MC9S08QG4CFQE vs MC9S08QG4CFKE Perbandingan
Perbandingan bersamaan detil MC9S08QG4CFQE dari NXP Semiconductors dan MC9S08QG4CFKE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC9S08QG4CFQE - 20MHz 8-Bit MCU | NXP | Embedded Control
MC9S08QG4CFQE ✗ Akhir Hidup
Perbandingan Spesifikasi
| Parameter Umum | MC9S08QG4CFQE | MC9S08QG4CFKE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | Aktif |
| Product Type | 8-bit HCS08 microcontroller | — |
| CPU Clock Speed | 20 MHz | — |
| Architecture | HCS08, HC08 instruction set with added BGND instruction | — |
| Flash Memory | 4 KB (4K x 8) | — |
| Supply Voltage Range | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| I/O Ports | 6 ports | 6 (per distributor listing) |
| Paket | 8-DFN-EP (4 mm x 4 mm) | 24-QFN-EP (4x4 mm) |
| Package Type | DFN with exposed pad | — |
| Core | 8-bit HCS08 central processing unit | — |
| Debug Support | Background debugging system | — |
| Breakpoint Support | Single breakpoint during in-circuit debugging plus two on-chip breakpoints | — |
| Shipping Package | Tray | — |
| Status RoHS | RoHS compliant | Compliant |
| Temperature Grade | [DATA_NEEDED: operating temperature range] | — |
| RAM | [DATA_NEEDED: RAM size] | [DATA_NEEDED: RAM size in bytes] |
| EEPROM | [DATA_NEEDED: EEPROM size] | — |
| Maximum GPIO | [DATA_NEEDED: maximum GPIO count] | — |
| Core Architecture | — | HCS08 (S08) |
| Core Size | — | 8-bit |
| Maximum CPU Clock | — | 20 MHz |
| Program Memory | — | 4 KB Flash (4K x 8) |
| Suhu Kerja | — | -40 C to +85 C |
| ADC | — | 10-bit (per LCSC listing) |
| Tipe Mounting | — | Surface Mount |
| Debug Interface | — | Background Debug Mode (BDM), single breakpoint |
| Instruction Set | — | HC08 with BGND instruction |
| Level MSL | — | [DATA_NEEDED: MSL level] |