MC9S08QG4CFQE vs MC9S08QG4CFKE 比較

詳細並排比較 MC9S08QG4CFQE 由 NXP Semiconductors 與 MC9S08QG4CFKE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MC9S08QG4CFQE MC9S08QG4CFQE - 20MHz 8-Bit MCU | NXP | Embedded Control

MC9S08QG4CFQE - 20MHz 8-Bit MCU | NXP | Embedded Control

MC9S08QG4CFQE ✗ 停產
NXP Semiconductors
MC9S08QG4CFKE MC9S08QG4CFKE - 8-bit MCU, 4KB Flash, 20MHz, 24-QFN | NXP

MC9S08QG4CFKE - 8-bit MCU, 4KB Flash, 20MHz, 24-QFN | NXP

MC9S08QG4CFKE ✓ 啟用中

規格比較

參數 MC9S08QG4CFQE MC9S08QG4CFKE
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 停產終止 啟用中
Product Type 8-bit HCS08 microcontroller —
CPU Clock Speed 20 MHz —
Architecture HCS08, HC08 instruction set with added BGND instruction —
Flash Memory 4 KB (4K x 8) —
Supply Voltage Range 1.8 V to 3.6 V 1.8 V to 3.6 V
I/O Ports 6 ports 6 (per distributor listing)
封裝 8-DFN-EP (4 mm x 4 mm) 24-QFN-EP (4x4 mm)
Package Type DFN with exposed pad —
Core 8-bit HCS08 central processing unit —
Debug Support Background debugging system —
Breakpoint Support Single breakpoint during in-circuit debugging plus two on-chip breakpoints —
Shipping Package Tray —
RoHS 狀態 RoHS compliant Compliant
Temperature Grade [DATA_NEEDED: operating temperature range] —
RAM [DATA_NEEDED: RAM size] [DATA_NEEDED: RAM size in bytes]
EEPROM [DATA_NEEDED: EEPROM size] —
Maximum GPIO [DATA_NEEDED: maximum GPIO count] —
Core Architecture — HCS08 (S08)
Core Size — 8-bit
Maximum CPU Clock — 20 MHz
Program Memory — 4 KB Flash (4K x 8)
工作溫度 — -40 C to +85 C
ADC — 10-bit (per LCSC listing)
安裝類型 — Surface Mount
Debug Interface — Background Debug Mode (BDM), single breakpoint
Instruction Set — HC08 with BGND instruction
MSL 等級 — [DATA_NEEDED: MSL level]

資料表與資源

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