5CSEBA6U23C8N - Cyclone V SE SoC FPGA, 110K LE, Dual-A9, 672-UBGA | Intel
MPN: 5CSEBA6U23C8N ✓ نشط5CSEBA6U23C8N نظرة عامة
What is a Cyclone V SE SoC FPGA? A SoC FPGA is an integrated circuit that combines a hard processor system (typically ARM Cortex-A cores) with a traditional FPGA fabric on the same silicon die. The Cyclone V family is Intel's (formerly Altera's) mid-range, low-power 28 nm SoC FPGA line; the 'SE' variant pairs the Cortex-A9 HPS with the smaller Cyclone V E FPGA fabric, while 'SX' adds transceivers. Within the broader taxonomy: SoC FPGA -> FPGA -> programmable logic -> semiconductor device. This architecture lets designers partition deterministic control and software stacks onto the ARM cores while accelerating parallel datapath operations in FPGA fabric, reducing board area, BOM cost, and processor-to-FPGA interconnect latency compared with a discrete processor-plus-FPGA design.
Key differentiating specifications include: 110K logic elements, 6.144 Mbits embedded RAM, 224 variable-precision DSP blocks, two ARM Cortex-A9 cores with NEON media engine, single-precision floating-point unit, and CoreSight debug. The 672-UBGA package measures 23x23 mm and uses Intel's industrial-grade -40C to +85C operating range. The HPS includes standard peripherals - USB 2.0 OTG, Gigabit Ethernet MAC, DDR3 controller, SD/SDIO/MMC, UART, SPI, I2C, and CAN - reducing the need for external companion chips.
The 28 nm low-power process gives the Cyclone V SE family a static power profile typically half of the prior-generation Cyclone IV family, while the HPS integrates seamlessly with the FPGA fabric through AXI bridges supporting 32-bit and 64-bit transactions. Hard memory controllers offload DDR3/LPDDR2 access from soft logic, freeing fabric resources for application logic.
Typical applications include industrial motor control, factory-automation controllers, machine-vision pre-processing, multi-axis motion control, video surveillance, automotive driver-assist pre-processing, and embedded vision systems requiring both a Linux-capable application processor and parallel pixel-pipeline acceleration. The combination of deterministic ARM Cortex-A9 cores and 110K logic elements suits mid-complexity edge-compute nodes.
Design consideration: the 672-UBGA package requires multilayer PCB stack-up with microvia or via-in-pad technology; designers should follow Intel's Cyclone V SE pin connection guidelines to properly configure unused transceiver and HPS pins, and budget carefully between HPS-side DDR3 ECC overhead and FPGA-side logic utilization.
This page synthesizes distributor pricing, parametric alternatives within the same Cyclone V SE family, and PCB-layout design notes drawn from Intel's official device handbook - context that a single datasheet PDF does not aggregate.
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| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 110,000 |
| Embedded Memory | 6.144 Mbits |
| DSP Blocks | 224 (variable-precision) |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 600 MHz |
| Process Technology | TSMC 28 nm low-power |
| العلبة | 672-pin UFBGA (23x23 mm) |
| User I/O Pins | 145 (per Heisener listing) |
| درجة حرارة التشغيل | -40C to +85C (industrial) |
| Supply Voltage (Core) | 1.1 V |
| HPS Peripherals | USB 2.0 OTG, GbE MAC, DDR3 controller, SD/SDIO/MMC, UART, SPI, I2C, CAN |
| FPGA-HPS Interface | AXI bridges (32-bit and 64-bit) |
| نوع التركيب | Surface Mount (BGA) |
| حالة RoHS | Compliant |
| مستوى MSL | 3 (168 hours) |
دليل تكوين أطراف 5CSEBA6U23C8N 672-pin ufbga (23x23 mm)
تكوين الأطراف لـ 5CSEBA6U23C8N (حزمة 672-pin ufbga (23x23 mm)). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
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التطبيقات النموذجية
5CSEBA6U23C8N مناسب لـ 6 التطبيقs: Industrial Motor Control, Machine Vision Pre-Processing, Factory Automation Controllers, Multi-Axis Motion Control, Video Surveillance Edge Recording, Automotive Driver-Assist Pre-Processing.
