EP20K600CEF672C7 vs EP20K600CF672 موازنہ
تفصیلی ساتھ ساتھ موازنہ از EP20K600CEF672C7 بذریعہ Intel اور EP20K600CF672 بذریعہ Intel. اہم خصوصیات، برقی پیرامیٹرز، پیکیجنگ، لائف سائیکل اسٹیٹس، قیمتوں اور دستیابی کا موازنہ کریں تاکہ آپ کی ڈیزائن ضروریات کے لیے بہترین کمپوننٹ کا تعین ہو سکے۔
Intel
EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel
EP20K600CF672 [data_needed: lifecycle status]خصوصیات کا موازنہ
| پیرامیٹر | EP20K600CEF672C7 | EP20K600CF672 |
|---|---|---|
| برانڈ | Intel | Intel |
| زمرہ | FPGA & CPLD | FPGA & CPLD |
| لائف سائیکل کی حالت | Obsolete | [DATA NEEDED: Lifecycle Status] |
| Manufacturer | Intel (formerly Altera) | Altera / Intel |
| Series | APEX 20KC | — |
| Family | APEX 20KC (Enhanced Configuration) | — |
| Device Type | FPGA / Loadable PLD | — |
| Logic Elements / Cells | 24,320 | — |
| Gate Count (typical) | 600,000 gates | — |
| Maximum Operating Frequency | 375.94 MHz | — |
| Propagation Delay | 1.48 ns (typ) | 1.48 ns for supplied EP20K600CF672C9N/C8N references |
| User I/Os | 488 | — |
| Core Supply Voltage | 1.8 V | — |
| Process Technology | 0.15 µm CMOS, all-layer copper | 0.15 um all-layer copper-metal process for supplied family references |
| پیکیج | 672-ball FineLine BGA (FC-FBGA) | — |
| Package Code | BGA-652, 45 x 45 mm, 1.27 mm pitch | — |
| آپریٹنگ درجہ حرارت | 0 °C to +85 °C (commercial) | 0 C to 85 C for supplied EP20K600CF672C9N/C8N references |
| Configuration | SRAM-based, serial or parallel (EPC) | — |
| Embedded Memory | EAB blocks (dual-port RAM with byte enables) | [DATA_NEEDED: embedded memory capacity] |
| LVDS Support | True-LVDS channels integrated | — |
| MultiVolt I/O | 1.8 V, 2.5 V, 3.3 V interfaces | — |
| External Memory Interface | DDR SDRAM, QDR SRAM | — |
| JTAG Support | IEEE 1149.1 boundary-scan | — |
| RoHS اسٹیٹس | [DATA_NEEDED: RoHS status] | unknown |
| Product Type | — | Field-Programmable Gate Array (FPGA) |
| Product Family | — | APEX-20KC |
| User I/O Lines | — | 508 I/O |
| Logic Elements | — | [DATA_NEEDED: logic element count] |
| Device Type Listed by Supplied References | — | SPLD |
| Performance Claim | — | Up to 35% faster than APEX 20KE devices |
| Package Type | — | 672-ball BGA, FCBGA |
| Package Dimensions | — | 45 mm x 45 mm |
| Ball Pitch | — | 1.27 mm |
| ماؤنٹنگ ٹائپ | — | Surface Mount |
| Configuration Device Type | — | Enhanced Configuration (EPC) device |
| Core Voltage | — | [DATA_NEEDED: core supply voltage] |
| I/O Voltage | — | [DATA_NEEDED: I/O supply voltage] |
| Configuration Memory | — | [DATA_NEEDED: configuration memory type and capacity] |
| REACH Status | — | unknown |
| AEC-Q100 Status | — | unknown |