EP3SE50F780C4N vs EP3SE50F780C2 Perbandingan
Perbandingan bersamaan detil EP3SE50F780C4N dari Intel dan EP3SE50F780C2 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE50F780C4N | EP3SE50F780C2 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LE) | 47,500 | 47,500 |
| Embedded Memory Bits | 5,760,000 | — |
| Embedded Memory (M9K/M144K blocks) | 488 (per family datasheet) | — |
| Number of LABs | 1900 | — |
| Maximum User I/Os | 488 | — |
| DSP Blocks (18x18 multipliers) | 432 | 384 |
| PLLs | 12 (per family datasheet) | — |
| Maximum Operating Frequency | 717 MHz | — |
| Transceiver Channels | Up to 12 (per family, model-dependent) | — |
| Transceiver Data Rate | Up to 6.375 Gbps (per Stratix III E family) | — |
| Process Node | 40 nm | — |
| Paket | 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch | 780-BBGA, FC-FBGA |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Tegangan Pemuat | Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail) | — |
| Suhu Kerja | 0C to +85C (C4 commercial grade) | — |
| Configuration Modes | JTAG, Passive Serial, Fast Passive Parallel | — |
| Status RoHS | Lead-free / RoHS compliant | [DATA_NEEDED: current RoHS status] |
| Level MSL | 3 (per JEDEC J-STD-020, FBGA package) | — |
| Hard Memory Controller | DDR2/DDR3 SDRAM (per Stratix III E family) | — |
| Manufacturer | — | Intel (formerly Altera) |
| LABs / CLBs | — | 1,900 |
| Total Memory Bits | — | 5,760,000 |
| User I/O Count | — | 488 |
| Core Voltage | — | 1.1 V |
| Process Technology | — | 65 nm |
| Operating Frequency | — | Up to 600 MHz |
| Number of Pins / Terminals | — | 780 |
| Form of Terminal | — | Ball |
| Package Code | — | BGA |
| Operating Temperature Grade | — | Commercial (C2) |