EP3SE50F780C4N vs EP3SE50F780C2 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP3SE50F780C4N بواسطة Intel و EP3SE50F780C2 بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP3SE50F780C4N | EP3SE50F780C2 |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | NRND | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LE) | 47,500 | 47,500 |
| Embedded Memory Bits | 5,760,000 | — |
| Embedded Memory (M9K/M144K blocks) | 488 (per family datasheet) | — |
| Number of LABs | 1900 | — |
| Maximum User I/Os | 488 | — |
| DSP Blocks (18x18 multipliers) | 432 | 384 |
| PLLs | 12 (per family datasheet) | — |
| Maximum Operating Frequency | 717 MHz | — |
| Transceiver Channels | Up to 12 (per family, model-dependent) | — |
| Transceiver Data Rate | Up to 6.375 Gbps (per Stratix III E family) | — |
| Process Node | 40 nm | — |
| العلبة | 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch | 780-BBGA, FC-FBGA |
| نوع التركيب | Surface Mount (BGA) | Surface Mount |
| جهد التغذية | Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail) | — |
| درجة حرارة التشغيل | 0C to +85C (C4 commercial grade) | — |
| Configuration Modes | JTAG, Passive Serial, Fast Passive Parallel | — |
| حالة RoHS | Lead-free / RoHS compliant | [DATA_NEEDED: current RoHS status] |
| مستوى MSL | 3 (per JEDEC J-STD-020, FBGA package) | — |
| Hard Memory Controller | DDR2/DDR3 SDRAM (per Stratix III E family) | — |
| Manufacturer | — | Intel (formerly Altera) |
| LABs / CLBs | — | 1,900 |
| Total Memory Bits | — | 5,760,000 |
| User I/O Count | — | 488 |
| Core Voltage | — | 1.1 V |
| Process Technology | — | 65 nm |
| Operating Frequency | — | Up to 600 MHz |
| Number of Pins / Terminals | — | 780 |
| Form of Terminal | — | Ball |
| Package Code | — | BGA |
| Operating Temperature Grade | — | Commercial (C2) |