EP20K600CEF672C7 vs EP20K600CF672 Perbandingan
Perbandingan bersamaan detil EP20K600CEF672C7 dari Intel dan EP20K600CF672 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel
EP20K600CF672 [data_needed: lifecycle status]Perbandingan Spesifikasi
| Parameter Umum | EP20K600CEF672C7 | EP20K600CF672 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | [DATA NEEDED: Lifecycle Status] |
| Manufacturer | Intel (formerly Altera) | Altera / Intel |
| Series | APEX 20KC | — |
| Family | APEX 20KC (Enhanced Configuration) | — |
| Device Type | FPGA / Loadable PLD | — |
| Logic Elements / Cells | 24,320 | — |
| Gate Count (typical) | 600,000 gates | — |
| Maximum Operating Frequency | 375.94 MHz | — |
| Propagation Delay | 1.48 ns (typ) | 1.48 ns for supplied EP20K600CF672C9N/C8N references |
| User I/Os | 488 | — |
| Core Supply Voltage | 1.8 V | — |
| Process Technology | 0.15 µm CMOS, all-layer copper | 0.15 um all-layer copper-metal process for supplied family references |
| Paket | 672-ball FineLine BGA (FC-FBGA) | — |
| Package Code | BGA-652, 45 x 45 mm, 1.27 mm pitch | — |
| Suhu Kerja | 0 °C to +85 °C (commercial) | 0 C to 85 C for supplied EP20K600CF672C9N/C8N references |
| Configuration | SRAM-based, serial or parallel (EPC) | — |
| Embedded Memory | EAB blocks (dual-port RAM with byte enables) | [DATA_NEEDED: embedded memory capacity] |
| LVDS Support | True-LVDS channels integrated | — |
| MultiVolt I/O | 1.8 V, 2.5 V, 3.3 V interfaces | — |
| External Memory Interface | DDR SDRAM, QDR SRAM | — |
| JTAG Support | IEEE 1149.1 boundary-scan | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | unknown |
| Product Type | — | Field-Programmable Gate Array (FPGA) |
| Product Family | — | APEX-20KC |
| User I/O Lines | — | 508 I/O |
| Logic Elements | — | [DATA_NEEDED: logic element count] |
| Device Type Listed by Supplied References | — | SPLD |
| Performance Claim | — | Up to 35% faster than APEX 20KE devices |
| Package Type | — | 672-ball BGA, FCBGA |
| Package Dimensions | — | 45 mm x 45 mm |
| Ball Pitch | — | 1.27 mm |
| Tipe Mounting | — | Surface Mount |
| Configuration Device Type | — | Enhanced Configuration (EPC) device |
| Core Voltage | — | [DATA_NEEDED: core supply voltage] |
| I/O Voltage | — | [DATA_NEEDED: I/O supply voltage] |
| Configuration Memory | — | [DATA_NEEDED: configuration memory type and capacity] |
| REACH Status | — | unknown |
| AEC-Q100 Status | — | unknown |