EP3C5F256C8 vs EP3C5F256C6 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP3C5F256C8 بواسطة Intel و EP3C5F256C6 بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP3C5F256C8 | EP3C5F256C6 |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Series | Cyclone III | — |
| Logic Elements | 5,136 | — |
| Total Memory Bits | 423,936 | 423,936 bits |
| Number of LABs/CLBs | 321 | — |
| Number of Logic Elements/Cells | 5,136 | — |
| Maximum User I/O | 182 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| درجة حرارة التشغيل | -40°C to +125°C | — |
| Package Type | 256-LBGA (FineLine BGA) | — |
| Package Code | FBGA-256 | — |
| نوع التركيب | Surface Mount | Surface Mount |
| جهد التغذية | [DATA_NEEDED: VCCINT/VCCA/VCCIO supply voltage values] | — |
| Configuration Memory | External flash via AS/PS/JTAG/FPP | — |
| Process Technology | 65 nm low-power CMOS | 65 nm CMOS, low-k |
| Embedded Multipliers | Yes (18x18 hard multipliers) | — |
| PLLs | Yes (general-purpose PLLs) | 4 |
| حالة RoHS | Lead Free, MS-034 | Compliant (lead-free per FBGA package) |
| مستوى MSL | [DATA_NEEDED: MSL rating] | — |
| Family | — | Cyclone III |
| Logic Elements (LE) | — | 5,136 |
| Logic Array Blocks (LABs) | — | 5136 / 342 (per ADatasheet summary) |
| Embedded Memory | — | M9K blocks (per Cyclone III family) |
| Embedded 18x18 Multipliers | — | 23 |
| User I/Os | — | 182 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.15 V to 1.25 V (typical 1.2 V) |
| Maximum Operating Frequency | — | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] |
| العلبة | — | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch |
| Operating Temperature (Commercial) | — | 0C to +85C (per device suffix C6) |
| Configuration Modes | — | AS, PS, JTAG |