MC9S08QG4CFQE vs MC9S08QG4CFKE مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MC9S08QG4CFQE بواسطة NXP Semiconductors و MC9S08QG4CFKE بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
NXP Semiconductors
MC9S08QG4CFQE - 20MHz 8-Bit MCU | NXP | Embedded Control
MC9S08QG4CFQE ✗ انتهى عمره الإنتاجي
مقارنة المواصفات
| المعامل | MC9S08QG4CFQE | MC9S08QG4CFKE |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | Microcontrollers | Microcontrollers |
| حالة دورة الحياة | نهاية العمر الإنتاجي | نشط |
| Product Type | 8-bit HCS08 microcontroller | — |
| CPU Clock Speed | 20 MHz | — |
| Architecture | HCS08, HC08 instruction set with added BGND instruction | — |
| Flash Memory | 4 KB (4K x 8) | — |
| Supply Voltage Range | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| I/O Ports | 6 ports | 6 (per distributor listing) |
| العلبة | 8-DFN-EP (4 mm x 4 mm) | 24-QFN-EP (4x4 mm) |
| Package Type | DFN with exposed pad | — |
| Core | 8-bit HCS08 central processing unit | — |
| Debug Support | Background debugging system | — |
| Breakpoint Support | Single breakpoint during in-circuit debugging plus two on-chip breakpoints | — |
| Shipping Package | Tray | — |
| حالة RoHS | RoHS compliant | Compliant |
| Temperature Grade | [DATA_NEEDED: operating temperature range] | — |
| RAM | [DATA_NEEDED: RAM size] | [DATA_NEEDED: RAM size in bytes] |
| EEPROM | [DATA_NEEDED: EEPROM size] | — |
| Maximum GPIO | [DATA_NEEDED: maximum GPIO count] | — |
| Core Architecture | — | HCS08 (S08) |
| Core Size | — | 8-bit |
| Maximum CPU Clock | — | 20 MHz |
| Program Memory | — | 4 KB Flash (4K x 8) |
| درجة حرارة التشغيل | — | -40 C to +85 C |
| ADC | — | 10-bit (per LCSC listing) |
| نوع التركيب | — | Surface Mount |
| Debug Interface | — | Background Debug Mode (BDM), single breakpoint |
| Instruction Set | — | HC08 with BGND instruction |
| مستوى MSL | — | [DATA_NEEDED: MSL level] |