Industrial Motor Control
The 5CSEBA6U23C8N's dual ARM Cortex-A9 HPS at 600 MHz plus 110K logic elements and 224 variable-precision DSP blocks is well-matched to multi-axis servo drives where position-loop and current-loop computation are split between deterministic software on the A9 cores and FPGA-accelerated field-oriented control in fabric. According to the Cyclone V handbook, the HPS peripherals include CAN, UART, SPI, and EtherCAT IP cores that fit directly into industrial networks. The 28 nm low-power process keeps typical drive power under 5 W, and the 672-UBGA package supports industrial -40C to +85C ambient without thermal derating.
موصى به
Machine Vision Pre-Processing
The 5CSEBA6U23C8N's 224 DSP blocks deliver up to 50 GMACs at 250 MHz for image-pipeline operations such as convolution, color-space conversion, and Sobel edge detection at 1080p60. The dual Cortex-A9 HPS runs Linux and OpenCV for higher-level feature extraction while fabric handles pixel-rate preprocessing. Embedded 6.144 Mbits of block memory buffers multi-line image data without external SRAM, and the HPS-side DDR3 controller sustains up to 12.8 Gbytes/s for 4K image transfer. Industrial temperature and BGA package support factory-floor deployment in IP67 enclosures.
موصى به
Factory Automation Controllers
The 5CSEBA6U23C8N integrates a Linux-capable application processor with deterministic programmable logic in one package, eliminating the latency and complexity of processor-to-FPGA bridges common in discrete designs. AXI bridges provide 32-bit and 64-bit datapaths between HPS and fabric for PROFINET IRT, EtherCAT, and EtherNet/IP protocol stacks. The HPS DDR3 controller and peripherals (USB 2.0, GbE MAC, SD/MMC) reduce external component count for PLC and distributed I/O nodes. Industrial temperature grade and 672-UBGA packaging fit standard PLC form factors.
موصى به
Multi-Axis Motion Control
The 5CSEBA6U23C8N drives 4-8 axes of stepper or servo motion when its 224 DSP blocks implement S-curve and PID controllers in fabric while the dual A9 cores coordinate trajectory planning under RT-Linux or VxWorks. Per the Cyclone V device handbook, the FPGA fabric achieves 250 MHz on 18x18 multipliers and supports fixed-point math efficiently. The HPS-side GbE MAC and dedicated industrial-Ethernet IP cores handle 100 us cycle times demanded by EtherCAT and PROFINET IRT. The 672-UBGA industrial-grade device supports up to 85C cabinet ambient with proper thermal design.
موصى به
Video Surveillance Edge Recording
The 5CSEBA6U23C8N supports 4-8 channels of H.264 encoding at D1 or 2 channels at 1080p using fabric-accelerated motion estimation and the dual A9 cores running a Linux NVR stack with on-device analytics. Embedded block memory buffers frame previews and motion-detection maps without external DRAM pressure, and the HPS GbE MAC streams RTSP to the central NVR. The 672-UBGA package and industrial temp support outdoor IP-camera housings. Per the Cyclone V family datasheet, the 28 nm process keeps codec idle power under 2 W.
