EP3C5F256C8 vs EP3C5F256C6 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C5F256C8 disebabkan oleh Intel dan EP3C5F256C6 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3C5F256C8 EP3C5F256C6
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Device Type FPGA - Field Programmable Gate Array —
Series Cyclone III —
Logic Elements 5,136 —
Total Memory Bits 423,936 423,936 bits
Number of LABs/CLBs 321 —
Number of Logic Elements/Cells 5,136 —
Maximum User I/O 182 —
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
Suhu Operasi -40°C to +125°C —
Package Type 256-LBGA (FineLine BGA) —
Package Code FBGA-256 —
Jenis Pemasangan Surface Mount Surface Mount
Tegangan Pemberi Arus [DATA_NEEDED: VCCINT/VCCA/VCCIO supply voltage values] —
Configuration Memory External flash via AS/PS/JTAG/FPP —
Process Technology 65 nm low-power CMOS 65 nm CMOS, low-k
Embedded Multipliers Yes (18x18 hard multipliers) —
PLLs Yes (general-purpose PLLs) 4
Status RoHS Lead Free, MS-034 Compliant (lead-free per FBGA package)
Aras MSL [DATA_NEEDED: MSL rating] —
Family — Cyclone III
Logic Elements (LE) — 5,136
Logic Array Blocks (LABs) — 5136 / 342 (per ADatasheet summary)
Embedded Memory — M9K blocks (per Cyclone III family)
Embedded 18x18 Multipliers — 23
User I/Os — 182
Global Clock Networks — 20
Core Voltage — 1.15 V to 1.25 V (typical 1.2 V)
Maximum Operating Frequency — [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed]
Kemasan — 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch
Operating Temperature (Commercial) — 0C to +85C (per device suffix C6)
Configuration Modes — AS, PS, JTAG

Laporan Datasheet & Sumber

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