APEX 20KE devices |
| Package Type | — | 672-ball BGA, FCBGA |
| Package Dimensions | — | 45 mm x 45 mm |
| Ball Pitch | — | 1.27 mm |
| نوع التركيب | — | Surface Mount |
| Configuration Device Type | — | Enhanced Configuration (EPC) device |
| Core Voltage | — | [DATA_NEEDED: core supply voltage] |
| I/O Voltage | — | [DATA_NEEDED: I/O supply voltage] |
| Configuration Memory | — | [DATA_NEEDED: configuration memory type and capacity] |
| REACH Status | — | unknown |
| AEC-Q100 Status | — | unknown |