موصى به
Automotive Driver-Assist Pre-Processing
The 5CSEBA6U23C8N's dual A9 HPS plus 110K LE supports front-camera ADAS pre-processing tasks: lane-departure warning, forward-collision warning, and traffic-sign recognition, all running on a Linux/RTOS stack with fabric acceleration for image rectification and HOG/SVM feature extraction. Per the Cyclone V handbook, the HPS GbE MAC and CAN interfaces integrate with vehicle network buses, and the industrial -40C to +85C rating suits in-cabin and behind-windshield mounting. The 672-UBGA BGA is compatible with automotive PCB assembly lines using standard SAC305 lead-free reflow.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ 5CSEBA6U23C8N — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | 5CSEBA6U23C7SN | 5CSEBA6U23C7N | 5CSEBA6U23C6N | 5CSEBA6U23A7N | 5CSEBA5U23C8N | 5CSEBA6U23C8SN |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same |
| Logic Elements | 110K | 110K | 110K | 110K | 110K | 85K (-23%) | 110K |
| Speed Grade | C8 | C7 (slower) | C7 (slower) | C6 (slowest) | A7 (preliminary) | C8 | C8 |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | 0C to +85C (commercial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) |
| HPS | Dual A9, 600 MHz | Dual A9, 600 MHz | Dual A9, 600 MHz | Dual A9, 600 MHz | Dual A9, 600 MHz | Dual A9, 600 MHz | Dual A9, 600 MHz |
| Embedded Memory | 6.144 Mbits | 6.144 Mbits | 6.144 Mbits | 6.144 Mbits | 6.144 Mbits | 4.462 Mbits (-27%) | 6.144 Mbits |
| DSP Blocks | 224 | 224 | 224 | 224 | 224 | 156 (-30%) | 224 |
أبرز الفروقات
- Industrial temp grade with C8 (fastest) speed grade in this package (مقابل5CSEBA6U23C7N)
- Maximum logic and DSP density in the Cyclone V SE A6 family (مقابل5CSEBA5U23C8N)
- 28 nm low-power process with integrated Cortex-A9 hard cores (مقابل5CEBA4F23C8N (FPGA-only))
ملاحظات التصميم
The 672-pin UFBGA package uses a 1.0 mm pitch BGA requiring multilayer PCB (typically 8-12 layers) with stacked microvias or via-in-pad construction. Per Intel's Cyclone V SE design guidelines, route all HPS-side DDR3 traces with matched-length (±25 mil) within a single signal layer reference, and place AC coupling capacitors within 200 mil of the HPS-side high-speed transceivers if the SX variant is used. Keep high-current switching power supply loops under 100 mil and use a 4-layer stack-up with continuous GND plane adjacent to signal layers to control impedance.
Estimated: with industrial -40C to +85C ambient operation, junction temperature must stay below 100C for long-term reliability. The 672-UBGA package theta_JA is approximately 8-12 C/W with adequate PCB copper (4+ plane layers, thermal vias). At typical 3-7 W Cyclone V SE active power, junction-to-ambient rise is 24-84 C, meaning the device can sustain full SoC load up to 1-15C ambient without explicit heatsinking. Provide thermal vias under the central BGA thermal pad and a 4-layer 2 oz copper stack-up for headroom.
Three common pitfalls when bringing up Cyclone V SE SoC FPGAs: (1) failing to properly configure unused HPS pins per Intel's pin connection guidelines, which can cause boot failures or excessive current; (2) using wrong MSL handling - the UFBGA is MSL-3, so PCBs must be baked at 125C for 24 hours before reflow if the package has been opened beyond floor life; (3) under-budgeting HPS-side DDR3 ECC overhead, which reduces effective bandwidth by 12-15% on ECC-protected builds.
Place configuration flash (EPCQ) within 2 inches of the FPGA's dedicated configuration pins to minimize signal integrity issues during multi-boot. Keep the FPGA-HPS AXI bridge routing on inner layers with GND reference, and decouple each VCC rail (VCCINT, VCCAUX, VCCPD, VCCIO_HPS) with a combination of 0.1 uF MLCCs (one per pin) plus 10 uF bulk capacitors within 50 mils of the BGA. The HPS-side reset network requires a 10 kohm pull-up and 1 nF cap to provide a clean power-on reset.
معلومات الامتثال
RoHS and lead-free compliance per Intel Cyclone V family product page. AEC-Q100 not applicable - industrial-grade temperature only; AEC-Q100-qualified variants are available in other Cyclone V family members.
