EP3C5F256C8 vs EP3C5F256C6 比較

詳細並排比較 EP3C5F256C8 由 Intel 與 EP3C5F256C6 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3C5F256C8 EP3C5F256C6
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Device Type FPGA - Field Programmable Gate Array —
Series Cyclone III —
Logic Elements 5,136 —
Total Memory Bits 423,936 423,936 bits
Number of LABs/CLBs 321 —
Number of Logic Elements/Cells 5,136 —
Maximum User I/O 182 —
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
工作溫度 -40°C to +125°C —
Package Type 256-LBGA (FineLine BGA) —
Package Code FBGA-256 —
安裝類型 Surface Mount Surface Mount
供應電壓 [DATA_NEEDED: VCCINT/VCCA/VCCIO supply voltage values] —
Configuration Memory External flash via AS/PS/JTAG/FPP —
Process Technology 65 nm low-power CMOS 65 nm CMOS, low-k
Embedded Multipliers Yes (18x18 hard multipliers) —
PLLs Yes (general-purpose PLLs) 4
RoHS 狀態 Lead Free, MS-034 Compliant (lead-free per FBGA package)
MSL 等級 [DATA_NEEDED: MSL rating] —
Family — Cyclone III
Logic Elements (LE) — 5,136
Logic Array Blocks (LABs) — 5136 / 342 (per ADatasheet summary)
Embedded Memory — M9K blocks (per Cyclone III family)
Embedded 18x18 Multipliers — 23
User I/Os — 182
Global Clock Networks — 20
Core Voltage — 1.15 V to 1.25 V (typical 1.2 V)
Maximum Operating Frequency — [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed]
封裝 — 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch
Operating Temperature (Commercial) — 0C to +85C (per device suffix C6)
Configuration Modes — AS, PS, JTAG

資料表與資源

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