EP3C5F256C8 vs EP3C5F256C6 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C5F256C8 sa pamamagitan ng Intel at EP3C5F256C6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C5F256C8 | EP3C5F256C6 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Series | Cyclone III | — |
| Logic Elements | 5,136 | — |
| Total Memory Bits | 423,936 | 423,936 bits |
| Number of LABs/CLBs | 321 | — |
| Number of Logic Elements/Cells | 5,136 | — |
| Maximum User I/O | 182 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Temperature na Operasyon | -40°C to +125°C | — |
| Package Type | 256-LBGA (FineLine BGA) | — |
| Package Code | FBGA-256 | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Volte ng Pagbibigay | [DATA_NEEDED: VCCINT/VCCA/VCCIO supply voltage values] | — |
| Configuration Memory | External flash via AS/PS/JTAG/FPP | — |
| Process Technology | 65 nm low-power CMOS | 65 nm CMOS, low-k |
| Embedded Multipliers | Yes (18x18 hard multipliers) | — |
| PLLs | Yes (general-purpose PLLs) | 4 |
| Tindminan RoHS | Lead Free, MS-034 | Compliant (lead-free per FBGA package) |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Family | — | Cyclone III |
| Logic Elements (LE) | — | 5,136 |
| Logic Array Blocks (LABs) | — | 5136 / 342 (per ADatasheet summary) |
| Embedded Memory | — | M9K blocks (per Cyclone III family) |
| Embedded 18x18 Multipliers | — | 23 |
| User I/Os | — | 182 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.15 V to 1.25 V (typical 1.2 V) |
| Maximum Operating Frequency | — | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] |
| Packhaging | — | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch |
| Operating Temperature (Commercial) | — | 0C to +85C (per device suffix C6) |
| Configuration Modes | — | AS, PS, JTAG |