EP20K600CEF672C7 vs EP20K600CF672 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP20K600CEF672C7 sa pamamagitan ng Intel at EP20K600CF672 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP20K600CF672 EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel

EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel

EP20K600CF672 [data_needed: lifecycle status]

Pagsanggunian na paghahambing

Parametro EP20K600CEF672C7 EP20K600CF672
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete [DATA NEEDED: Lifecycle Status]
Manufacturer Intel (formerly Altera) Altera / Intel
Series APEX 20KC —
Family APEX 20KC (Enhanced Configuration) —
Device Type FPGA / Loadable PLD —
Logic Elements / Cells 24,320 —
Gate Count (typical) 600,000 gates —
Maximum Operating Frequency 375.94 MHz —
Propagation Delay 1.48 ns (typ) 1.48 ns for supplied EP20K600CF672C9N/C8N references
User I/Os 488 —
Core Supply Voltage 1.8 V —
Process Technology 0.15 µm CMOS, all-layer copper 0.15 um all-layer copper-metal process for supplied family references
Packhaging 672-ball FineLine BGA (FC-FBGA) —
Package Code BGA-652, 45 x 45 mm, 1.27 mm pitch —
Temperature na Operasyon 0 °C to +85 °C (commercial) 0 C to 85 C for supplied EP20K600CF672C9N/C8N references
Configuration SRAM-based, serial or parallel (EPC) —
Embedded Memory EAB blocks (dual-port RAM with byte enables) [DATA_NEEDED: embedded memory capacity]
LVDS Support True-LVDS channels integrated —
MultiVolt I/O 1.8 V, 2.5 V, 3.3 V interfaces —
External Memory Interface DDR SDRAM, QDR SRAM —
JTAG Support IEEE 1149.1 boundary-scan —
Tindminan RoHS [DATA_NEEDED: RoHS status] unknown
Product Type — Field-Programmable Gate Array (FPGA)
Product Family — APEX-20KC
User I/O Lines — 508 I/O
Logic Elements — [DATA_NEEDED: logic element count]
Device Type Listed by Supplied References — SPLD
Performance Claim — Up to 35% faster than APEX 20KE devices
Package Type — 672-ball BGA, FCBGA
Package Dimensions — 45 mm x 45 mm
Ball Pitch — 1.27 mm
Uri ng Pagpapasok — Surface Mount
Configuration Device Type — Enhanced Configuration (EPC) device
Core Voltage — [DATA_NEEDED: core supply voltage]
I/O Voltage — [DATA_NEEDED: I/O supply voltage]
Configuration Memory — [DATA_NEEDED: configuration memory type and capacity]
REACH Status — unknown
AEC-Q100 Status — unknown

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